Patents by Inventor Kenneth Duong
Kenneth Duong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10970627Abstract: Some embodiments provide a three-dimensional (3D) circuit structure that has two or more vertically stacked bonded layers with a machine-trained network on at least one bonded layer. As described above, each bonded layer can be an IC die or an IC wafer in some embodiments with different embodiments encompassing different combinations of wafers and dies for the different bonded layers. The machine-trained network in some embodiments includes several stages of machine-trained processing nodes with routing fabric that supplies the outputs of earlier stage nodes to drive the inputs of later stage nodes. In some embodiments, the machine-trained network is a neural network and the processing nodes are neurons of the neural network. In some embodiments, one or more parameters associated with each processing node (e.g., each neuron) is defined through machine-trained processes that define the values of these parameters in order to allow the machine-trained network (e.g.Type: GrantFiled: June 2, 2020Date of Patent: April 6, 2021Assignee: Xcelsis CorporationInventors: Steven L. Teig, Kenneth Duong, Javier DeLaCruz
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Publication number: 20200356714Abstract: An integrated circuit and a method for designing an IC where the smallest repeatable block is selected, designed and tested to span across multiple die levels. The block is configured to be timing closed at the block level thereby reducing the overall complexity of the design and avoiding the limiting effects of the constrained EDA tools. The block may subsequently be repeated on multiple die to be stacked in an IC.Type: ApplicationFiled: May 22, 2020Publication date: November 12, 2020Applicant: Xcelsis CorporationInventors: Javier A. DELACRUZ, Eric NEQUIST, Jung KO, Kenneth DUONG
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Publication number: 20200342046Abstract: Some embodiments provide an IC for implementing a machine-trained network with multiple layers. The IC includes a set of circuits to compute a dot product of (i) a first number of input values computed by other circuits of the IC and (ii) a set of predefined weight values, several of which are zero, with a weight value for each of the input values. The set of circuits includes (i) a dot product computation circuit to compute the dot product based on a second number of inputs and (ii) for each input value, at least two sets of wires for providing the input value to at least two of the dot product computation circuit inputs. The second number is less than the first number. Each input value with a corresponding weight value that is not equal to zero is provided to a different one of the dot product computation circuit inputs.Type: ApplicationFiled: July 9, 2020Publication date: October 29, 2020Inventors: Kenneth Duong, Jung Ko, Steven L. Teig
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Publication number: 20200293872Abstract: Some embodiments provide a three-dimensional (3D) circuit structure that has two or more vertically stacked bonded layers with a machine-trained network on at least one bonded layer. As described above, each bonded layer can be an IC die or an IC wafer in some embodiments with different embodiments encompassing different combinations of wafers and dies for the different bonded layers. The machine-trained network in some embodiments includes several stages of machine-trained processing nodes with routing fabric that supplies the outputs of earlier stage nodes to drive the inputs of later stage nodes. In some embodiments, the machine-trained network is a neural network and the processing nodes are neurons of the neural network. In some embodiments, one or more parameters associated with each processing node (e.g., each neuron) is defined through machine-trained processes that define the values of these parameters in order to allow the machine-trained network (e.g.Type: ApplicationFiled: June 2, 2020Publication date: September 17, 2020Inventors: Steven L. Teig, Kenneth Duong, Javier DeLaCruz
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Patent number: 10762420Abstract: Some embodiments of the invention provide an integrated circuit (IC) with a defect-tolerant neural network. The neural network has one or more redundant neurons in some embodiments. After the IC is manufactured, a defective neuron in the neural network can be detected through a test procedure and then replaced by a redundant neuron (i.e., the redundant neuron can be assigned the operation of the defective neuron). The routing fabric of the neural network can be reconfigured so that it re-routes signals around the discarded, defective neuron. In some embodiments, the reconfigured routing fabric does not provide any signal to or forward any signal from the discarded, defective neuron, and instead provides signals to and forwards signals from the redundant neuron that takes the defective neuron's position in the neural network. In some embodiments that implement a neural network by re-purposing (i.e.Type: GrantFiled: December 31, 2017Date of Patent: September 1, 2020Assignee: XCELSIS CORPORATIONInventors: Steven L. Teig, Kenneth Duong
