Patents by Inventor Kentaro Yamada

Kentaro Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11217670
    Abstract: A characteristic of a semiconductor device having a back electrode including an Au—Sb alloy is improved. The semiconductor device has a semiconductor substrate and the back electrode including the Au—Sb alloy layer. The back electrode is formed on the semiconductor substrate. The Sb concentration in the Au—Sb alloy layer is equal to or greater than 15 wt %, and equal to or less than 37 wt %. The thickness of the Au—Sb alloy layer is equal to or larger than 20 nm, and equal to or less than 45 nm.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: January 4, 2022
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Yuji Takahashi, Masaki Watanabe, Masashi Sahara, Kentaro Yamada, Masaki Sakashita, Shinichi Maeda, Yoshiaki Yamada
  • Patent number: 11198087
    Abstract: Technology improving the effect of cleaning a filter by a high pressure air current is provided. A first dust collector 27 has a housing into which a gas carrying capture material is carried; a filter 240 having a filter element 305 that captures the capture material, and an opening 305b from which air passing through the filter element 305 flows out; and an injector having a nozzle with an injection opening that injects a gas, moves the nozzle to a position in contact with the opening, and injects the gas from the injection opening 305b when the nozzle is in contact with the opening 305b.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: December 14, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Kentaro Yamada
  • Patent number: 11154931
    Abstract: A manufacturing method for a three-dimensional formed object for manufacturing the three-dimensional formed object by stacking layers includes supplying a first forming material of the three-dimensional formed object to a contour region of the three-dimensional formed object in the layers, applying energy to the first forming material supplied to the contour region to solidify the first forming material, supplying a second forming material to a region corresponding to the three-dimensional formed object, the region being a contact region in contact with the contour region, and applying energy to the second forming material supplied to the contact region to solidify the second forming material.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: October 26, 2021
    Assignee: Seiko Epson Corporation
    Inventors: Masaya Ishida, Hajime Onishi, Eiji Okamoto, Kentaro Yamada
  • Patent number: 11143541
    Abstract: A sample container of a thermal analyzer that performs thermogravimetry or calorimetry includes a bottomed cylindrical body portion and a cover portion abutting against an opening of the body portion and covering at least a part of the opening. The cover portion includes a first cover portion abutting against an edge portion of the opening and having a second opening in a part of the first cover portion, and a second cover portion separated from the first cover portion in an axial direction of the body portion so as to cover at least a part of the second opening.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: October 12, 2021
    Assignee: Hitachi High-Tech Science Corporation
    Inventors: Kentaro Yamada, Yasuyuki Takagi
  • Patent number: 11123746
    Abstract: Provided are a shredder assuring greater freedom in designing a feedstock supplier that supplies sheets, and a sheet manufacturing apparatus. The shredder has a feedstock supplier having a supply opening through which a sheet is supplied; and a shredding device configured to shred the sheet supplied from the feedstock supplier. The shredding device includes a rotary cutter that rotates on a first axis, and a circulating cutter that moves in an endless path and cuts the sheet in conjunction with the rotary cutter. The circulating cutter includes a conveyor configured to convey the sheet from the feedstock supplier to the rotary cutter.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: September 21, 2021
    Assignee: Seiko Epson Corporation
    Inventor: Kentaro Yamada
  • Publication number: 20210252982
    Abstract: A control device controls a display device capable of displaying visual information for a passenger of a moving body, in two or more display regions. The control device causes adjacent target regions of the display regions to change from a display state in which the information is displayed to a display restricted state in which display is restricted, according to a predetermined order, when a predetermined condition is satisfied. The control device determines the target regions and the order, based on a traveling direction of the moving body at the time when the condition is satisfied or a traveling direction of the moving body that is predicted after the time when the condition is satisfied.
    Type: Application
    Filed: February 12, 2021
    Publication date: August 19, 2021
    Inventors: Yuji YASUI, Misako YOSHIMURA, Kentaro YAMADA, Nanami TSUKAMOTO
  • Publication number: 20210252981
    Abstract: An information processing device includes a display control unit which controls a display unit which can display an image of a character and a graphical user interface (GUI) which accepts an operation instruction for an apparatus. The information processing device includes an obtaining unit which obtains information indicating an operation content of an apparatus intended by a user. The display control unit determines the presentation duration for which a presentation image of the character operating the GUI is displayed based on the operation content and causes a display unit to display the presentation image for the presentation duration.
    Type: Application
    Filed: January 27, 2021
    Publication date: August 19, 2021
    Inventors: Yuji YASUI, Nanami TSUKAMOTO, Misako YOSHIMURA, Kentaro YAMADA, Hisashi ISHIMATSU
  • Publication number: 20210214356
    Abstract: The present disclosure provides a compound that is useful for the treatment and prophylaxis of rabies. The present disclosure provides a compound represented by formula XXIF or formula XXIB: wherein R1, R2A, R2B, R3, and R4 are defined in the specification, a solvent, or a pharmaceutically acceptable salt thereof, use of such a compound, solvate, or pharmaceutically acceptable salt thereof for the treatment or prophylaxis of rabies and cancer, a pharmaceutical composition comprising such a compound, solvate, or pharmaceutically acceptable salt thereof, and a method for the treatment or prophylaxis of rabies and cancer using the same.
