Abstract: Some embodiments provide a three-dimensional (3D) circuit structure that has two or more vertically stacked bonded layers with a machine-trained network on at least one bonded layer. As described above, each bonded layer can be an IC die or an IC wafer in some embodiments with different embodiments encompassing different combinations of wafers and dies for the different bonded layers. The machine-trained network in some embodiments includes several stages of machine-trained processing nodes with routing fabric that supplies the outputs of earlier stage nodes to drive the inputs of later stage nodes. In some embodiments, the machine-trained network is a neural network and the processing nodes are neurons of the neural network. In some embodiments, one or more parameters associated with each processing node (e.g., each neuron) is defined through machine-trained processes that define the values of these parameters in order to allow the machine-trained network (e.g.

Abstract: Some embodiments of the invention provide an integrated circuit (IC) with a defect-tolerant neural network. The neural network has one or more redundant neurons in some embodiments. After the IC is manufactured, a defective neuron in the neural network can be detected through a test procedure and then replaced by a redundant neuron (i.e., the redundant neuron can be assigned the operation of the defective neuron). The routing fabric of the neural network can be reconfigured so that it re-routes signals around the discarded, defective neuron. In some embodiments, the reconfigured routing fabric does not provide any signal to or forward any signal from the discarded, defective neuron, and instead provides signals to and forwards signals from the redundant neuron that takes the defective neuron's position in the neural network. In some embodiments that implement a neural network by re-purposing (i.e.

Abstract: A programmable integrated circuit may include configuration random-access memory (CRAM) cells and lookup table random-access memory (LUTRAM) cells. The programmable integrated circuit may include a CRAM column and at least two LUTRAM columns, a first portion of which is operable as LUTRAM cells and a second portion of which is reused as CRAM cells. Each of the memory cells have a configuration write port and a read port. The configuration write ports of the first portion may be gated, whereas the configuration write ports of the second portion lack gating logic. The read port of the memory cells in the LUTRAM columns may be masked only when the first portion of cells are operated in RAM mode and are currently being accessed.

Abstract: An integrated circuit that includes an array of random-access memory cells is provided. Each memory cell in the array may be a single-port or a multiport memory cell. Memory cells in the same column of the array are connected to shared bit lines, whereas memory cells in the same row of the array are connected to shared word lines. The memory cells in the same row may also be connected to a row control line. During normal operations, the row control line may provide a positive power supply voltage to each memory cell along that row. During write operations, the row control line may be driven to ground or tri-stated to help improve the write margin and the write performance of the selected memory cells. The aspect ratio of these memory cells may also be more square-like or balanced to help improve power delivery.

Abstract: An integrated circuit with a clock distribution network is provided. The clock distribution network may include configurable clock routing paths linking a clock source to one or more clock tree roots and may also include fixed clock routing paths linking the clock tree roots to corresponding leaf nodes. Both the configurable clock routing paths and the fixed clock routing paths can be implemented using an array of logic regions, where each logic region includes a clock switching box, a horizontal routing segment, a vertical routing segment, and associated logic circuitry. The configurable routing paths may include horizontal/vertical routing segments with bidirectional tristate buffers. The fixed routing paths may include horizontal/vertical routing segments with unidirectional inverters that are configured to form an H-tree.