Patents by Inventor Kenneth Costello
Kenneth Costello has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20060113655Abstract: There is described-novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.Type: ApplicationFiled: January 3, 2006Publication date: June 1, 2006Inventors: Kenneth Costello, Kevin Roderick
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Patent number: 7042060Abstract: Backthinning in an area selective manner is applied to imaging sensors 12 for use in electron bombarded devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.Type: GrantFiled: July 15, 2004Date of Patent: May 9, 2006Assignee: Intevac, Inc.Inventors: Kenneth A Costello, Kevin P. Fairbairn, David W. Brown, Yun Chung, Patricia Gober, Edward Yin
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Patent number: 7012328Abstract: There is described novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.Type: GrantFiled: May 14, 2004Date of Patent: March 14, 2006Assignee: Intevac, Inc.Inventors: Kenneth A Costello, Kevin James Roderick
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Patent number: 7005637Abstract: Backthinning in an area selective manner is applied to imaging sensors 12 for use in electron bombarded devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.Type: GrantFiled: March 5, 2004Date of Patent: February 28, 2006Assignee: Intevac, Inc.Inventors: Kenneth A Costello, Kevin P. Fairbairn, David W. Brown, Yun Chung, Patricia Gober, Edward Yin
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Patent number: 6969839Abstract: This invention deals with the reduction in fixed pattern noise in backthinned CMOS imagers primarily for use in a vacuum environment. Reduction is achieved by effectively shielding the imager. This is done by depositing a conductive layer on the front surface prior to the attachment of a support member or by incorporating a conductive layer into the die at least extensive with the analog circuitry. This also may be achieved by leaving a void adjacent to the analog circuitry area. This void, filled with air or a vacuum specifies a low dielectric layer over critical analog circuitry. Finally there is extended across the die an adhesive or underfill material after which a support member is placed onto the underfill to provide structure to the die. The underfill and the support layer should have thermal coefficients of expansion that substantially match that of the silicon.Type: GrantFiled: January 31, 2003Date of Patent: November 29, 2005Assignee: Intevac, Inc.Inventor: Kenneth A Costello
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Publication number: 20050258212Abstract: There is described novel bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.Type: ApplicationFiled: July 28, 2005Publication date: November 24, 2005Inventor: Kenneth Costello
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Publication number: 20050253242Abstract: There is described novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.Type: ApplicationFiled: May 14, 2004Publication date: November 17, 2005Inventors: Kenneth Costello, Kevin Roderick
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Patent number: 6943425Abstract: There is described a back thinned sensor in which a material is added on the front surface to extend the wavelength of the sensor into wavelengths it normally does not reach. In the preferred embodiment, the back-thinned layer comprises silicon and is the base for a CMOS device or a CCD. The photocathode in a night vision device comprises in the preferred unit GaAs.Type: GrantFiled: January 23, 2004Date of Patent: September 13, 2005Assignee: Intevac, Inc.Inventor: Kenneth A Costello
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Publication number: 20050161703Abstract: There is described a back thinned sensor in which a material is added on the front surface to extend the wavelength of the sensor into wavelengths it normally does not reach. In the preferred embodiment, the back-thinned layer comprises silicon and is the base for a CMOS device or a CCD. The photocathode in a night vision device comprises in the preferred unit GaAs.Type: ApplicationFiled: January 23, 2004Publication date: July 28, 2005Inventor: Kenneth Costello
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Patent number: 6837766Abstract: A housing for microelectronic devices requiring an internal vacuum for operation, e.g., an image detector, is formed by tape casting and incorporates leads between interior and exterior of the housing where the leads are disposed on a facing surface of green tape layers. Adjacent green tape layers having corresponding apertures therein are stacked on a first closure member to form a resulting cavity and increased electrical isolation or channel sub-structures are achievable by forming adjacent layers with aperture dimension which vary non-monotonically. After assembly of the device within the cavity, a second closure member is sealed against an open face of the package in a vacuum environment to produce a vacuum sealed device.Type: GrantFiled: January 10, 2003Date of Patent: January 4, 2005Assignee: Intevac, Inc.Inventor: Kenneth A. Costello
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Publication number: 20040245593Abstract: Backthinning in an area selective manner is applied to imaging sensors 12 for use in electron bombarded devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.Type: ApplicationFiled: July 15, 2004Publication date: December 9, 2004Inventors: Kenneth A. Costello, Kevin P. Fairbairn, David W. Brown, Yun Chung, Patricia Gober, Edward Yin
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Publication number: 20040232834Abstract: A housing for microelectronic devices requiring an internal vacuum for operation, e.g., an image detector, is formed by tape casting and incorporates leads between interior and exterior of said housing where said leads are disposed on a facing surface of green tape layers. Adjacent green tape layers having corresponding apertures therein are stacked on a first closure member to form a resulting cavity and increased electrical isolation or channel sub-structures are achievable by forming adjacent layers with aperture dimension which vary non-monotonically. After assembly of the device within the cavity, a second closure member is sealed against an open face of the package in a vacuum environment to produce a vacuum sealed device.Type: ApplicationFiled: June 29, 2004Publication date: November 25, 2004Inventor: Kenneth A. Costello
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Publication number: 20040180462Abstract: Backthinning in an area selective manner is applied to imaging sensors 12 for use in electron bombarded devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.Type: ApplicationFiled: March 5, 2004Publication date: September 16, 2004Applicant: INTEVAC, INC.Inventors: Kenneth A. Costello, Kevin P. Fairbairn, David W. Brown, Yun Chung, Patricia Gober, Edward Yin