    Type: Application
    Filed: February 14, 2020
    Publication date: July 15, 2021
    Inventors: Hiroyuki Kouji, Kentaro Yamada, Akira Kato, Toshimasa Ishizaki, Shigeru Matsuoka, Akira Nishizono, Tadashi Mishina, Atsushi Yoshimori
  • Patent number: 10903475
    Abstract: An energy storage apparatus includes: energy storage devices each including an external terminal, the energy storage devices being arranged in a first direction; a bus bar including a plate-like conductive portion; and a neighboring member disposed between the energy storage devices. The conductive portion includes: a fusible portion where a width size, which is a size in a second direction orthogonal to the first direction, is defined by a pair of edges, the width size being smaller than a width size of other portions of the conductive portion; and a pair of enlarged width portions contiguously formed with both sides of the fusible portion in the first direction, a width size of the pair of enlarged width portions increasing in a direction away from the fusible portion.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: January 26, 2021
    Assignees: GS YUASA INTERNATIONAL LTD., HONDA MOTOR CO., LTD.
    Inventors: Yosuke Nishimura, Yuta Yamamoto, Kentaro Yamada
  • Patent number: 10872813
    Abstract: To provide a semiconductor device capable of having improved adhesion between a plating film and a wiring layer. A method of manufacturing the semiconductor device includes a step of forming a wiring layer having a surface covered with an oxide film, a step of removing a portion of the oxide film by dry etching to form, in the oxide film, a first opening for exposing a portion of the wiring layer, a step of forming a passivation film covering the wiring layer, is provided with a second opening communicated with the first opening, and is made of an insulating resin material, and a step of growing a plating film on the wiring layer exposed from the first and second openings.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: December 22, 2020
    Assignee: Renesas Electronics Corporation
    Inventors: Mitsuhiro Sukegawa, Yoshinori Matsumuro, Toshikazu Hanawa, Kentaro Yamada
  • Patent number: 10847821
    Abstract: A temperature detecting device is equipped with an insertion hole structure for guiding a case which is inserted from outside into a holder that covers an outer wall of a battery cell, to the outer wall of the battery cell. In this insertion structure, a plurality of load distribution portions, specifically a first structure and a second structure, are formed at the periphery of an opening of an insertion hole. The load is generated upon abutment on a foreign matter that is about to enter through the insertion hole toward the battery cell. The load distribution portions distribute and release a load to the periphery of the opening.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: November 24, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Kentaro Yamada
  • Patent number: 10813414
    Abstract: In a cover of a buckle device, an engagement hook of a side wall of an upper cover is fit together with an engagement groove of a side wall of a lower cover to assemble the upper cover to the lower cover. When the side wall of the upper cover receives an external force, a holder of a buckle switch is sandwiched between a side plate of a buckle body and a rib of the lower cover such that the side plate receives the external force. Accordingly, the rigidity at the engagement hook of the cover is able to be increased.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: October 27, 2020
    Assignee: KABUSHIKI KAISHA TOKAI-RIKA-DENKI-SEISAKUSHO
    Inventors: Tomoya Yokoi, Tomotaka Suzuki, Takahiro Osaki, Akihito Kunisada, Kentaro Yamada
  • Publication number: 20200292431
    Abstract: A thermal analysis apparatus includes: a cylindrical heating furnace extending in an axial direction; a weight detector arranged on a rear-end side in the axial direction of the cylindrical heating furnace and including levers extending in the axial direction to detect a weight; a connecting portion for connecting the cylindrical heating furnace and the weight detector to communicate an internal space of the cylindrical heating furnace with an internal space of the weight detector and positioning the levers from the weight detector into the cylindrical heating furnace; sample holding portions connected to tip ends of the levers and arranged inside the cylindrical heating furnace and holding a sample; resistance heaters arranged to cover the weight detector and energized by an electric current of 6 A or less; and a heater control part for controlling an energization state of the resistance heaters to maintain the weight detector at a constant temperature.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 17, 2020
    Inventors: Takashi KUMAZAKI, Kentaro YAMADA
  • Publication number: 20200208348
    Abstract: A hopper includes a receiving member having a guide surface that guides a non-flat strip-shaped sheet and a posture adjusting unit that adjusts a posture of the falling sheet and sends it to the guide surface, and a discharge unit that discharges the sheet. The posture adjusting unit may have a posture adjusting surface continuous with the guide surface and bent from the guide surface so as to form a ridge line at a boundary portion with the guide surface.
