Patents by Inventor Kenong Wu

Kenong Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10923317
    Abstract: Methods and systems for detecting defects in a logic region on a wafer are provided. One method includes acquiring information for different types of design-based care areas in a logic region of a wafer. The method also includes designating the different types of the design-based care areas as different types of sub-regions and, for a localized area within the logic region, assigning two or more instances of the sub-regions located in the localized area to a super-region. In addition, the method includes generating one scatter plot for all of the two or more instances of the sub-regions assigned to the super-region. The one scatter plot is generated with different segmentation values for the output corresponding to the different types of the sub-regions. The method further includes detecting defects in the sub-regions based on the one scatter plot.
    Type: Grant
    Filed: August 18, 2019
    Date of Patent: February 16, 2021
    Assignee: KLA Corp.
    Inventors: Junqing Huang, Paul Russell, Hucheng Lee, Kenong Wu
  • Publication number: 20200258792
    Abstract: A system, method, and non-transitory computer readable medium are provided for tuning sensitivities of, and determining a process window for, a modulated wafer. The sensitivities for dies of the modulated wafer are tuned dynamically based on a single set of parameters. Further, the process window is determined for the modulated wafer from prior determined parameter-specific nominal process windows.
    Type: Application
    Filed: April 29, 2020
    Publication date: August 13, 2020
    Applicant: KLA-Tencor Corporation
    Inventors: David Craig Oram, Abhinav Mathur, Kenong Wu, Eugene Shifrin
  • Patent number: 10679909
    Abstract: A system, method, and non-transitory computer readable medium are provided for tuning sensitivities of, and determining a process window for, a modulated wafer. The sensitivities for dies of the modulated wafer are tuned dynamically based on a single set of parameters. Further, the process window is determined for the modulated wafer from prior determined parameter-specific nominal process windows.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: June 9, 2020
    Assignee: KLA-TENCOR CORPORATION
    Inventors: David Craig Oram, Abhinav Mathur, Kenong Wu, Eugene Shifrin
  • Publication number: 20200090904
    Abstract: Methods and systems for detecting defects in a logic region on a wafer are provided. One method includes acquiring information for different types of design-based care areas in a logic region of a wafer. The method also includes designating the different types of the design-based care areas as different types of sub-regions and, for a localized area within the logic region, assigning two or more instances of the sub-regions located in the localized area to a super-region. In addition, the method includes generating one scatter plot for all of the two or more instances of the sub-regions assigned to the super-region. The one scatter plot is generated with different segmentation values for the output corresponding to the different types of the sub-regions. The method further includes detecting defects in the sub-regions based on the one scatter plot.
    Type: Application
    Filed: August 18, 2019
    Publication date: March 19, 2020
    Inventors: Junqing Huang, Paul Russell, Hucheng Lee, Kenong Wu
  • Publication number: 20200072763
    Abstract: Methods and systems for transforming positions of defects detected on a wafer are provided. One method includes aligning output of an inspection subsystem for a first frame in a first swath in a first die in a first instance of a multi-die reticle printed on the wafer to the output for corresponding frames, swaths, and dies in other reticle instances printed on the wafer. The method also includes determining different swath coordinate offsets for each of the frames, respectively, in the other reticle instances based on the swath coordinates of the output for the frames and the corresponding frames aligned thereto and applying one of the different swath coordinate offsets to the swath coordinates reported for the defects based on the other reticle instances in which they are detected thereby transforming the swath coordinates for the defects from swath coordinates in the other reticle instances to the first reticle instance.
    Type: Application
    Filed: May 14, 2018
    Publication date: March 5, 2020
    Inventors: Shishir Suman, Kenong Wu, Hong Chen
  • Patent number: 10572991
    Abstract: A method may include, but is not limited to, receiving a plurality of reference images of a wafer. The method may include, but is not limited to, receiving the plurality of test images of the wafer. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a coarse alignment process. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a fine alignment process after alignment via the coarse alignment process. The fine alignment process may include measuring individual offsets and correcting individual offset data between at least one of the plurality of reference images and the plurality of test images.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: February 25, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Hong Chen, Michael Cook, Pavan Kumar, Kenong Wu
  • Patent number: 10395359
    Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: August 27, 2019
    Assignee: KLA-Tencor Corp.
