Abstract: In a circuit forming device, resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into cavity of the resin laminated body, and electronic component is placed on ultraviolet curable resin. Then, electronic component is cured and electronic component is fixed. In addition, since the ultraviolet curable resin is cured by only irradiating the ultraviolet curable resin with ultraviolet rays, it is possible to reduce the time required for fixing the component. In addition, by causing the ejection amount of the ultraviolet curable resin for fixing the component to correspond with at least one of the size and the weight of the electronic component, it is possible to properly mount the component at a planned mounting position by a self-alignment effect.

Abstract: A method of controlling a liquid ejecting apparatus includes detecting an ejection failure of nozzles by inspecting an ejection state of the nozzles from which liquid is ejected, covering the nozzles with a cap when the number of the nozzles whose ejection failure is detected is equal to or less than a predetermined number, and discharging the liquid from the nozzles when the number of the nozzles whose ejection failure is detected is greater than the predetermined number.

Abstract: A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

Abstract: To provide a data conversion device capable of generating data necessary for shaping a target object using an inkjet method from three-dimensional data in accordance with an impact diameter. Grid data generation section of data conversion device generates grid data obtained by defining layer data by each grid region indicating a position to which a droplet is ejected by the inkjet method. Ejection position change section changes the position (ejection region) to which the droplet is ejected on grid data, based on impact diameter when the droplet is ejected and length of grid regions.

Abstract: A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.

Abstract: When manufacturing three-dimensional electronic device by layering multiple layer cross sections sliced at a predetermined thickness of three-dimensional electronic device which is the target for forming, first, each layer cross section using multiple types of materials is formed by being layered on top of the layer cross section underneath, and each time a layer cross section is formed, the cross section is cured or sintered by being exposed to ultraviolet light, a laser beam, visible light, and so on. The forming method for each cross section may be forming cross section by discharging a binder via a droplet discharge method such as inkjet printing or dispensing, or by spreading a layer of powdered material and bonding the powdered material by discharging a binder or sintering it by exposing it to a laser beam.

Abstract: A circuit forming method where a metal ink is ejected to a planned formation position of a first wiring at an upper face of a base material. Then, the metal ink is baked, and first wiring is formed. Further, a planned connection section of the first wiring and a second wiring is unbaked. The metal-ink is ejected over an upper face of the unbaked metal ink and a planned formation position of the second wiring at the upper face of the base material. Since the wettability of the upper face of the unbaked metal ink and the wettability of the upper face of the base material are equal to each other, the ejected metal ink ejected and the unbaked metal ink are not separated from each other, so that it is possible to properly connect the first wiring and the second wiring to each other.

Abstract: To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.

Abstract: A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.

Abstract: A data conversion device capable of generating data necessary for manufacturing electrical device from three-dimensional data using an additive manufacturing, and an additive manufacturing system which performs layered shaping using post-conversion data are provided. A layer information generation section detects members which are included in three-dimensional data and generates layer information for each of the detected members with respect to the three-dimensional data of an electronic device. A layer data division section generates layer data in which the members which are included in the layer information are divided into layer thicknesses which can be shaped using an additive manufacturing. A unit determination section generates unit information which relates to units to be shaped based on the layer data. A control content determination section generates control data which is control information of the units which perform the shaping based on the unit information and the layer data.

Abstract: To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.

Abstract: A manufacturing apparatus that includes a conveyance device that moves a stage, where an electronic device shaped by multiple layers is placed, in X-axis and Y-axis directions. A first shaping unit, a second shaping unit, and a component mounting unit are arranged within a range in which the stage can move. The manufacturing apparatus performs additive manufacturing of the electronic device on the stage by performing a sequential movement of the stage to respective working positions of different units. As a result, in this manufacturing apparatus, a workpiece on the stage does not have to be removed and repositioned during each work process such as shaping by a first shaping unit, shaping by a second shaping unit, and electronic component mounting by a component mounting unit.

