Abstract: In a manufacturing method of an optical-electrical substrate comprising a wiring substrate, an optical waveguide which is disposed on the wiring substrate and transmits an optical signal, and mirrors for reflecting the optical signal, insulating members having smooth inclined surfaces are formed on the wiring substrate and thereafter, a metal film is formed on the smooth inclined surfaces and the mirrors are formed.

Abstract: An optical waveguide includes: a first clad layer; a core layer formed on the first clad layer; a second clad layer formed on the core layer; and an optical transmission direction changing part. The optical transmission direction changing part is configured and arranged to change a transmission direction of a light transmitting through the core layer. The optical transmission direction changing part penetrates through the core layer. An optical transmission direction changing surface of the optical transmission direction changing part inclines relative to a predetermined reference plane by a predetermined angle.

Abstract: A manufacturing method of an optical waveguide, the optical waveguide including a first clad layer; a core layer formed on the first clad layer and configured to propagate light; a second clad layer formed on the first clad layer so as to cover the core layer; and a light propagation direction changing part configured to change a propagation direction of the light propagating in the core layer; the manufacturing method of the optical waveguide includes the steps of forming a concave part penetrating the first clad layer and the core layer; and inserting the light propagation direction changing part into the concave part so that a light propagation direction changing surface of the light propagation direction changing part forms a predetermined inclination angle to a predetermined reference plane.

Abstract: In an optical/electrical hybrid substrate 10 including a wiring board 11 having a wiring and a via, and an optical waveguide 12 including an optical waveguide body 80 having a first clad layer 81, a second clad layer 83 and a core portion 82 disposed between the first clad layer 81 and the second clad layer 83 and provided on the wiring board 11, and a pair of mirrors 88 and 89 for reflecting a light signal, a first wiring pattern 96 for electrically connecting a terminal 117 of a light emitting device 13 for irradiating the light signal to the wiring and via, and a second wiring pattern 97 for electrically connecting a terminal 119 of a light receiving device 14 for receiving the light signal to the wiring and via, the first and second wiring patterns 96 and 97 are disposed in the optical waveguide body 80.

Abstract: There is provided a method for fabricating a wiring board including: a mounting step of mounting a light transmitting member, the mounting step including: an arranging step of holding the light transmitting member by light transmitting holder to arrange the light transmitting member at a wiring board main body, and a step of curing a photo-curing resin material between the light transmitting member and the wiring board main body by light transmitted through the light transmitting member and the holder.

Abstract: An optical/electrical hybrid substrate is provided. The optical/electrical substrate includes: a wiring substrate; an optical waveguide disposed on the wiring substrate and configured to transmit an optical signal; a mirror support bonded onto the wiring substrate with an adhesive and being made of glass or silicon; and a mirror which reflects the optical signal and which is formed on an inclined surface of the mirror support.

Abstract: A coated paper for printing having a bulk density of 1.05 g/cm3 or less and two or more coating layers mainly composed of white pigments and adhesives formed on at least one side of a base paper which has a bulk density of 0.75 g/cm3 or less, wherein pigments of an undercoat in contact with an outermost coating layer comprises satin white of 1-30 mass % whose average particle diameter is within a range of 0.1-1.3 ?m measured pursuant to radiolucent particle size distribution measurement and other white pigments of 70-99 mass %, wherein an amount of the adhesives of the undercoat is within a range of 10-20 mass % based on 100 mass parts of pigment components.

Abstract: Openings are disposed in an insulating layer to expose a conductor layer. A lower cladding layer is formed, and a resist layer is formed on an insulating layer and the lower cladding layer. Electrolytic plating is performed with using the conductor layer which is connected to the external, as an electrode, to fill openings passing through the lower cladding layer and the resist layer with Cu. The resist layer is removed away to form projections configured by the filled Cu. The projections are processed to have an inclined face. Au layers are formed on the inclined faces of the projection. A core layer and an upper cladding layer are stacked.

Abstract: A lower cladding layer is formed on a surface of an electrical circuit substrate. A UV curable resin layer is stacked on the lower cladding layer. The resin layer is partly cured, and the other uncured resin layer is removed, thereby forming resin projections. The resin projections are processed so as to have an inclined face. Metal reflecting layers are formed on the inclined faces. A core layer is stacked on the lower cladding layer and the metal reflecting layers, and an upper cladding layer is stacked on the core layer.

