Patents by Inventor Kenneth A. Stanley

Kenneth A. Stanley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of controlling the spread of an adhesive on a circuitized organic substrate
    Patent number: 6046500
    Abstract: A method for preparing a circuitized organic substrate for the subsequent deposition of an adhesive thereon is provided. The method comprises exposing the circuitized substrate to a plasma formed from a gas mixture comprising a fluorine-containing entity. Preferably, the gas mixture used to form the plasma also comprises oxygen. It has been determined that treatment of the circuitized substrate with a plasma formed from a gas mixture comprising at least 20% by volume of the fluorine-containing entity and, preferably, up to about 80% by volume of oxygen reduces the spread of an adhesive deposited on the surface of the organic substrate. It has also been determined that such treatment does not adversely affect the subsequent bonding of wires to the wire bond sites that are present on the surface of the substrate.
    Type: Grant
    Filed: August 21, 1997
    Date of Patent: April 4, 2000
    Assignee: International Business Machines Corporation
    Inventors: Edmond Otto Fey, Kenneth Stanley Lyjak, Donna Jean Trevitt
  • Method of controlling the spread of an adhesive on a circuitized organic substrate
    Patent number: 5910341
    Abstract: A method for preparing a circuitized organic substrate for the subsequent deposition of an adhesive thereon is provided. The method comprises exposing the circuitized substrate to a plasma formed from a gas mixture comprising a fluorine-containing entity. Preferably, the gas mixture used to form the plasma also comprises oxygen. It has been determined that treatment of the circuitized substrate with a plasma formed from a gas mixture comprising at least 20% by volume of the fluorine-containing entity and, preferably, up to about 80% by volume of oxygen reduces the spread of an adhesive deposited on the surface of the organic substrate. It has also been determined that such treatment does not adversely affect the subsequent bonding of wires to the wire bond sites that are present on the surface of the substrate.
    Type: Grant
    Filed: October 31, 1996
    Date of Patent: June 8, 1999
    Assignee: International Business Machines Corporation
    Inventors: Edmond Otto Fey, Kenneth Stanley Lyjak, Donna Jean Trevitt
  • Method of making simulated solid wood slabs and resulting solid wood slab
    Patent number: 5469903
    Abstract: A method of simulating a solid wood multipanel door is disclosed. Predetermined portions of the thin sheets of wood which are typically used to construct hollow core doors are cut away. The portions are used to construct artificial door panels, which are replaced into the openings in the hollow core door from which they were cut. Molding is then placed around the artificial door panels. In an alternative embodiment, Wainscott panels may be constructed utilizing the inventive technique.
    Type: Grant
    Filed: October 7, 1994
    Date of Patent: November 28, 1995
    Inventor: Kenneth Stanley