Patents by Inventor Kenya Ito

Kenya Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10307656
    Abstract: A swing diagnosis apparatus includes a level calculation section that calculates a level on the basis of a relationship between an incidence angle of a ball hitting portion of an exercise appliance at impact, and an inclination of the ball hitting portion of the exercise appliance at impact.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: June 4, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Tsuyoshi Ito, Kenya Kodaira, Norihisa Hagiwara, Kazuhiro Ito
  • Patent number: 10300332
    Abstract: An electronic apparatus includes a processor that calculates identification data indicating a region in which a ball hitting portion of an exercise appliance is included at each of a plurality of timings during a swing of the exercise appliance, of a plurality of regions to which the identification data is allocated in advance, and displays the identification data to a user.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: May 28, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Tsuyoshi Ito, Kenya Kodaira
  • Patent number: 10286285
    Abstract: A display method includes acquiring first attitude information of the hands of a subject holding an exercise equipment during standing still on the basis of an output from an inertial sensor (sensor unit) which measures a swing action of the subject (user) performing a swing with the exercise equipment (golf club) and is attached to at least one of the exercise equipment and the subject, acquiring second attitude information of the hands of the subject holding the exercise equipment at impact on the basis of an output from the inertial sensor, and displaying at least one of the first attitude information and the second attitude information.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: May 14, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Tsuyoshi Ito, Kazuhiro Shibuya, Kenya Kodaira
  • Patent number: 10286282
    Abstract: A swing diagnosis method includes a procedure of performing diagnosis of a plurality of items including a first item regarding at least one of a backswing and a downswing, and a second item regarding impact on the basis of data regarding a swing, and a procedure of outputting diagnosis information on the basis of the plurality of items.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: May 14, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Tsuyoshi Ito, Kenya Kodaira, Norihisa Hagiwara, Kazuhiro Ito
  • Publication number: 20190054594
    Abstract: A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.
    Type: Application
    Filed: June 8, 2018
    Publication date: February 21, 2019
    Applicant: Ebara Corporation
    Inventors: Masayuki NAKANISHI, Yu ISHII, Kenya ITO, Keisuke UCHIYAMA, Makoto KASHIWAGI
  • Publication number: 20180371302
    Abstract: The present invention aims to provide a sealant for sealing liquid crystal and a liquid crystal display device, which can sufficiently reduce image sticking and stains at the periphery of a liquid crystal display. The sealant for sealing liquid crystal of the present invention contains a curable resin and a radical polymerization initiator, wherein the radical polymerization initiator contains a silsesquioxane group. The silsesquioxane group is preferably a group represented by the following formula (I) or (II): wherein R1s are the same as or different from each other and each represent a monovalent organic group; R2 represents a divalent linking group; R3s are the same as or different from each other and each represent a monovalent organic group; and R4 represents a divalent linking group.
    Type: Application
    Filed: November 24, 2016
    Publication date: December 27, 2018
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: MASANOBU MIZUSAKI, HIROSHI TSUCHIYA, KENYA ITO
  • Patent number: 10155294
    Abstract: A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: December 18, 2018
    Assignee: Ebara Corporation
    Inventors: Masaya Seki, Tetsuji Togawa, Kenya Ito
  • Patent number: 10134614
    Abstract: A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing controller (54) processes the electric signal of the reflected light to decide the state of the peripheral portion (30). The state of the peripheral portion being polished is monitored. Moreover, the polish end point is detected. A transmission wave other than the laser light may also be used. The peripheral portion (30) may also be enclosed by a passage forming member thereby to form a passage properly. The peripheral portion can be properly measured even in the situation where the liquid is flowing on the substrate peripheral portion.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: November 20, 2018
    Assignee: Ebara Corporation
    Inventors: Mitsuo Tada, Yasunari Suto, Hirofumi Ichihara, Kenya Ito, Tamami Takahashi
  • Publication number: 20180254196
    Abstract: A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.
    Type: Application
    Filed: March 1, 2018
    Publication date: September 6, 2018
    Inventors: Yu ISHII, Kenya ITO, Keisuke UCHIYAMA, Masayuki NAKANISHI
  • Patent number: 10022799
    Abstract: The present invention provides a method for producing a silver powder, the method being capable of producing a silver powder with high productivity and at low cost, the silver powder having an average particle diameter of 0.3 to 2.0 ?m and a narrow particle size distribution, and provides a silver powder produced by the production method. According to the present invention, the method for producing a silver powder includes: quantitatively and continuously supplying each of a silver solution containing a silver complex and a reductant solution to a flow path; and quantitatively and continuously reducing a silver complex in a reaction solution obtained by mixing the silver solution with the reductant solution in the flow path, wherein the reaction solution is made to contain a dispersant, and also a silver concentration in the reaction solution is adjusted to be in a range of 5 to 75 g/L.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: July 17, 2018
    Assignee: SUMITOMO METAL MINING CO., LTD.