Abstract: A base plate (31) and an ultraviolet curing type waveguide material (32) are interposed between a pair of films (41, 42), a portion between the pair of films is decompressed or an external pressure is applied to the films, thereby laminating the ultraviolet curing type waveguide material on the base plate, and at the same time, ultraviolet rays are irradiated on the ultraviolet curing type waveguide material through the films to cure the waveguide material.

Abstract: In an optical/electrical hybrid substrate 10 including a wiring board 11 having a wiring and a via, and an optical waveguide 12 including an optical waveguide body 80 having a first clad layer 81, a second clad layer 83 and a core portion 82 disposed between the first clad layer 81 and the second clad layer 83 and provided on the wiring board 11, and a pair of mirrors 88 and 89 for reflecting a light signal, a first wiring pattern 96 for electrically connecting a terminal 117 of a light emitting device 13 for irradiating the light signal to the wiring and via, and a second wiring pattern 97 for electrically connecting a terminal 119 of a light receiving device 14 for receiving the light signal to the wiring and via, the first and second wiring patterns 96 and 97 are disposed in the optical waveguide body 80.

Abstract: An optical waveguide includes an optical waveguide main body and mirrors. The optical waveguide main body includes a first cladding layer, a second cladding layer and a core portion provided between the first cladding layer and the second cladding layer. The optical waveguide main body has a first region in which the core portion and the mirrors are arranged and the light signal is transmitted, and a second region arranged on both sides of the first region and not contributing to a transmission of a light signal. Through vias that pass through the optical waveguide main body is provided in the second region. The first region on a side that faces the light emitting element or the light receiving element is protruded larger than the second region on a side that faces the light emitting element or the light receiving element.

Abstract: In a manufacturing method of an optical-electrical substrate comprising a wiring substrate, an optical waveguide which is disposed on the wiring substrate and transmits an optical signal, and mirrors for reflecting the optical signal, insulating members having smooth inclined surfaces are formed on the wiring substrate and thereafter, a metal film is formed on the smooth inclined surfaces and the mirrors are formed.

Abstract: There is provided a method for fabricating a wiring board including: a mounting step of mounting a light transmitting member, the mounting step including: an arranging step of holding the light transmitting member by light transmitting holder to arrange the light transmitting member at a wiring board main body, and a step of curing a photo-curing resin material between the light transmitting member and the wiring board main body by light transmitted through the light transmitting member and the holder.

Abstract: A manufacturing method of an optical waveguide is disclosed, the optical waveguide transmitting an optical signal between a luminous source and an optical receiver. The optical waveguide is structured by forming a lower clad layer, a core section, and an upper clad layer one by one on a substrate; by forming a first slot and a second slot each dividing the core section from the side of the upper clad layer that is not connected to the substrate; and by forming a metal film in the first and second slots such that a first mirror and a second mirror are formed.

Abstract: A coated paper comprised of a paper substrate, at least one surface of which is provided with at least one coating layer, characterized in that the surface of said coating layer has cracks of a width of 0.2 to 3.0 ?m and a length of 3 to 1000 ?m in an amount of 1 to 1000 cracks per mm2 is provided. In another embodiment, a coated paper comprised of a paper substrate, at least one surface of which is provided with at least two coating layers, characterized in that an inner coating layer adjoining said paper substrate comprises a pigment having a crystal structure selected from the group consisting of acicular crystal, spindle-shape crystal, columnar crystal, and rice-shape granulated crystal, and starches, and an outermost coating layer formed on said inner coating layer comprises crack formation promoting particles and a styrene-butadiene copolymer having a glass transition temperature of 20 to 150° C. is provided.

Abstract: A manufacturing method of an optical waveguide is disclosed, the optical waveguide transmitting an optical signal between a luminous source and an optical receiver. The optical waveguide is structured by forming a lower clad layer, a core section, and an upper clad layer one by one on a substrate; by forming a first slot and a second slot each dividing the core section from the side of the upper clad layer that is not connected to the substrate; and by forming a metal film in the first and second slots such that a first mirror and a second mirror are formed.