    Type: Application
    Filed: December 26, 2019
    Publication date: July 2, 2020
    Inventor: Kentaro YAMADA
  • Publication number: 20200203491
    Abstract: A characteristic of a semiconductor device having a back electrode including an Au—Sb alloy is improved. The semiconductor device has a semiconductor substrate and the back electrode including the Au—Sb alloy layer. The back electrode is formed on the semiconductor substrate. The Sb concentration in the Au—Sb alloy layer is equal to or greater than 15 wt %, and equal to or less than 37 wt %. The thickness of the Au—Sb alloy layer is equal to or larger than 20 nm, and equal to or less than 45 nm.
    Type: Application
    Filed: December 20, 2019
    Publication date: June 25, 2020
    Inventors: Yuji TAKAHASHI, Masaki WATANABE, Masashi SAHARA, Kentaro YAMADA, Masaki SAKASHITA, Shinichi MAEDA, Yoshiaki YAMADA
  • Publication number: 20200200188
    Abstract: This fluid machine includes a motor housing, a rotating shaft which is inserted through the motor housing, an impeller which is mounted on a protruding portion of the rotating shaft, and a facing portion which faces the motor housing on a first end side in the axial direction. A first opening is provided on the first end side of the motor housing, a second opening is provided on a second end side of the motor housing, and an in-housing passage fluidly couples the first opening with the second opening. The fluid machine further includes an exhaust passage which is formed between the motor housing and the facing portion and which fluidly couples the first opening with external air, and a rotating blade which is disposed between the first opening and the exhaust passage, wherein the rotating blade is mounted on the rotating shaft and is rotatable with the rotating shaft.
    Type: Application
    Filed: March 4, 2020
    Publication date: June 25, 2020
    Inventors: Yosuke AKAMATSU, Gen KUWATA, Kentaro YAMADA
  • Publication number: 20200126853
    Abstract: To provide a semiconductor device capable of having improved adhesion between a plating film and a wiring layer. A method of manufacturing the semiconductor device includes a step of forming a wiring layer having a surface covered with an oxide film, a step of removing a portion of the oxide film by dry etching to form, in the oxide film, a first opening for exposing a portion of the wiring layer, a step of forming a passivation film covering the wiring layer, is provided with a second opening communicated with the first opening, and is made of an insulating resin material, and a step of growing a plating film on the wiring layer exposed from the first and second openings.
    Type: Application
    Filed: December 20, 2019
    Publication date: April 23, 2020
    Inventors: Mitsuhiro SUKEGAWA, Yoshinori MATSUMURO, Toshikazu HANAWA, Kentaro YAMADA
  • Patent number: 10586777
    Abstract: To improve the reliability of a semiconductor device. The semiconductor device includes a plurality of wiring layers formed on a semiconductor substrate, a pad formed on an uppermost wiring layer of the plurality of wiring layers, a surface protection film which includes an opening on the pad and is made of an inorganic insulating film, a rewiring formed on the surface protection film; a pad electrode formed on the rewiring, and a wire connected to the pad electrode. The rewiring includes a pad electrode mounting portion on which the pad electrode is mounted, a connection portion which is connected to the pad, and an extended wiring portion which couples the pad electrode mounting portion and the connection portion, and the pad electrode mounting portion has a rectangular shape when seen in a plan view.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: March 10, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kentaro Yamada, Shigeki Tomaru, Taketoshi Fukushima
  • Publication number: 20200030810
    Abstract: Provided are a shredder assuring greater freedom in designing a feedstock supplier that supplies sheets, and a sheet manufacturing apparatus. The shredder has a feedstock supplier having a supply opening through which a sheet is supplied; and a shredding device configured to shred the sheet supplied from the feedstock supplier. The shredding device includes a rotary cutter that rotates on a first axis, and a circulating cutter that moves in an endless path and cuts the sheet in conjunction with the rotary cutter. The circulating cutter includes a conveyor configured to convey the sheet from the feedstock supplier to the rotary cutter.
    Type: Application
    Filed: July 25, 2019
    Publication date: January 30, 2020
    Inventor: Kentaro YAMADA
  • Patent number: 10401342
    Abstract: Disclosed herein are an evolved gas analyzer and a method for analyzing evolved gas, the apparatus cooling a sample holder in a short time without using excessive cooling performance and without providing the entire apparatus in an excessively large size, thereby enhancing analysis work efficiency. The apparatus 200 includes: a sample holder 20 holding a sample S; a heating unit 10 receiving the sample holder therein, and evolving a gas component G by heating the sample; a detecting means 110 detecting the gas component; a sample holder supporting unit 204L movably supporting the sample holder to move the sample holder to predetermined outer and inner positions of the heating unit; and a cooling unit 30 provided at an outside of the heating unit, and cooling the sample holder by being in direct or indirect contact with the sample holder, when the sample holder is moved to a discharging position.
    Type: Grant
    Filed: November 19, 2016
    Date of Patent: September 3, 2019
    Assignee: HITACHI HIGH-TECH SCIENCE CORPORATION
    Inventors: Hideyuki Akiyama, Kentaro Yamada, Toshitada Takeuchi