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Patent number: 10740434Abstract: Some embodiments provide an IC for implementing a machine-trained network with multiple layers. The IC includes a set of circuits to compute a dot product of (i) a first number of input values computed by other circuits of the IC and (ii) a set of predefined weight values, several of which are zero, with a weight value for each of the input values. The set of circuits includes (i) a dot product computation circuit to compute the dot product based on a second number of inputs and (ii) for each input value, at least two sets of wires for providing the input value to at least two of the dot product computation circuit inputs. The second number is less than the first number. Each input value with a corresponding weight value that is not equal to zero is provided to a different one of the dot product computation circuit inputs.Type: GrantFiled: September 3, 2018Date of Patent: August 11, 2020Assignee: PERCEIVE CORPORATIONInventors: Kenneth Duong, Jung Ko, Steven L. Teig
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Patent number: 10719762Abstract: Some embodiments provide a three-dimensional (3D) circuit structure that has two or more vertically stacked bonded layers with a machine-trained network on at least one bonded layer. As described above, each bonded layer can be an IC die or an IC wafer in some embodiments with different embodiments encompassing different combinations of wafers and dies for the different bonded layers. The machine-trained network in some embodiments includes several stages of machine-trained processing nodes with routing fabric that supplies the outputs of earlier stage nodes to drive the inputs of later stage nodes. In some embodiments, the machine-trained network is a neural network and the processing nodes are neurons of the neural network. In some embodiments, one or more parameters associated with each processing node (e.g., each neuron) is defined through machine-trained processes that define the values of these parameters in order to allow the machine-trained network (e.g.Type: GrantFiled: December 31, 2017Date of Patent: July 21, 2020Assignee: XCELSIS CORPORATIONInventors: Steven L. Teig, Kenneth Duong, Javier DeLaCruz
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Publication number: 20200227389Abstract: Some embodiments of the invention provide a three-dimensional (3D) circuit that is formed by vertically stacking two or more integrated circuit (IC) dies to at least partially overlap. In this arrangement, several circuit blocks defined on each die (1) overlap with other circuit blocks defined on one or more other dies, and (2) electrically connect to these other circuit blocks through connections that cross one or more bonding layers that bond one or more pairs of dies. In some embodiments, the overlapping, connected circuit block pairs include pairs of computation blocks and pairs of computation and memory blocks. The connections that cross bonding layers to electrically connect circuit blocks on different dies are referred to below as z-axis wiring or connections. This is because these connections traverse completely or mostly in the z-axis of the 3D circuit, with the x-y axes of the 3D circuit defining the planar surface of the IC die substrate or interconnect layers.Type: ApplicationFiled: March 27, 2020Publication date: July 16, 2020Inventors: Steven L. Teig, Ilyas Mohammed, Kenneth Duong, Javier DeLaCruz
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Patent number: 10672745Abstract: Some embodiments of the invention provide a three-dimensional (3D) circuit that is formed by vertically stacking two or more integrated circuit (IC) dies to at least partially overlap. In this arrangement, several circuit blocks defined on each die (1) overlap with other circuit blocks defined on one or more other dies, and (2) electrically connect to these other circuit blocks through connections that cross one or more bonding layers that bond one or more pairs of dies. In some embodiments, the overlapping, connected circuit block pairs include pairs of computation blocks and pairs of computation and memory blocks. The connections that cross bonding layers to electrically connect circuit blocks on different dies are referred to below as z-axis wiring or connections. This is because these connections traverse completely or mostly in the z-axis of the 3D circuit, with the x-y axes of the 3D circuit defining the planar surface of the IC die substrate or interconnect layers.Type: GrantFiled: October 14, 2018Date of Patent: June 2, 2020Assignee: Xcelsis CorporationInventors: Steven L. Teig, Ilyas Mohammed, Kenneth Duong, Javier DeLaCruz
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Patent number: 10672743Abstract: Some embodiments of the invention provide a three-dimensional (3D) circuit that is formed by vertically stacking two or more integrated circuit (IC) dies to at least partially overlap. In this arrangement, several circuit blocks defined on each die (1) overlap with other circuit blocks defined on one or more other dies, and (2) electrically connect to these other circuit blocks through connections that cross one or more bonding layers that bond one or more pairs of dies. In some embodiments, the overlapping, connected circuit block pairs include pairs of computation blocks and pairs of computation and memory blocks. The connections that cross bonding layers to electrically connect circuit blocks on different dies are referred to below as z-axis wiring or connections. This is because these connections traverse completely or mostly in the z-axis of the 3D circuit, with the x-y axes of the 3D circuit defining the planar surface of the IC die substrate or interconnect layers.Type: GrantFiled: October 14, 2018Date of Patent: June 2, 2020Assignee: Xcelsis CorporationInventors: Steven L. Teig, Ilyas Mohammed, Kenneth Duong, Javier DeLaCruz
