Patents by Inventor Kenneth E. Goodson
Kenneth E. Goodson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230380106Abstract: Disclosed herein are apparatus for a cooler device includes a manifold constructed at least partially of silicon oxide. The manifold includes an array of inlet channels and an array of outlet channels. Each inlet channel has a first depth. The array of outlet channels are interlaced with the array of inlet channels, Each outlet channel has a second depth that is larger than the first depth. Each of the array of outlet channels has a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels.Type: ApplicationFiled: May 19, 2022Publication date: November 23, 2023Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the Leland Stanford Junior University, The Regents of the University of California, Merced, Alliance for Sustainable Energy, LLCInventors: Sougata Hazra, Chi Zhang, Mehdi Asheghi, Kenneth E. Goodson, Ercan M. Dede, James Palko, Sreekant Narumanchi
-
Publication number: 20230314090Abstract: Improved vapor chambers are provided using monolithic wick structures having deep features (?150 um) and two or more different feature heights above the substrate. Such monolithic multi-level wick structures provide improved performance in vapor chambers by alleviating the tradeoff between fluid transport (which favors tall pin-fins) and heat transfer (which favors short pin-fins).Type: ApplicationFiled: March 31, 2023Publication date: October 5, 2023Inventors: Sougata Hazra, Mehdi Asheghi, Kenneth E. Goodson, Chi Zhang
-
Patent number: 11729951Abstract: A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.Type: GrantFiled: January 13, 2022Date of Patent: August 15, 2023Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the Leland Stanford Junior University, The Regents of the University of California, Merced, Alliance for Sustainable Energy, LLCInventors: Chi Zhang, Qianying Wu, Muhammad Shattique, Neda Seyedhassantehrani, Souvik Roy, James Palko, Sreekant Narumanchi, Bidzina Kekelia, Sougata Hazra, Kenneth E. Goodson, Roman Giglio, Ercan M. Dede, Mehdi Asheghi
-
Publication number: 20230225082Abstract: A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.Type: ApplicationFiled: January 13, 2022Publication date: July 13, 2023Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the Leland Stanford Junior University, The Regents of the University of California, Merced, Alliance for Sustainable Energy, LLCInventors: Chi Zhang, Qianying Wu, Muhammad Shattique, Neda Seyedhassantehrani, Souvik Roy, James Palko, Sreekant Narumanchi, Bidzina Kekelia, Sougata Hazra, Kenneth E. Goodson, Roman Giglio, Ercan M. Dede, Mehdi Asheghi
-
Publication number: 20230197448Abstract: We provide a novel cleanroom-based process flow that allows for easy creation of multi-level, hierarchical 3D structures in a substrate. This is achieved by introducing an ultra-thin sacrificial hardmask layer on the substrate which is first 3D patterned via multiple rounds of lithography. This 3D pattern is then scaled vertically by a factor of 200 - 300 and transferred to the substrate underneath via a single shot deep etching step. This method is also easily characterizable - using features of different topographies and dimensions, the etch rates and selectivities were quantified; this characterization information was later used while fabricating specific target structures.Type: ApplicationFiled: December 19, 2022Publication date: June 22, 2023Inventors: Chi Zhang, Sougata Hazra, Qianying Wu, Mehdi Asheghi, Kenneth E. Goodson, Ercan Dede, James Palko, Sreekant Narumanchi
-
Publication number: 20220370951Abstract: A first aspect of this work relates to water harvesting in power plants. A water adsorbent material is driven through adsorption-desorption cycles using waste heat from a power plant to harvest water from ambient air. In a preferred embodiment, metal-organic-framework (MOF) powders are used as the water adsorbent material for this application. A second aspect of this work relates more generally to rapid adsorption-desorption cycling of MOFs for various applications.Type: ApplicationFiled: September 30, 2020Publication date: November 24, 2022Inventors: Mehdi Asheghi, Kenneth E. Goodson, Alexandros Terzis, Juan G. Santiago
-
Publication number: 20220115590Abstract: A low-power phase-change memory (PCM) technology with interfacial thermoelectric heating (TEH) enhancement is provided. Embodiments described herein leverage a substantial, positive thermoelectric coefficient in PCM materials to generate additional heating or cooling at an interface with another material, enabling memory switching with a large reduction in current and power. Interfacial thermoelectric engineering is applied to a PCM cell using a special class of thermoelectric materials with large negative Seebeck coefficients (e.g., bismuth telluride (Bi2Te3), lead telluride (PbTe), lanthanum telluride (La3Te4), indium selenide (InSe), silicon-germanium (Si0.8Ge0.2)) to induce efficient heating at significantly lowered power and current.Type: ApplicationFiled: October 11, 2021Publication date: April 14, 2022Inventors: Asir Intisar Khan, Eric Pop, Raisul Islam, H.-S. Philip Wong, Kenneth E. Goodson, Mehdi Asheghi, Heungdong Kwon
-
