Patents by Inventor Kenneth D. Schatz
Kenneth D. Schatz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200402772Abstract: Systems and methods may be used to produce coated components. Exemplary semiconductor chamber components may include an aluminum alloy comprising nickel and may be characterized by a surface. The surface may include a corrosion resistant coating. The corrosion resistant coating may include a conformal layer and a non-metal layer. The conformal layer may extend about the semiconductor chamber component. The non-metal oxide layer may extend over a surface of the conformal layer. The non-metal oxide layer may be characterized by an amorphous microstructure having a hardness of from about 300 HV to about 10,000 HV. The non-metal oxide layer may also be characterized by an sp2 to sp3 hybridization ratio of from about 0.01 to about 0.5 and a hydrogen content of from about 1 wt. % to about 35 wt. %.Type: ApplicationFiled: June 3, 2020Publication date: December 24, 2020Applicant: Applied Materials, Inc.Inventors: Laksheswar Kalita, Son Nguyen, Dmitry Lubomirsky, Kenneth D. Schatz
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Publication number: 20200328065Abstract: An apparatus for distributing plasma products includes first and second electrodes that each include planar surfaces. The first electrode forms first apertures from a first planar surface to a second planar surface; the second electrode forms second apertures from the third planar surface to the fourth planar surface. The electrodes couple through one or more adjustable couplers such that the third planar surface is disposed adjacent to the second planar surface with a gap therebetween, the gap having a gap distance. Each of the adjustable couplers has a range of adjustment. The first and second apertures are arranged such that for at least one position within the ranges of adjustment, none of the first apertures aligns with any of the second apertures to form an open straight-line path extending through both the first and second electrodes.Type: ApplicationFiled: June 29, 2020Publication date: October 15, 2020Applicant: Applied Materials, Inc.Inventors: Tien Fak Tan, Saravjeet Singh, Dmitry Lubomirsky, Tae Wan Kim, Kenneth D. Schatz, Tae Seung Cho, Lok Kee Loh
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Patent number: 10699879Abstract: An apparatus for distributing plasma products includes first and second electrodes that each include planar surfaces. The first electrode forms first apertures from a first planar surface to a second planar surface; the second electrode forms second apertures from the third planar surface to the fourth planar surface. The electrodes couple through one or more adjustable couplers such that the third planar surface is disposed adjacent to the second planar surface with a gap therebetween, the gap having a gap distance. Each of the adjustable couplers has a range of adjustment. The first and second apertures are arranged such that for at least one position within the ranges of adjustment, none of the first apertures aligns with any of the second apertures to form an open straight-line path extending through both the first and second electrodes, and the gap distance is between 0.005 inch and 0.050 inch.Type: GrantFiled: April 17, 2018Date of Patent: June 30, 2020Assignee: Applied Materials, Inc.Inventors: Tien Fak Tan, Saravjeet Singh, Dmitry Lubomirsky, Tae Wan Kim, Kenneth D. Schatz, Tae Seung Cho, Lok Kee Loh
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Patent number: 10593560Abstract: Exemplary magnetic induction plasma systems for generating plasma products are provided. The magnetic induction plasma system may include a first plasma source including a plurality of first sections and a plurality of second sections arranged in an alternating manner and fluidly coupled with each other such that at least a portion of plasma products generated inside the first plasma source may circulate through at least one of the plurality of first sections and at least one of the plurality of second sections inside the first plasma source. Each of the plurality of second sections may include a dielectric material. The system may further include a plurality of first magnetic elements each of which may define a closed loop. Each of the plurality of second sections may define a plurality of recesses for receiving one of the plurality of first magnetic elements therein.Type: GrantFiled: March 1, 2018Date of Patent: March 17, 2020Assignee: Applied Materials, Inc.Inventors: Tae Seung Cho, Soonwook Jung, Junghoon Kim, Satoru Kobayashi, Kenneth D. Schatz, Soonam Park, Dmitry Lubomirsky
