Abstract: A method and system for probing with electrical test signals on an integrated circuit specimen using a high resolution microscope positioned for observing a surface of the specimen exposing electrically conductive terminals thereon. A housing is provided with a carrier therein for supporting the specimen in relation to the microscope and a probe assembly is positionable on the surface of the specimen for conveying and acquiring electrical test signals to and from the specimen. A drive system is provided for shifting at least one of the probe and the carrier to a predetermined test position. In one form the system has a heat shield for protecting one of the probe assembly and the carrier from heat energy generated upon operation of the drive system, and in another form, the system has an environmental control for maintaining a desired temperature within the housing so that accurate measurements may be taken from the specimen.

Abstract: A method and apparatus for keeping a probe accurately positioned relative to a device to be tested. The apparatus having a probe and movable probe station element for positioning the probe at a predetermined test position on the device to be tested. The probe station element being driven by a drive to position the probe at the test position, and having a controller connected thereto for substantially keeping the probe at the test position and inhibiting the probe shifting therefrom. In one form the controller is capable of determining the variance between the current probe position and the desired or predetermined test position, and actuating the drive after the variance has reached a predetermined value.

Abstract: The invention relates to a probe assembly for a wafer probe station having a probe holder and a replaceable probe tip. The probe holder is triaxially configured with a laterally extending center signal conductor, an intermediate guard conductor extending along the length of the center conductor and spaced radially therefrom by a tubular insulator member, and an outer shield member extending along a portion of the guard conductor and spaced radially therefrom by a second tubular insulator member. A coaxially configured probe tip has a center conductor extending to a probe point and a guard conductor radially spaced from the center conductor by an intermediate insulator. A releasable connection provides a rigid attachment between the probe tip and the probe holder and provides electrical interfaces between the center and guard conductors thereof.

Abstract: The invention relates to a probe assembly for a wafer probe station having a probe holder and a replaceable probe tip. The probe holder is triaxially configured with a laterally extending center signal conductor, an intermediate guard conductor extending along the length of the center conductor and spaced radially therefrom by a tubular insulator member, and an outer shield member extending along a portion of the guard conductor and spaced radially therefrom by a second tubular insulator member. A coaxially configured probe tip has a center conductor extending to a probe point and a guard conductor radially spaced from the center conductor by an intermediate insulator. A releasable connection provides a rigid attachment between the probe tip and the probe holder and provides electrical interfaces between the center and guard conductors thereof.