Patents by Inventor Kentaro Sano
Kentaro Sano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240100503Abstract: Water-absorbent resin particles have polymer particles; and a polymer disposed on at least a part of a surface of the polymer particle, in which a surface free energy is 14.0 to 33.0 mJ/m2, and a fracture energy of the polymer determined from a stress-strain curve in a tensile test at a tensile rate of 200 mm/min is 2.00×106 J/m3 or more. An absorber contains the water-absorbent resin particles. An absorbent article has the absorber.Type: ApplicationFiled: November 30, 2021Publication date: March 28, 2024Inventors: Hiroki SAWAKI, Kentaro SANO
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Patent number: 11632334Abstract: A first node and a second node transmit packets to a third node via a switch. The packets are buffered in a Tx buffer in the switch and then transmitted to the third node. When the third node detects a sign of congestion at the Tx buffer based on the reception frequency of the packets, it is recognized, from transmitter addresses included in the received packets, that the nodes transmitting the packets to the third node are the first node and the second node, and a control packet for a transmission stop request is transmitted to the first node and the second node. On receiving the control packet for a transmission stop request, the first node stops transmission of only packets addressed to the third node. On receiving the control packet for a transmission stop request, the second node stops transmission of only packets addressed to the third node.Type: GrantFiled: September 7, 2021Date of Patent: April 18, 2023Assignees: FUJITSU LIMITED, RIKENInventors: Junichi Sugiyama, Katsuya Tsushita, Kentaro Sano, Tomohiro Ueno
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Publication number: 20230037333Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (4): [A]: epoxy resin [B]: aromatic diamine [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): the ratio H/E between the amount by mole, E, of the epoxy group in the component [A] and the amount by mole, H, of active hydrogen in the component [B] is 0.50 or more and 1.30 or less. (2): at least a part of the component [C] satisfies 0.10 or more and 0.Type: ApplicationFiled: November 5, 2020Publication date: February 9, 2023Applicant: TORAY INDUSTRIES, INC.Inventors: Koji FURUKAWA, Kentaro SANO, Junko KAWASAKI
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Publication number: 20220411626Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, and (1): at least a part of the component [C] has two or more alcoholic hydroxyl groups in the molecule. (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less. (3): the viscosity at 70° C. for 2 hours is 5.Type: ApplicationFiled: November 5, 2020Publication date: December 29, 2022Applicant: TORAY INDUSTRIES, INC.Inventors: Koji FURUKAWA, Kentaro SANO, Junko KAWASAKI
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Publication number: 20220411572Abstract: An object of the present invention is to provide an epoxy resin composition excellent in elastic modulus and strength, and a prepreg and a fiber reinforced composite material with the epoxy resin composition. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: aromatic diamine [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or more. (2): at least a part of the component [C] satisfies that the Hansen solubility parameter distance L to the component [A] is 20.0 or less.Type: ApplicationFiled: November 5, 2020Publication date: December 29, 2022Applicant: TORAY INDUSTRIES, INC.Inventors: Koji FURUKAWA, Kentaro SANO, Junko KAWASAKI
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Publication number: 20220380561Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications, has high Tg, and is excellent in elastic modulus and strength. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (2): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, (1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or less, (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.Type: ApplicationFiled: November 5, 2020Publication date: December 1, 2022Applicant: TORAY INDUSTRIES, INC.Inventors: Koji FURUKAWA, Kentaro SANO, Junko KAWASAKI
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Patent number: 11505641Abstract: A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.Type: GrantFiled: February 27, 2019Date of Patent: November 22, 2022Assignee: TORAY INDUSTRIES, INC.Inventors: Koji Furukawa, Junko Kawasaki, Soichi Yoshizaki, Kentaro Sano, Toshiya Kamae
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Publication number: 20220086096Abstract: A first node and a second node transmit packets to a third node via a switch. The packets are buffered in a Tx buffer in the switch and then transmitted to the third node. When the third node detects a sign of congestion at the Tx buffer based on the reception frequency of the packets, it is recognized, from transmitter addresses included in the received packets, that the nodes transmitting the packets to the third node are the first node and the second node, and a control packet for a transmission stop request is transmitted to the first node and the second node. On receiving the control packet for a transmission stop request, the first node stops transmission of only packets addressed to the third node. On receiving the control packet for a transmission stop request, the second node stops transmission of only packets addressed to the third node.Type: ApplicationFiled: September 7, 2021Publication date: March 17, 2022Applicants: FUJITSU LIMITED, RIKENInventors: Junichi Sugiyama, Katsuya Tsushita, Kentaro Sano, Tomohiro Ueno