    Inventors: Junqing Huang, Hucheng Lee, Kenong Wu, Lisheng Gao
  • Patent number: 10387601
    Abstract: Systems and methods are disclosed for storing dynamic layer content in a design file. A design file is received having design data corresponding to a plurality of process layers. A geometric operation formula is also received. A processor generates a polygon having dynamic layer content that is formed by applying the geometric operation formula on two or more of the plurality of process layers. The updated design file is stored, the design file now having a polygon having dynamic layer content.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: August 20, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Thirupurasundari Jayaraman, Srikanth Kandukuri, Gordon Rouse, Anil Raman, Kenong Wu, Praveen Gunasekaran, Aravindh Balaji, Ankit Jain
  • Patent number: 10365232
    Abstract: Methods and systems for transforming positions of defects detected on a wafer are provided. One method includes aligning output of an inspection subsystem for a first frame in a first swath in a first die in a first instance of a multi-die reticle printed on the wafer to the output for corresponding frames, swaths, and dies in other reticle instances printed on the wafer. The method also includes determining different swath coordinate offsets for each of the frames, respectively, in the other reticle instances based on the swath coordinates of the output for the frames and the corresponding frames aligned thereto and applying one of the different swath coordinate offsets to the swath coordinates reported for the defects based on the other reticle instances in which they are detected thereby transforming the swath coordinates for the defects from swath coordinates in the other reticle instances to the first reticle instance.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: July 30, 2019
    Assignee: KLA-Tencor Corp.
    Inventors: Shishir Suman, Kenong Wu
  • Patent number: 10339262
    Abstract: A method includes identifying a first set of a first care area with a first sensitivity threshold, the first care area associated with a first design of interest within a block of repeating cells in design data; identifying an additional set of an additional care area with an additional sensitivity threshold, the additional care area associated with an additional design of interest within the block of repeating cells in design data; identifying one or more defects within the first set of the first care areas in one or more images of a selected region of a sample based on the first sensitivity threshold; and identifying one or more defects within the additional set of the additional care areas in the one or more images of the selected region of the sample based on the additional sensitivity threshold.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: July 2, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Junqing Huang, Soren Konecky, Hucheng Lee, Kenong Wu, Lisheng Gao
  • Publication number: 20190139208
    Abstract: A method may include, but is not limited to, receiving a plurality of reference images of a wafer. The method may include, but is not limited to, receiving the plurality of test images of the wafer. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a coarse alignment process. The method may include, but is not limited to, aligning the plurality of reference images and the plurality of test images via a fine alignment process after alignment via the coarse alignment process. The fine alignment process may include measuring individual offsets and correcting individual offset data between at least one of the plurality of reference images and the plurality of test images.
    Type: Application
    Filed: December 11, 2017
    Publication date: May 9, 2019
    Inventors: Hong Chen, Michael Cook, Pavan Kumar, Kenong Wu
  • Publication number: 20180328860
    Abstract: Methods and systems for transforming positions of defects detected on a wafer are provided. One method includes aligning output of an inspection subsystem for a first frame in a first swath in a first die in a first instance of a multi-die reticle printed on the wafer to the output for corresponding frames, swaths, and dies in other reticle instances printed on the wafer. The method also includes determining different swath coordinate offsets for each of the frames, respectively, in the other reticle instances based on the swath coordinates of the output for the frames and the corresponding frames aligned thereto and applying one of the different swath coordinate offsets to the swath coordinates reported for the defects based on the other reticle instances in which they are detected thereby transforming the swath coordinates for the defects from swath coordinates in the other reticle instances to the first reticle instance.
    Type: Application
    Filed: March 29, 2018
    Publication date: November 15, 2018
    Inventors: Shishir Suman, Kenong Wu
  • Patent number: 10127652
    Abstract: Systems and methods for classifying defects detected on a wafer are provided. One method includes detecting defects on a wafer based on output generated for the wafer by an inspection system. The method also includes determining one or more attributes for at least one of the defects based on portions of a standard reference image corresponding to the at least one of the defects. The method further includes classifying the at least one of the defects based at least in part on the one or more determined attributes.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: November 13, 2018
    Assignee: KLA-Tencor Corp.