    Inventors: Yoshihiro Okabe, Kenya Ito, Shuuji Okada, Masamu Nishimoto, Akihiro Murakami, Shintaro Ishikawa
  • Patent number: 10016875
    Abstract: A method for fabricating an abrasive firm includes preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin, and drying the paint to form a first layer. The method further includes coating the first layer with a second paint which contains the abrasive grains and the binder resin, and drying the paint to form a second layer. The method further includes heating the first layer and the second layer for imidization.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: July 10, 2018
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Hiroyuki Kawasaki, Masayuki Nakanishi, Kenya Ito
  • Publication number: 20180169822
    Abstract: A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.
    Type: Application
    Filed: January 29, 2018
    Publication date: June 21, 2018
    Applicant: Ebara Corporation
    Inventors: Masaya Seki, Tetsuji Togawa, Kenya Ito
  • Publication number: 20180094164
    Abstract: A laminated film appropriate as a PPF material which has a three-layer structure in which a top coating layer including a urethane acrylate cured product, a substrate layer including polycarbonate thermoplastic polyurethane, and an adhesive layer including a pressure sensitive adhesive are in contact in that order. Preferably, the top coating layer includes a unit derived from ?-methacryloxypropylhepta(trifluoropropyl)-T8-silsesquioxane.
    Type: Application
    Filed: September 30, 2017
    Publication date: April 5, 2018
    Applicant: JNC CORPORATION
    Inventors: Kenya ITO, Hiroyuki IIZUKA, Shino SATO, Yasuhiro SHIRAISHI
  • Publication number: 20180086882
    Abstract: Provided is a coating agent that can be formed into a surface layer having excellent self-restoring properties and stain-proof properties by applying the coating agent onto a surface of a base material (for example, thermoplastic polyurethane) and curing the resulting material. The coating agent according to the present application contains urethane (meth)acrylate-based resin (a), fluorine-based compound (b) and photopolymerization initiator (d). Urethane (meth)acrylate-based resin (a) has weight average molecular weight (Mw) of 10,000 to 800,000. Fluorine-based compound (b) has at least two polymerizable functional groups. The surface layer formed of the coating agent has excellent self-restoring properties of a scratch, stain-proof properties and stretchability.
    Type: Application
    Filed: March 29, 2016
    Publication date: March 29, 2018
    Applicant: JNC CORPORATION
    Inventors: Kyoko KONDO, Kenya ITO, Hiroyuki IIZUKA, Aki KUROMATSU
  • Publication number: 20180076043
    Abstract: A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.
    Type: Application
    Filed: September 11, 2017
    Publication date: March 15, 2018
    Inventors: Kenya ITO, Masaya SEKI, Kenichi KOBAYASHI, Michiyoshi YAMASHITA
  • Patent number: 9914196
    Abstract: A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: March 13, 2018
    Assignee: Ebara Corporation
    Inventors: Masaya Seki, Tetsuji Togawa, Kenya Ito
  • Patent number: 9821429
    Abstract: A polishing pad for polishing a workpiece to a mirror finish is attached to a rotatable polishing table of a chemical mechanical polishing apparatus. The workpiece, such as a metal body, is held by a carrier and pressed against the polishing pad. This polishing pad includes: an elastic pad having a polishing surface; a deformable base layer that supports the elastic pad; and an adhesive layer that joins the elastic pad to the base layer.
    Type: Grant
    Filed: May 10, 2013
    Date of Patent: November 21, 2017
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Kenya Ito, Shozo Takahashi, Mika Suzuki
  • Patent number: 9808836
    Abstract: There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: November 7, 2017
    Assignee: EBARA CORPORATION
    Inventors: Tetsuji Togawa, Kenya Ito, Yu Ishii, Keisuke Uchiyama
  • Patent number: 9808903
    Abstract: A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: November 7, 2017
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Kenya Ito, Masayuki Nakanishi, Tetsuji Togawa
  • Patent number: D845568
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: April 9, 2019
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Kenya Ito, Hirohiko Ueda