Patent number: 10784115Abstract: A method of etching features in a silicon wafer includes coating a top surface and a bottom surface of the silicon wafer with a mask layer having a lower etch rate than an etch rate of the silicon wafer, removing one or more portions of the mask layer to form a mask pattern in the mask layer on the top surface and the bottom surface of the silicon wafer, etching one or more top surface features into the top surface of the silicon wafer through the mask pattern to a depth plane located between the top surface and the bottom surface of the silicon wafer at a depth from the top surface, coating the top surface and the one or more top surface features with a metallic coating, and etching one or more bottom surface features into the bottom surface of the silicon wafer through the mask pattern to the target depth plane.Type: GrantFiled: July 10, 2019Date of Patent: September 22, 2020Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the Leland Stanford Junior UniversityInventors: Feng Zhou, Ki Wook Jung, Ercan Mehmet Dede, Mehdi Asheghi, Kenneth E. Goodson
-
Publication number: 20190333773Abstract: A method of etching features in a silicon wafer includes coating a top surface and a bottom surface of the silicon wafer with a mask layer having a lower etch rate than an etch rate of the silicon wafer, removing one or more portions of the mask layer to form a mask pattern in the mask layer on the top surface and the bottom surface of the silicon wafer, etching one or more top surface features into the top surface of the silicon wafer through the mask pattern to a depth plane located between the top surface and the bottom surface of the silicon wafer at a depth from the top surface, coating the top surface and the one or more top surface features with a metallic coating, and etching one or more bottom surface features into the bottom surface of the silicon wafer through the mask pattern to the target depth plane.Type: ApplicationFiled: July 10, 2019Publication date: October 31, 2019Applicants: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., The Board of Trustees of the Leland Stanford Junior UniversityInventors: Feng Zhou, Ki Wook Jung, Ercan Mehmet Dede, Mehdi Asheghi, Kenneth E. Goodson
-
Publication number: 20190287810Abstract: A method of etching features in a silicon wafer includes coating a top surface and a bottom surface of the silicon wafer with a mask layer having a lower etch rate than an etch rate of the silicon wafer, removing one or more portions of the mask layer to form a mask pattern in the mask layer on the top surface and the bottom surface of the silicon wafer, etching one or more top surface features into the top surface of the silicon wafer through the mask pattern to a depth plane located between the top surface and the bottom surface of the silicon wafer at a depth from the top surface, coating the top surface and the one or more top surface features with a metallic coating, and etching one or more bottom surface features into the bottom surface of the silicon wafer through the mask pattern to the target depth plane.Type: ApplicationFiled: March 13, 2018Publication date: September 19, 2019Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the Leland Stanford Junior UniversityInventors: Feng Zhou, Ki Wook Jung, Ercan Mehmet Dede, Mehdi Asheghi, Kenneth E. Goodson
-
Patent number: 10395940Abstract: A method of etching features in a silicon wafer includes coating a top surface and a bottom surface of the silicon wafer with a mask layer having a lower etch rate than an etch rate of the silicon wafer, removing one or more portions of the mask layer to form a mask pattern in the mask layer on the top surface and the bottom surface of the silicon wafer, etching one or more top surface features into the top surface of the silicon wafer through the mask pattern to a depth plane located between the top surface and the bottom surface of the silicon wafer at a depth from the top surface, coating the top surface and the one or more top surface features with a metallic coating, and etching one or more bottom surface features into the bottom surface of the silicon wafer through the mask pattern to the target depth plane.Type: GrantFiled: March 13, 2018Date of Patent: August 27, 2019Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the Leland Stanford Junior UniversityInventors: Feng Zhou, Ki Wook Jung, Ercan Mehmet Dede, Mehdi Asheghi, Kenneth E. Goodson
-
Patent number: 10180288Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: GrantFiled: February 2, 2017Date of Patent: January 15, 2019Assignee: Northrop Grumman Systems CorporationInventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
-
Patent number: 10066876Abstract: Embodiments of an evaporator chamber heat flux rectifier and thermal switch are provided. Some embodiments include an evaporator layer with a first thermally conductive surface, a wicking structure for facilitating evaporation of a fluid in the vapor chamber heat flux rectifier, and a condenser layer that includes a second thermally conductive surface. Some embodiments include a middle layer, where when heat is applied to the first thermally conductive surface, the vapor chamber heat flux rectifier operates as a thermal conductor. Some embodiments that operate as a thermal switch include a non-condensable gas reservoir that is coupled to the condenser layer. The non-condensable gas reservoir may store a non-condensable gas when a threshold heat flux is applied to the evaporator layer. The non-condensable gas provides thermal insulation between the evaporator layer and the condenser layer when the threshold heat flux is not applied to the evaporator layer.Type: GrantFiled: September 9, 2016Date of Patent: September 4, 2018Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the Leland Stanford Junior UniversityInventors: Feng Zhou, Ercan M. Dede, Mehdi Asheghi, James W. Palko, Kenneth E. Goodson