    Inventors: Lisheng Gao, Avijit K. Ray-Chaudhuri, Raghav Babulnath, Kenong Wu
  • Publication number: 20180144996
    Abstract: A system, method, and non-transitory computer readable medium are provided for tuning sensitivities of, and determining a process window for, a modulated wafer. The sensitivities for dies of the modulated wafer are tuned dynamically based on a single set of parameters. Further, the process window is determined for the modulated wafer from prior determined parameter-specific nominal process windows.
    Type: Application
    Filed: November 14, 2017
    Publication date: May 24, 2018
    Inventors: David Craig Oram, Abhinav Mathur, Kenong Wu, Eugene Shifrin
  • Patent number: 9846930
    Abstract: Methods and systems for detecting defects on a wafer using defect-specific and multi-channel information are provided. One method includes acquiring information for a target on a wafer. The target includes a pattern of interest (POI) formed on the wafer and a known defect of interest (DOI) occurring proximate to or in the POI. The method also includes detecting the known DOI in target candidates by identifying potential DOI locations based on images of the target candidates acquired by a first channel of an inspection system and applying one or more detection parameters to images of the potential DOI locations acquired by a second channel of the inspection system. Therefore, the image(s) used for locating potential DOI locations and the image(s) used for detecting defects can be different.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: December 19, 2017
    Assignee: KLA-Tencor Corp.
    Inventors: Kenong Wu, Lisheng Gao, Grace Hsiu-Ling Chen, David W. Shortt
  • Publication number: 20170287128
    Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates, The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates.
    Type: Application
    Filed: June 15, 2017
    Publication date: October 5, 2017
    Inventors: Junqing Huang, Hucheng Lee, Kenong Wu, Lisheng Gao
  • Publication number: 20170286589
    Abstract: A method includes identifying a first set of a first care area with a first sensitivity threshold, the first care area associated with a first design of interest within a block of repeating cells in design data; identifying an additional set of an additional care area with an additional sensitivity threshold, the additional care area associated with an additional design of interest within the block of repeating cells in design data; identifying one or more defects within the first set of the first care areas in one or more images of a selected region of a sample based on the first sensitivity threshold; and identifying one or more defects within the additional set of the additional care areas in the one or more images of the selected region of the sample based on the additional sensitivity threshold.
    Type: Application
    Filed: November 15, 2016
    Publication date: October 5, 2017
    Inventors: Junqing Huang, Soren Konecky, Hucheng Lee, Kenong Wu, Lisheng Gao
  • Patent number: 9766186
    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: September 19, 2017
    Assignee: KLA-Tencor Corp.
    Inventors: Hong Chen, Kenong Wu, Eugene Shifrin, Masatoshi Yamaoka
  • Patent number: 9766187
    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: September 19, 2017
    Assignee: KLA-Tencor Corp.
    Inventors: Hong Chen, Kenong Wu, Eugene Shifrin, Masatoshi Yamaoka, Gangadharan Sivaraman, Raghav Babulnath, Satya Kurada, Shuo Sun
  • Patent number: 9727047
    Abstract: Systems and methods for detecting defects on a specimen based on structural information are provided. One system includes one or more computer subsystems configured for separating the output generated by a detector of an inspection subsystem in an array area on a specimen into at least first and second segments of the output based on characteristic(s) of structure(s) in the array area such that the output in different segments has been generated in different locations in the array area in which the structure(s) having different values of the characteristic(s) are formed. The computer subsystem(s) are also configured for detecting defects on the specimen by applying one or more defect detection methods to the output based on whether the output is in the first segment or the second segment.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: August 8, 2017
    Assignee: KLA-Tencor Corp.
    Inventors: Qing Luo, Kenong Wu, Hucheng Lee, Lisheng Gao, Eugene Shifrin, Yan Xiong, Shuo Sun