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Publication number: 20190318911Abstract: An apparatus for distributing plasma products includes first and second electrodes that each include planar surfaces. The first electrode forms first apertures from a first planar surface to a second planar surface; the second electrode forms second apertures from the third planar surface to the fourth planar surface. The electrodes couple through one or more adjustable couplers such that the third planar surface is disposed adjacent to the second planar surface with a gap therebetween, the gap having a gap distance. Each of the adjustable couplers has a range of adjustment. The first and second apertures are arranged such that for at least one position within the ranges of adjustment, none of the first apertures aligns with any of the second apertures to form an open straight-line path extending through both the first and second electrodes, and the gap distance is between 0.005 inch and 0.050 inch.Type: ApplicationFiled: April 17, 2018Publication date: October 17, 2019Applicant: Applied Materials, Inc.Inventors: Tien Fak Tan, Saravjeet Singh, Dmitry Lubomirsky, Tae Wan Kim, Kenneth D. Schatz, Tae Seung Cho, Lok Kee Loh
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Publication number: 20190272999Abstract: Exemplary magnetic induction plasma systems for generating plasma products are provided. The magnetic induction plasma system may include a first plasma source including a plurality of first sections and a plurality of second sections arranged in an alternating manner and fluidly coupled with each other such that at least a portion of plasma products generated inside the first plasma source may circulate through at least one of the plurality of first sections and at least one of the plurality of second sections inside the first plasma source. Each of the plurality of second sections may include a dielectric material. The system may further include a plurality of first magnetic elements each of which may define a closed loop. Each of the plurality of second sections may define a plurality of recesses for receiving one of the plurality of first magnetic elements therein.Type: ApplicationFiled: March 1, 2018Publication date: September 5, 2019Applicant: Applied Materials, Inc.Inventors: Tae Seung Cho, Soonwook Jung, Junghoon Kim, Satoru Kobayashi, Kenneth D. Schatz, Soonam Park, Dmitry Lubomirsky
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Publication number: 20190189401Abstract: The present technology includes improved gas distribution designs for forming uniform plasmas during semiconductor processing operations or for treating the interior of semiconductor processing chambers. While conventional gas distribution assemblies may receive a specific reactant or reactant ratio which is then distributed into the plasma region, the presently described technology allows for improved control of the reactant input distribution. The technology allows for separate flows of reactants to different regions of the plasma to offset any irregularities observed in process uniformity. A first precursor may be delivered to the center of the plasma above the center of the substrate/pedestal while a second precursor may be delivered to an outer portion of the plasma above an outer portion of the substrate/pedestal. In so doing, a substrate residing on the pedestal may experience a more uniform etch or deposition profile across the entire surface.Type: ApplicationFiled: December 19, 2017Publication date: June 20, 2019Applicant: Applied Materials, Inc.Inventors: Saravjeet Singh, Kenneth D. Schatz, Alan Tso, Marlin Wijekoon, Dimitri Kioussis
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Patent number: 9922840Abstract: Methods of selectively etching an exposed portion of a patterned substrate relative to a second exposed portion are described. The etching process is a gas phase etch which uses an oxidizing precursor unexcited in any plasma prior to combination with plasma effluents formed in a remote plasma from an inert precursor. The plasma effluents may be combined with the oxidizing precursor in a plasma-free remote chamber region and/or in a plasma-free substrate processing region. The combination of the plasma effluents excites the oxidizing precursor and removes material from the exposed portion of the patterned substrate. The etch rate is controllable and selectable by adjusting the flow rate of the oxidizing precursor or the unexcited/plasma-excited flow rate ratio.Type: GrantFiled: July 7, 2015Date of Patent: March 20, 2018Assignee: Applied Materials, Inc.Inventors: Soonam Park, Kenneth D. Schatz, Soonwook Jung, Dmitry Lubomirsky