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Patent number: 10672744Abstract: Some embodiments of the invention provide a three-dimensional (3D) circuit that is formed by vertically stacking two or more integrated circuit (IC) dies to at least partially overlap. In this arrangement, several circuit blocks defined on each die (1) overlap with other circuit blocks defined on one or more other dies, and (2) electrically connect to these other circuit blocks through connections that cross one or more bonding layers that bond one or more pairs of dies. In some embodiments, the overlapping, connected circuit block pairs include pairs of computation blocks and pairs of computation and memory blocks. The connections that cross bonding layers to electrically connect circuit blocks on different dies are referred to below as z-axis wiring or connections. This is because these connections traverse completely or mostly in the z-axis of the 3D circuit, with the x-y axes of the 3D circuit defining the planar surface of the IC die substrate or interconnect layers.Type: GrantFiled: October 14, 2018Date of Patent: June 2, 2020Assignee: XCELSIS CORPORATIONInventors: Steven L. Teig, Ilyas Mohammed, Kenneth Duong, Javier DeLaCruz
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Patent number: 10664564Abstract: An integrated circuit and a method for designing an IC where the smallest repeatable block is selected, designed and tested to span across multiple die levels. The block is configured to be timing closed at the block level thereby reducing the overall complexity of the design and avoiding the limiting effects of the constrained EDA tools. The block may subsequently be repeated on multiple die to be stacked in an IC.Type: GrantFiled: June 22, 2018Date of Patent: May 26, 2020Assignee: Xcelsis CorporationInventors: Javier A Delacruz, Eric Nequist, Jung Ko, Kenneth Duong
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Patent number: 10607136Abstract: Some embodiments of the invention provide a three-dimensional (3D) circuit structure that uses latches to transfer signals between two bonded circuit layers. In some embodiments, this structure includes a first circuit partition on a first bonded layer and a second circuit partition on a second bonded layer. It also includes at least one latch to transfer signals between the first circuit partition on the first bonded layer and the second circuit partition on the second bonded layer. In some embodiments, the latch operates in (1) an open first mode that allows a signal to pass from the first circuit partition to the second circuit partition and (2) a closed second mode that maintains the signal passed through during the prior open first mode.Type: GrantFiled: December 31, 2017Date of Patent: March 31, 2020Assignee: Xcelsis CorporationInventors: Steven L. Teig, Kenneth Duong, Javier DeLaCruz
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Publication number: 20190392104Abstract: An integrated circuit and a method for designing an IC where the smallest repeatable block is selected, designed and tested to span across multiple die levels. The block is configured to be timing closed at the block level thereby reducing the overall complexity of the design and avoiding the limiting effects of the constrained EDA tools. The block may subsequently be repeated on multiple die to be stacked in an IC.Type: ApplicationFiled: June 22, 2018Publication date: December 26, 2019Applicant: Xcelsis CorporationInventors: Javier A DELACRUZ, Eric NEQUIST, Jung KO, Kenneth DUONG
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Publication number: 20190252375Abstract: A microelectronic circuit structure comprises a stack of bonded layers comprising a bottom layer and at least one upper layer. At least one of the upper layers comprises an oxide layer having a back surface and a front surface closer to the bottom layer than the back surface, and a plurality of FD-SOI transistors built on the front surface. At least a first back gate line and a second back gate line extend separate from each other above the back surface for independently providing a first back gate bias to a first group of transistors and a second back gate bias to a second different group of transistors.Type: ApplicationFiled: February 9, 2018Publication date: August 15, 2019Inventors: Javier A. DELACRUZ, David Edward FISCH, Kenneth DUONG, Xu CHANG, Liang WANG