-
Publication number: 20180073814Abstract: Embodiments of an evaporator chamber heat flux rectifier and thermal switch are provided. Some embodiments include an evaporator layer with a first thermally conductive surface, a wicking structure for facilitating evaporation of a fluid in the vapor chamber heat flux rectifier, and a condenser layer that includes a second thermally conductive surface. Some embodiments include a middle layer, where when heat is applied to the first thermally conductive surface, the vapor chamber heat flux rectifier operates as a thermal conductor. Some embodiments that operate as a thermal switch include a non-condensable gas reservoir that is coupled to the condenser layer. The non-condensable gas reservoir may store a non-condensable gas when a threshold heat flux is applied to the evaporator layer. The non-condensable gas provides thermal insulation between the evaporator layer and the condenser layer when the threshold heat flux is not applied to the evaporator layer.Type: ApplicationFiled: September 9, 2016Publication date: March 15, 2018Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the Leland Stanford Junior UniversityInventors: Feng Zhou, Ercan M. Dede, Mehdi Asheghi, James W. Palko, Kenneth E. Goodson
-
Publication number: 20170146302Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material: placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: ApplicationFiled: February 2, 2017Publication date: May 25, 2017Inventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
-
Patent number: 9601452Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: GrantFiled: August 29, 2016Date of Patent: March 21, 2017Assignees: Northrup Grumman Systems Corporation, The Board of Trustees of the Leland Stanford Junior UniversityInventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
-
Patent number: 9583702Abstract: Provided is a phase change memory device including a graphene layer inserted between a lower electrode into which heat flows and a phase change material layer, to prevent the heat from being diffused to an outside so as to efficiently transfer the heat to the phase change material layer, and a method of fabricating the phase change memory device. The phase change memory device includes a lower electrode; an insulating layer formed to enclose the lower electrode; a graphene layer formed on the lower electrode; a phase change material layer formed on the graphene layer and the insulating layer; and an upper electrode formed on the phase change material layer. Since a phase of the phase change material layer is changed at a small amount of driving current, the phase change memory device is fabricated to have a high driving speed and a high integration.Type: GrantFiled: January 29, 2016Date of Patent: February 28, 2017Assignees: Samsung Electronics Co., Ltd., The Board of Trustees of the Leland Stanford Junior UniversityInventors: Yongsung Kim, Chiyui Ahn, Aditya Sood, Eric Pop, H.-S. Philip Wong, Kenneth E. Goodson, Scott Fong, Seunghyun Lee, Christopher M. Neumann, Mehdi Asheghi
-
Publication number: 20160372438Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: ApplicationFiled: August 29, 2016Publication date: December 22, 2016Inventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
-
Patent number: 9468989Abstract: A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.Type: GrantFiled: January 26, 2016Date of Patent: October 18, 2016Assignees: Northrop Grumman Systems Corporation, The Board of Trustees of the Leland Stanford Junior UniversityInventors: John A. Starkovich, Edward M. Silverman, Jesse B. Tice, Hsiao-Hu Peng, Michael T. Barako, Kenneth E. Goodson
-
Publication number: 20160276585Abstract: Provided is a phase change memory device including a graphene layer inserted between a lower electrode into which heat flows and a phase change material layer, to prevent the heat from being diffused to an outside so as to efficiently transfer the heat to the phase change material layer, and a method of fabricating the phase change memory device. The phase change memory device includes a lower electrode; an insulating layer formed to enclose the lower electrode; a graphene layer formed on the lower electrode; a phase change material layer formed on the graphene layer and the insulating layer; and an upper electrode formed on the phase change material layer. Since a phase of the phase change material layer is changed at a small amount of driving current, the phase change memory device is fabricated to have a high driving speed and a high integration.Type: ApplicationFiled: January 29, 2016Publication date: September 22, 2016Inventors: Yongsung Kim, Chiyui Ahn, Aditya Sood, Eric Pop, H.S. Philip Wong, Kenneth E. Goodson, Scott Fong, Seunghyun Lee, Christopher M. Neumann, Mehdi Asheghi