Patents by Inventor Kenneth B. Greiner

Kenneth B. Greiner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9317632
    Abstract: A virtual fabrication environment for semiconductor device structure development is discussed that enables the use of a selective epitaxy process to virtually model epitaxial growth of a crystalline material layer. The epitaxial growth occurs on a crystalline substrate surface of a virtually fabricated model device structure. A surface growth rate may be defined over possible 3D surface orientations of the virtually fabricated device structure by modeling the growth rates of the three major families of crystal planes. Growth rates along neighboring non-crystalline material may also be modeled.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: April 19, 2016
    Assignee: Coventor, Inc.
    Inventors: Daniel Faken, Kenneth B. Greiner, David M. Fried, Stephen R. Breit
  • Publication number: 20150213176
    Abstract: A mechanism for identifying and modeling pattern dependent effects of processes in a 3-D Virtual Semiconductor Fabrication Environment is discussed.
    Type: Application
    Filed: January 26, 2015
    Publication date: July 30, 2015
    Inventors: Kenneth B. GREINER, David M. FRIED, Mattan KAMON, Daniel FAKEN
  • Patent number: 8959464
    Abstract: A virtual fabrication environment for semiconductor device structure development is discussed. The insertion of a multi-etch process step using material-specific behavioral parameters into a process sequence enables a multi-physics, multi-material etching process to be simulated using a suitable numerical technique. The multi-etch process step accurately and realistically captures a wide range of etch behavior and geometry to provide in a virtual fabrication system a semi-physical approach to modeling multi-material etches based on a small set of input parameters that characterize the etch behavior.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: February 17, 2015
    Assignee: Coventor, Inc.
    Inventors: Kenneth B. Greiner, Daniel Faken, David M. Fried, Stephen R. Breit
  • Publication number: 20140282302
    Abstract: A virtual fabrication environment for semiconductor device structure development is discussed. The insertion of a multi-etch process step using material-specific behavioral parameters into a process sequence enables a multi-physics, multi-material etching process to be simulated using a suitable numerical technique. The multi-etch process step accurately and realistically captures a wide range of etch behavior and geometry to provide in a virtual fabrication system a semi-physical approach to modeling multi-material etches based on a small set of input parameters that characterize the etch behavior.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Inventors: Kenneth B. GREINER, Daniel FAKEN, David M. FRIED, Stephen R. BREIT
  • Publication number: 20140278266
    Abstract: A virtual fabrication environment for semiconductor device structure development is discussed that enables the use of a selective epitaxy process to virtually model epitaxial growth of a crystalline material layer. The epitaxial growth occurs on a crystalline substrate surface of a virtually fabricated model device structure. A surface growth rate may be defined over possible 3D surface orientations of the virtually fabricated device structure by modeling the growth rates of the three major families of crystal planes. Growth rates along neighboring non-crystalline material may also be modeled.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Inventors: Daniel FAKEN, Kenneth B. GREINER, David M. FRIED, Stephen R. BREIT
  • Publication number: 20140282328
    Abstract: A virtual fabrication environment that enables 3D Design Rule Checks (DRCs) or Optical Rule Checks (ORCs) on 3D structural models of semiconductor devices to be performed is discussed. The virtual fabrication environment may perform 3D design rule checks, such as minimum line width, minimum space between features, and minimum contact area between adjacent materials, directly in 3D without making assumptions about the translation from 2D design data to a 3D structure effected by an integrated process flow for semiconductor devices. The required number of 3D design rule checks may therefore be significantly reduced from the number of design rule checks required in 2D environments. Embodiments may also perform the 3D design rule checks for a range of statistical variations in process and design parameters.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Inventors: David M. FRIED, Kenneth B. GREINER, Mark J. STOCK, Stephen R. BREIT
  • Publication number: 20140282324
    Abstract: A virtual fabrication environment for semiconductor device structures that includes the use of virtual metrology measurement data to optimize a virtual fabrication sequence is described. Further, calibration of the virtual fabrication environment is performed by comparing virtual metrology data generated from a virtual fabrication run with a subset of measurements performed in a physical fabrication environment. Additionally, virtual experiments conducted in the virtual fabrication environment of the present invention generate multiple device structure models using ranges of process and design parameter variations for an integrated process flow and design space of interest.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: COVENTOR, INC.
    Inventors: Kenneth B. GREINER, Stephen R. BREIT, David M. FRIED, Daniel FAKEN
  • Patent number: 8832620
    Abstract: A virtual fabrication environment that enables 3D Design Rule Checks (DRCs) or Optical Rule Checks (ORCs) on 3D structural models of semiconductor devices to be performed is discussed. The virtual fabrication environment may perform 3D design rule checks, such as minimum line width, minimum space between features, and minimum contact area between adjacent materials, directly in 3D without making assumptions about the translation from 2D design data to a 3D structure effected by an integrated process flow for semiconductor devices. The required number of 3D design rule checks may therefore be significantly reduced from the number of design rule checks required in 2D environments. Embodiments may also perform the 3D design rule checks for a range of statistical variations in process and design parameters.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: September 9, 2014
    Assignee: Coventor, Inc.
    Inventors: David M. Fried, Kenneth B. Greiner, Mark J. Stock, Stephen R. Breit