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Publication number: 20190123023Abstract: Some embodiments of the invention provide a three-dimensional (3D) circuit that is formed by vertically stacking two or more integrated circuit (IC) dies to at least partially overlap. In this arrangement, several circuit blocks defined on each die (1) overlap with other circuit blocks defined on one or more other dies, and (2) electrically connect to these other circuit blocks through connections that cross one or more bonding layers that bond one or more pairs of dies. In some embodiments, the overlapping, connected circuit block pairs include pairs of computation blocks and pairs of computation and memory blocks. The connections that cross bonding layers to electrically connect circuit blocks on different dies are referred to below as z-axis wiring or connections. This is because these connections traverse completely or mostly in the z-axis of the 3D circuit, with the x-y axes of the 3D circuit defining the planar surface of the IC die substrate or interconnect layers.Type: ApplicationFiled: October 14, 2018Publication date: April 25, 2019Inventors: Steven L. Teig, Ilyas Mohammed, Kenneth Duong, Javier DeLaCruz
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Publication number: 20190123024Abstract: Some embodiments of the invention provide a three-dimensional (3D) circuit that is formed by vertically stacking two or more integrated circuit (IC) dies to at least partially overlap. In this arrangement, several circuit blocks defined on each die (1) overlap with other circuit blocks defined on one or more other dies, and (2) electrically connect to these other circuit blocks through connections that cross one or more bonding layers that bond one or more pairs of dies. In some embodiments, the overlapping, connected circuit block pairs include pairs of computation blocks and pairs of computation and memory blocks. The connections that cross bonding layers to electrically connect circuit blocks on different dies are referred to below as z-axis wiring or connections. This is because these connections traverse completely or mostly in the z-axis of the 3D circuit, with the x-y axes of the 3D circuit defining the planar surface of the IC die substrate or interconnect layers.Type: ApplicationFiled: October 14, 2018Publication date: April 25, 2019Inventors: Steven L. Teig, Ilyas Mohammed, Kenneth Duong, Javier DeLaCruz
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Publication number: 20190123022Abstract: Some embodiments of the invention provide a three-dimensional (3D) circuit that is formed by vertically stacking two or more integrated circuit (IC) dies to at least partially overlap. In this arrangement, several circuit blocks defined on each die (1) overlap with other circuit blocks defined on one or more other dies, and (2) electrically connect to these other circuit blocks through connections that cross one or more bonding layers that bond one or more pairs of dies. In some embodiments, the overlapping, connected circuit block pairs include pairs of computation blocks and pairs of computation and memory blocks. The connections that cross bonding layers to electrically connect circuit blocks on different dies are referred to below as z-axis wiring or connections. This is because these connections traverse completely or mostly in the z-axis of the 3D circuit, with the x-y axes of the 3D circuit defining the planar surface of the IC die substrate or interconnect layers.Type: ApplicationFiled: October 14, 2018Publication date: April 25, 2019Inventors: Steven L. Teig, Ilyas Mohammed, Kenneth Duong, Javier DeLaCruz
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Publication number: 20190043832Abstract: Some embodiments provide a three-dimensional (3D) circuit structure that has two or more vertically stacked bonded layers with a machine-trained network on at least one bonded layer. As described above, each bonded layer can be an IC die or an IC wafer in some embodiments with different embodiments encompassing different combinations of wafers and dies for the different bonded layers. The machine-trained network in some embodiments includes several stages of machine-trained processing nodes with routing fabric that supplies the outputs of earlier stage nodes to drive the inputs of later stage nodes. In some embodiments, the machine-trained network is a neural network and the processing nodes are neurons of the neural network. In some embodiments, one or more parameters associated with each processing node (e.g., each neuron) is defined through machine-trained processes that define the values of these parameters in order to allow the machine-trained network (e.g.Type: ApplicationFiled: December 31, 2017Publication date: February 7, 2019Inventors: Steven L. Teig, Kenneth Duong, Javier DeLaCruz
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Publication number: 20190042912Abstract: Some embodiments of the invention provide a three-dimensional (3D) circuit structure that uses latches to transfer signals between two bonded circuit layers. In some embodiments, this structure includes a first circuit partition on a first bonded layer and a second circuit partition on a second bonded layer. It also includes at least one latch to transfer signals between the first circuit partition on the first bonded layer and the second circuit partition on the second bonded layer. In some embodiments, the latch operates in (1) an open first mode that allows a signal to pass from the first circuit partition to the second circuit partition and (2) a closed second mode that maintains the signal passed through during the prior open first mode.Type: ApplicationFiled: December 31, 2017Publication date: February 7, 2019Inventors: Steven L. Teig, Kenneth Duong, Javier DeLaCruz