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Patent number: 11221552Abstract: A light source device comprises: an excitation light source configured to generate excitation light; a wavelength conversion member including a base and a phosphor layer which is provided on the base and configured to convert the excitation light into fluorescence; and a converging optical system including a converging lens for converging the excitation light on the phosphor layer, wherein the light source device further comprises a housing for accommodating the wavelength conversion member, the excitation light source is provided outside the housing, a wall surface of the housing includes a lens hole into which the converging lens is inserted, and the converging lens which is inserted into the lens hole and the wall surface of the housing isolate an internal space of the housing from an outer space of the housing.Type: GrantFiled: November 12, 2018Date of Patent: January 11, 2022Assignee: MAXELL, LTD.Inventors: Masatoshi Arai, Hiroshi Shiina, Kentaro Sano
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Publication number: 20210371613Abstract: A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.Type: ApplicationFiled: February 27, 2019Publication date: December 2, 2021Applicant: Toray Industries, Inc.Inventors: Koji Furukawa, Junko Kawasaki, Soichi Yoshizaki, Kentaro Sano, Toshiya Kamae
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Epoxy resin composition, prepreg, fiber-reinforced composite material, and method for producing same
Patent number: 11186674Abstract: Provided is a fiber-reinforced composite material exhibiting high heat resistance and excellent appearance quality. is the composite material is based on an epoxy resin composition which contains constituents [A], [B], and [C] and satisfies conditions (i) and (ii): [A] a tri- or higher functional epoxy resin; [B] an aromatic amine; [C] an imidazole compound; 0.20?b/a?0.60; and??(i) 0.002?c/a?0.014;??(ii) wherein a (mol) denotes the number of epoxy groups in 100 g of the epoxy resin composition, b (mol) denotes the number of active hydrogens contained in the constituent [B], and c (mol) denotes the number of imidazole rings contained in the constituent [C]).Type: GrantFiled: April 5, 2018Date of Patent: November 30, 2021Assignee: TORAY INDUSTRIES, INC.Inventors: Kentaro Sano, Taiki Kuroda, Ayumi Mori, Toshiya Kamae -
Patent number: 11130857Abstract: The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A], an aromatic urea [B1] and/or an imidazole compound [B2] as component [B], and a borate ester compound as component [C], containing dicyandiamide in the amount of 0.5 part by mass or less relative to the total quantity of epoxy resins which accounts for 100 parts by mass, wherein the epoxy resin composition meets certain sets of further requirements with respect to its composition.Type: GrantFiled: June 23, 2017Date of Patent: September 28, 2021Assignee: TORAY INDUSTRIES, INC.Inventors: Kentaro Sano, Taiki Kuroda, Reo Takaiwa, Noriyuki Hirano
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Publication number: 20210230384Abstract: The present invention addresses the problem of providing: a towpreg that has superior bobbin unspoolability and process pass-through properties, and is capable of yielding a fiber-reinforced composite having extremely high 0° tensile strength utilization; and a pressure vessel using such a towpreg. The means for solving this problem is a towpreg obtained by impregnating a reinforcing fiber tow with an epoxy resin composition containing [A]-[D], wherein: the epoxy resin composition contains 10-90 parts by mass of [A] and 10-50 parts by mass of [B] per 100 parts by mass of the epoxy resin component; the epoxy resin composition has a 25° C. viscosity (?25) of 1-40 Pa·s and a 40° C. viscosity (?40) of 0.2-5 Pa·s; and the cured epoxy resin composition has a glass transition temperature (Tg) of 95° C. or higher.Type: ApplicationFiled: May 15, 2019Publication date: July 29, 2021Applicant: Toray Industries, Inc.Inventors: Masahiro Tsuzuki, Kentaro Sano, Toshiya Kamae
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Publication number: 20210189078Abstract: Disclosed is a prepreg comprising an epoxy resin composition containing [A] an epoxy resin and [B] a curing agent, and a reinforcing fiber, wherein the epoxy resin composition satisfies: (a) [A1] an epoxy resin represented by the general formula (I) is contained as the epoxy resin [A], and [A1?] an epoxy resin satisfying: n?2 among the component [A1]; wherein, R1, R2 and R3 each independently represent a hydrogen atom or a methyl group, and n represents an integer of 1 or more; (b) the entire epoxy resin has an average epoxy equivalent of 165 to 265 g/eq; (c) a water absorption coefficient at 85° C. and 95% RH for 2 hours is 3.0% by mass or less based on 100% by mass of the epoxy resin composition; (d) [B1] an aromatic urea as [B] a curing agent; and (e) the content of [B2] dicyandiamide is 0.5 part by mass or less based on 100 parts by mass of the entire epoxy resin.Type: ApplicationFiled: November 27, 2018Publication date: June 24, 2021Applicant: Toray Industries, Inc.Inventors: Kentaro Sano, Taiki Kuroda, Hiroyuki Uchida, Toshiya Kamae