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Publication number: 20170011931Abstract: Methods of selectively etching an exposed portion of a patterned substrate relative to a second exposed portion are described. The etching process is a gas phase etch which uses an oxidizing precursor unexcited in any plasma prior to combination with plasma effluents formed in a remote plasma from an inert precursor. The plasma effluents may be combined with the oxidizing precursor in a plasma-free remote chamber region and/or in a plasma-free substrate processing region. The combination of the plasma effluents excites the oxidizing precursor and removes material from the exposed portion of the patterned substrate. The etch rate is controllable and selectable by adjusting the flow rate of the oxidizing precursor or the unexcited/plasma-excited flow rate ratio.Type: ApplicationFiled: July 7, 2015Publication date: January 12, 2017Applicant: APPLIED MATERIALS, INC.Inventors: Soonam Park, Kenneth D. Schatz, Soonwook Jung, Dmitry Lubomirsky
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Patent number: 9418328Abstract: A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.Type: GrantFiled: December 3, 2014Date of Patent: August 16, 2016Assignee: Ruizhang Technology Limited CompanyInventors: Glenn W. Gengel, Mark A. Hadley, Tom Pounds, Kenneth D. Schatz, Paul S. Drzaic
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Publication number: 20150242739Abstract: A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.Type: ApplicationFiled: December 3, 2014Publication date: August 27, 2015Inventors: Glenn W. Gengel, Mark A. Hadley, Tom Pounds, Kenneth D. Schatz, Paul S. Drzaic
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Patent number: 8912907Abstract: A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.Type: GrantFiled: December 28, 2012Date of Patent: December 16, 2014Assignee: Alien Technology, LLCInventors: Glenn W. Gengel, Mark A. Hadley, Tom Pounds, Kenneth D. Schatz, Paul S. Drzaic
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Publication number: 20130265134Abstract: A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.Type: ApplicationFiled: December 28, 2012Publication date: October 10, 2013Inventors: Glenn W. Gengel, Mark A. Hadley, Tom Pounds, Kenneth D. Schatz, Paul S. Drzaic
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Patent number: 8350703Abstract: A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.Type: GrantFiled: January 10, 2011Date of Patent: January 8, 2013Assignee: Alien Technology CorporationInventors: Glenn W. Gengel, Mark A. Hadley, Torn Pounds, Kenneth D. Schatz, Paul S. Drzaic
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Publication number: 20110186640Abstract: A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.Type: ApplicationFiled: January 10, 2011Publication date: August 4, 2011Inventors: Glenn W. Gengel, Mark A. Hadley, Tom Pounds, Kenneth D. Schatz, Paul S. Drazaic
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Patent number: 7931063Abstract: A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.Type: GrantFiled: June 19, 2007Date of Patent: April 26, 2011Assignee: Alien Technology CorporationInventors: Gordon S. W. Craig, Kenneth D. Schatz, Mark A. Hadley, Paul S. Drzaic
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Patent number: 7868766Abstract: A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.Type: GrantFiled: February 5, 2009Date of Patent: January 11, 2011Assignee: Alien Technology CorporationInventors: Glenn W. Gengel, Mark A. Hadley, Tom Pounds, Kenneth D. Schatz, Paul S. Drzaic
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Publication number: 20090167534Abstract: A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.Type: ApplicationFiled: February 5, 2009Publication date: July 2, 2009Inventors: Glenn W. Gengel, Mark A. Hadley, Tom Pounds, Kenneth D. Schatz, Paul S. Drzaic
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Patent number: 7542301Abstract: An embossing die, the die comprises one or more protruding features configured to create one or more corresponding recessed regions in a substrate; and a left side edge and a right side edge. Either the left side edge or the right side edge is a gradually sloping edge. The embossing die can be used to form an assembly. The assembly comprises a substrate including a more than one defined frames. Each of the defined frames comprises a plurality of recessed regions and a plurality of functional blocks, each functional block being deposited in one of the recessed regions. Each of the defined frames is separated from another frame by a region. The region can be a flattened region, a sloped region, or a plateau shaped region having a plateau top and two sloped sides, wherein each sloped side forms about 10-15 degree angle to a surface of the substrate.Type: GrantFiled: June 22, 2005Date of Patent: June 2, 2009Assignee: Alien Technology CorporationInventors: Lily Liong, Kenneth D. Schatz, Gordon Craig, Mark A. Hadley, Eric Kanemoto
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Patent number: 7489248Abstract: A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.Type: GrantFiled: July 31, 2006Date of Patent: February 10, 2009Assignee: Alien Technology CorporationInventors: Glenn W. Gengel, Mark A. Hadley, Tom Pounds, Kenneth D. Schatz, Paul S. Drzaic