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Publication number: 20040169248Abstract: Backthinning in an area selective manner is applied to imaging sensors 12 for use in electron bombarded devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.Type: ApplicationFiled: March 5, 2004Publication date: September 2, 2004Applicant: INTEVAC, INC.Inventors: Kenneth A. Costello, Kevin P. Fairbairn, David W. Brown, Yun Chung, Patricia Gober, Edward Yin
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Publication number: 20040149888Abstract: This invention deals with the reduction in fixed pattern noise in backthinned CMOS imagers primarily for use in a vacuum environment. Reduction is achieved by effectively shielding the imager. This is done by depositing a conductive layer on the front surface prior to the attachment of a support member or by incorporating a conductive layer into the die at least extensive with the analog circuitry. This also may be achieved by leaving a void adjacent to the analog circuitry area. This void, filled with air or a vacuum specifies a low dielectric layer over critical analog circuitry. Finally there is extended across the die an adhesive or underfill material after which a support member is placed onto the underfill to provide structure to the die. The underfill and the support layer should have thermal coefficients of expansion that substantially match that of the silicon.Type: ApplicationFiled: January 31, 2003Publication date: August 5, 2004Applicant: INTEVAC, INC.Inventor: Kenneth A. Costello
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Publication number: 20030137243Abstract: A housing for microelectronic devices requiring an internal vacuum for operation, e.g., an image detector, is formed by tape casting and incorporates leads between interior and exterior of said housing where said leads are disposed on a facing surface of green tape layers. Adjacent green tape layers having corresponding apertures therein are stacked on a first closure member to form a resulting cavity and increased electrical isolation or channel sub-structures are achievable by forming adjacent layers with aperture dimension which vary non-monotonically. After assembly of the device within the cavity, a second closure member is sealed against an open face of the package in a vacuum environment to produce a vacuum sealed device.Type: ApplicationFiled: January 10, 2003Publication date: July 24, 2003Inventor: Kenneth A. Costello
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Patent number: 6507147Abstract: A housing for microelectronic devices requiring an internal vacuum for operation, e.g., an image detector, is formed by tape casting and incorporates leads between interior and exterior of said housing where said leads are disposed on a facing surface of green tape layers. Adjacent green tape layers having corresponding apertures therein are stacked on a first closure member to form a resulting cavity and increased electrical isolation or channel sub-structures are achievable by forming adjacent layers with aperture dimension which vary non-monotonically. After assembly of the device within the cavity, a second closure member is sealed against an open face of the package in a vacuum environment to produce a vacuum sealed device.Type: GrantFiled: August 31, 2000Date of Patent: January 14, 2003Assignee: Intevac, Inc.Inventor: Kenneth A. Costello
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Patent number: 6307586Abstract: A camera includes a photocathode operable in a night mode wherein electrons are generated in response to incident light, an active pixel sensor including an array of pixels for sensing electrons in the night mode, a power supply for energizing the photocathode in the night mode in response to a control signal, and a power supply control circuit for providing the control signal to the power supply in response to a sensed incident light level. The control signal may be a gating signal having a duty cycle that increases as the sensed incident light level decreases. The camera may be operable in a day mode wherein a fraction of the incident light is transmitted through the photocathode and is sensed by the active pixel sensor. The camera may further include an electron shielded light detector. A light detector signal generated by the electron shielded light detector may be used to control switching between the day mode and the night mode.Type: GrantFiled: July 20, 1999Date of Patent: October 23, 2001Assignee: Intevac, Inc.Inventor: Kenneth A. Costello
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Patent number: 5932966Abstract: An electron source includes a negative electron affinity photocathode on a light-transmissive substrate and a light beam generator for directing a light beam through the substrate at the photocathode for exciting electrons into the conduction band. The photocathode has at least one active area for emission of electrons with dimensions of less than about two micrometers. The electron source further includes electron optics for forming the electrons into an electron beam and a vacuum enclosure for maintaining the photocathode at high vacuum. The photocathode is patterned to define emission areas. A patterned mask may be located on the emission surface of the active layer, may be buried within the active layer or may be located between the active layer and the substrate.Type: GrantFiled: December 9, 1997Date of Patent: August 3, 1999Assignees: Intevac, Inc., Board of Trustees of the Leland Stanford Jr. UniversityInventors: James E. Schneider, Kenneth A. Costello, Mark A. McCord, R. Fabian Pease, Aaron W. Baum
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Patent number: 5912500Abstract: A transferred-electron photocathode or other opto-electronic device having one light-receiving side and one electronic side, in which multiple photocathodes are processed concurrently on a wafer for front and back side contacts and anti-reflection layers. After the wafer-level processing, the individual cells are diced, and each is placed in a rectangular recess formed in a window body with the light-receptive part of the photocathode facing the window. The integration is aided by several novel processes including coining a chip recess into a window, selective etching of titanium over chromium, and using a single metal sheet member for electrically contacting the photocathode, forming part of the vacuum envelope, and providing an exterior electrical tab.Type: GrantFiled: November 22, 1995Date of Patent: June 15, 1999Assignee: Intevac, Inc.Inventors: Kenneth A. Costello, Verle W. Aebi, Robert E. Weiss