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Patent number: 11008419Abstract: The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A] and an imidazole compound as component [B] and meets certain conditions (a) to (d).Type: GrantFiled: June 23, 2017Date of Patent: May 18, 2021Assignee: TORAY INDUSTRIES, INC.Inventors: Kentaro Sano, Taiki Kuroda, Reo Takaiwa, Noriyuki Hirano
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Publication number: 20200371415Abstract: A light source device comprises: an excitation light source configured to generate excitation light; a wavelength conversion member including a base and a phosphor layer which is provided on the base and configured to convert the excitation light into fluorescence; and a converging optical system including a converging lens for converging the excitation light on the phosphor layer, wherein the light source device further comprises a housing for accommodating the wavelength conversion member, the excitation light source is provided outside the housing, a wall surface of the housing includes a lens hole into which the converging lens is inserted, and the converging lens which is inserted into the lens hole and the wall surface of the housing isolate an internal space of the housing from an outer space of the housing.Type: ApplicationFiled: November 12, 2018Publication date: November 26, 2020Inventors: Masatoshi ARAI, Hiroshi SHIINA, Kentaro SANO
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Patent number: 10829603Abstract: There is provided a cured product of an epoxy resin composition, in which the compounding composition and the phase-separated structure of the epoxy resin composition are controlled so that the balance between rigidity and toughness of the cured product is superior compared with those of cured products of conventional epoxy resin compositions. A cured product of an epoxy resin composition, which has both superior rigidity and superior toughness compared with conventional materials can be produced by curing an epoxy resin composition comprising an epoxy resin, a polyrotaxane having graft-chain-modified cyclic molecules and a curing agent for the epoxy resin.Type: GrantFiled: February 17, 2015Date of Patent: November 10, 2020Assignee: TORAY INDUSTRIES, INC.Inventors: Keiichiro Nomura, Nobuhiro Morioka, Kentaro Sano, Noriyuki Hirano, Sadayuki Kobayashi
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Publication number: 20200241401Abstract: A projection video display apparatus capable of, even when an air inlet of a certain duct among a plurality of ducts is blocked, securing a cooling air path to the duct whose air inlet is blocked is provided. A projection video display apparatus 100 according to one embodiment includes a heat generating member that generates heat such as an optical system component or an electronic component, a plurality of cooling fans 121 to 127 configured to cool heat from the heat generating member, and a plurality of ducts 201 to 203 to be cooling air paths each having at least one of the plurality of cooling fans 121 to 127 stored therein, at least two of the ducts being adjacent to each other. Also, the ducts adjacent to each other have openings 221 to 223 in wall surfaces between the adjacent ducts.Type: ApplicationFiled: April 27, 2017Publication date: July 30, 2020Inventors: Kentaro SANO, Takeshi KATAYAMA
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EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING SAME
Publication number: 20200165378Abstract: Provided is a fiber-reinforced composite material exhibiting high heat resistance and excellent appearance quality. is the composite material is based on an epoxy resin composition which contains constituents [A], [B], and [C] and satisfies conditions (i) and (ii): [A] a tri- or higher functional epoxy resin; [B] an aromatic amine; [C] an imidazole compound; 0.20?b/a?0.60; and??(i) 0.002?c/a?0.014;??(ii) wherein a (mol) denotes the number of epoxy groups in 100 g of the epoxy resin composition, b (mol) denotes the number of active hydrogens contained in the constituent [B], and c (mol) denotes the number of imidazole rings contained in the constituent [C]).Type: ApplicationFiled: April 5, 2018Publication date: May 28, 2020Applicant: Toray Industries, Inc.Inventors: Kentaro Sano, Taiki Kuroda, Ayumi Mori, Toshiya Kamae -
Publication number: 20200109899Abstract: A heat transport device 1 includes a housing 2 with a hollow structure, working fluid 3 sealed in a sealed space of the housing 2, and a porous structure member 4 having a capillary structure disposed in the sealed space, and the housing 2 is configured to be rotatable around a rotation axis P by a motor as a drive source. The housing 2 includes an evaporation part S1 for vaporizing the working fluid 3 by heat from a heating element 5 and a condensation part S2 for condensing vapor to restore it to the working fluid 3, and the evaporation part S1 is provided on an outer side in the radial direction than the condensation part S2 with respect to the rotation axis P.Type: ApplicationFiled: May 22, 2018Publication date: April 9, 2020Inventors: Kentaro SANO, Masatoshi ARAI, Yusuke MATSUMOTO, Hiroshi SHIINA