Abstract: A displacement detection device includes a detection signal processor including a first differential amplifier a to output a first AC signal acquired by synthesizing a cosine function and a minus cosine function, a second differential amplifier to output a second AC signal acquired by synthesizing a sine function and a minus sine function, and a processor to determine, at least at a start of use of the displacement detection device, a value that substantially indicates a phase displacement amount between an excitation signal and the first AC signal and the second AC signal. When detecting displacement, the processor is configured or programmed to perform an arctangent computation using values of the first and second AC signals acquired at a timing based on the value that is determined, and output relative displacement information of a scale with respect to a magnetic detection head.

Abstract: A first LED with a first LED sidewall is disclosed. A second LED with a second LED sidewall facing the first LED sidewall is also disclosed. A first dynamic optical isolation material between the first LED sidewall and the second LED sidewall and configured to change an optical state based on a state trigger such that a light behavior at the first LED sidewall for a light emitted by one of the first LED and the second LED is determined by the optical state, is also disclosed.

Abstract: A light source includes an array of light emitters, with at least some light emitters having a central patterned surface and an unpatterned border; a light blocking metal layer positioned between each of the array of light emitters; and down-converter material positioned on each of the array of light emitters.

Abstract: An array of phosphor pixels is positioned on an array of semiconductor LED pixels with thermally curable adhesive between them. Selected LED pixels of the array are electrically activated; resulting heat cures the adhesive to attach the corresponding phosphor pixel to the activated LED pixel and to release the corresponding phosphor pixel from a carrier. Removal of the carrier removes unattached phosphor pixels, leaving behind phosphor pixels attached to the LED pixels that were activated. The process can be repeated for phosphor pixels of different colors.

Abstract: An array of phosphor pixels is positioned on an array of semiconductor LED pixels with thermally curable adhesive between them. Selected LED pixels of the array are electrically activated; resulting heat cures the adhesive to attach the corresponding phosphor pixel to the activated LED pixel and to release the corresponding phosphor pixel from a carrier. Removal of the carrier removes unattached phosphor pixels, leaving behind phosphor pixels attached to the LED pixels that were activated. The process can be repeated for phosphor pixels of different colors.

Abstract: A device including a phosphor layer having a plurality of holes or pockets arranged within the phosphor layer to reduce lateral light transmission. The phosphor layer can be sized and positioned to extend over a plurality of LED emitter pixels.

Abstract: A method includes depositing a layer comprising a photoinitiator and a curable material onto a surface and applying a nanoimprint mold on the layer of curable material to form a mesh comprising intersecting walls defining cavities. After applying the nanoimprint mold, the mesh is illuminated with light causing decarboxylation of the photoinitator to initiate curing of the curable material. After curing the curable material, the nanoimprint mold is removed and a wavelength converting material is deposited in the cavities to form an array of wavelength converting pixels.

Abstract: A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.

Abstract: A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.

Abstract: A method includes depositing a layer comprising a photoinitiator and a curable material onto a surface and applying a nanoimprint mold on the layer of curable material to form a mesh comprising intersecting walls defining cavities. After applying the nanoimprint mold, the mesh is illuminated with light causing decarboxylation of the photoinitiator to initiate curing of the curable material. After curing the curable material, the nanoimprint mold is removed and a wavelength converting material is deposited in the cavities to form an array of wavelength converting pixels.

Abstract: Described herein is a system and method for tuning light scatter in an optically functional porous layer of an LED. The layer comprises a non-light absorbing material structure having a plurality of sub-micron pores and a polymer matrix. The non-light absorbing material forms either a plurality of micron-sized porous particles dispersed throughout the layer or a mesh slab, wherein a plurality of sub-micron pores is located within each micron-sized porous particle or forms an interconnected network of sub-micron pores within the mesh slab, respectively. A polymer matrix, such as a high refractive index silicone fills the plurality of sub-micron pores creating an interface between the materials. Refractive index differences between the materials allow for light scatter to occur at the interface of the materials. Light scatter can also be decreased as a function of temperature, creating a system for tuning light scatter in both an off state and on state of an LED.

Abstract: A first LED with a first LED sidewall is disclosed. A second LED with a second LED sidewall facing the first LED sidewall is also disclosed. A first dynamic optical isolation material between the first LED sidewall and the second LED sidewall and configured to change an optical state based on a state trigger such that a light behavior at the first LED sidewall for a light emitted by one of the first LED and the second LED is determined by the optical state, is also disclosed.

Abstract: A device including a phosphor layer having a plurality of holes or pockets arranged within the phosphor layer to reduce lateral light transmission. The phosphor layer can be sized and positioned to extend over a plurality of LED emitter pixels.

Abstract: A first pixel with a first pixel sidewall is disclosed. A second pixel with a second pixel sidewall facing the first pixel sidewall is also disclosed. A first dynamic optical isolation material between the first pixel sidewall and the second pixel sidewall and configured to change an optical state based on a state trigger such that a light behavior at the first pixel sidewall for a light emitted by one of the first pixel and the second pixel is determined by the optical state, is also disclosed.

Abstract: A wavelength converting layer is partially diced to generate a first and second wavelength converting layer segment and to allow partial isolation between the first segment and the second segment such that the wavelength converting layer segments are connected by a connecting wavelength converting layer. The first and second wavelength converting layer segments are attached to a first and second light emitting device, respectively to create a first and second pixel. The connecting wavelength converting layer segment is removed to allow complete isolation between the first pixel and the second pixel. An optical isolation material is applied to exposed surfaces of the first and second pixel and a sacrificial portion of the wavelength converting layer segments and optical isolation material attached to the sacrificial portion is removed from a surface facing away from the first light emitting device, to expose a emitting surface of the first wavelength converting layer segment.

Abstract: A first pixel with a first pixel sidewall is disclosed. A second pixel with a second pixel sidewall facing the first pixel sidewall is also disclosed. A first dynamic optical isolation material between the first pixel sidewall and the second pixel sidewall and configured to change an optical state based on a state trigger such that a light behavior at the first pixel sidewall for a light emitted by one of the first pixel and the second pixel is determined by the optical state, is also disclosed.

Abstract: A device including a phosphor layer having a plurality of holes or pockets arranged within the phosphor layer to reduce lateral light transmission. The phosphor layer can be sized and positioned to extend over a plurality of LED emitter pixels.

Abstract: Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles or air voids. The pigments, light scattering particles, or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles, or air voids inhomogeneously distributed in the reflector. The side reflector can include phosphor particles.

Abstract: Sidewall reflectors disposed on the sidewalls of an LED or pcLED comprise porous (for example, hollow) high refractive index light scattering particles dispersed in a transparent binder. The porous particles exhibit a high refractive index contrast and corresponding strong scattering at the interfaces between the porous particle material and one or more pores in each particle. These sidewall reflectors can provide light confinement with thin reflector structures, allowing close spacing between LEDs and pcLEDs, and may be advantageously employed in microLED arrays.

Abstract: A wavelength converting layer is partially diced to generate a first and second wavelength converting layer segment and to allow partial isolation between the first segment and the second segment such that the wavelength converting layer segments are connected by a connecting wavelength converting layer. The first and second wavelength converting layer segments are attached to a first and second light emitting device, respectively to create a first and second pixel. The connecting wavelength converting layer segment is removed to allow complete isolation between the first pixel and the second pixel. An optical isolation material is applied to exposed surfaces of the first and second pixel and a sacrificial portion of the wavelength converting layer segments and optical isolation material attached to the sacrificial portion is removed from a surface facing away from the first light emitting device, to expose a emitting surface of the first wavelength converting layer segment.