Abstract: A liquid ejecting apparatus includes a liquid path that connects a liquid storage portion for storing liquid and a liquid ejecting portion for ejecting liquid, a receiving tray that is provided on a gravity direction side of the liquid path and is capable of receiving the liquid, and a detector that has a detecting portion for detecting the liquid received on the receiving tray. In the liquid ejecting apparatus, the receiving tray includes a receiving region for receiving the liquid, a detection region in which the detecting portion is arranged so as to make contact with the liquid, and a groove portion formed in the receiving region, and a part of the groove portion makes contact with the detection region.

Abstract: A liquid ejection apparatus includes: a liquid ejection head having a nozzle which ejects a liquid containing volatile organic compounds to a medium; and a maintenance unit that has a cap, which forms a closed space including an opening of the nozzle, and a suction unit that suctions a fluid from the closed space, and that performs maintenance for discharging the liquid from the nozzle by reducing pressure of the closed space. The maintenance unit is provided with a filter for adsorbing volatile organic compounds contained in the liquid discharged from the liquid ejection head.

Abstract: A liquid ejection apparatus includes: a liquid ejection head having a nozzle which ejects a liquid containing volatile organic compounds to a medium; and a maintenance unit that has a cap, which forms a closed space including an opening of the nozzle, and a suction unit that suctions a fluid from the closed space, and that performs maintenance for discharging the liquid from the nozzle by reducing pressure of the closed space. The maintenance unit is provided with a filter for adsorbing volatile organic compounds contained in the liquid discharged from the liquid ejection head.

Abstract: A liquid ejecting apparatus includes a liquid path that connects a liquid storage portion for storing liquid and a liquid ejecting portion for ejecting liquid, a receiving tray that is provided on a gravity direction side of the liquid path and is capable of receiving the liquid, and a detector that has a detecting portion for detecting the liquid received on the receiving tray. In the liquid ejecting apparatus, the receiving tray includes a receiving region for receiving the liquid, a detection region in which the detecting portion is arranged so as to make contact with the liquid, and a groove portion formed in the receiving region, and a part of the groove portion makes contact with the detection region.

Abstract: An inkjet printing device including a head unit that includes an inkjet head, a fixed tank for storing ink to be supplied to the inkjet head, and a tank attachment section to which ink tank for storing ink to be replenished to the fixed tank is exchangeably attached. When ink tanks are exchanged, an ink tank attached to the tank attachment section of head unit is removed by an arm section of the tank exchange mechanism, and an ink tank to be used for exchange removed from tank storage unit is attached to the tank attachment section of the head unit.

Abstract: When manufacturing three-dimensional electronic device by layering multiple layer cross sections sliced at a predetermined thickness of three-dimensional electronic device which is the target for forming, first, each layer cross section using multiple types of materials is formed by being layered on top of the layer cross section underneath, and each time a layer cross section is formed, the cross section is cured or sintered by being exposed to ultraviolet light, a laser beam, visible light, and so on. The forming method for each cross section may be forming cross section by discharging a binder via a droplet discharge method such as inkjet printing or dispensing, or by spreading a layer of powdered material and bonding the powdered material by discharging a binder or sintering it by exposing it to a laser beam.

Abstract: For a semiconductor package mounted on a mounting member with wiring which connects an electrode on the upper surface of an LED device (semiconductor device) and an electrode at the mounting member side formed by a droplet discharge method or printing method, a stress relaxation film to reduce stresses applied to the wiring due to the difference in expansion/contraction between a land at the level difference sections and the wiring is formed at least at the level difference sections in the land which forms wiring, and the wiring is formed by a droplet discharge method or printing method on the stress relaxation film. The stress relaxation film may be formed of an insulating material for which the difference of the linear expansion coefficient from wiring is as small as possible and for which the Young's modulus is as large as possible.

Abstract: An inkjet printing device including a head unit that includes an inkjet head, a fixed tank for storing ink to be supplied to the inkjet head, and a tank attachment section to which ink tank for storing ink to be replenished to the fixed tank is exchangeably attached. When ink tanks are exchanged, an ink tank attached to the tank attachment section of head unit is removed by an arm section of the tank exchange mechanism, and an ink tank to be used for exchange removed from tank storage unit is attached to the tank attachment section of the head unit.