Patents by Inventor Kenya Ito

Kenya Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240339440
    Abstract: Provided is a method of producing a micro-LED panel that can produce a micro-LED panel with excellent display quality by reducing misalignment of micro-LED chips and can achieve an increased yield. The method of producing a micro-LED panel includes: producing a micro-LED chip including a micro-LED, a first contact electrode, and a light blocking component; producing an array substrate including a switching element, a second contact electrode, and an insulating film; and placing the micro-LED chip on the array substrate. The light blocking component includes a bump with an inclined surface. The insulating film includes a dent with an inclined surface. The placing of the micro-LED chip includes electrically connecting the first contact electrode to the second contact electrode by making the bump of the light blocking component opposite to the dent of the insulating film.
    Type: Application
    Filed: March 13, 2024
    Publication date: October 10, 2024
    Inventors: Kenya ITO, Yoshiyuki HARUMOTO
  • Publication number: 20240159659
    Abstract: Efficient acquisition of information to adjust a cooking environment for providing a fried food with good taste is realized by determining the cooking environment in advance based on a state of edible oil. A determination device for determining a cooking environment of an edible oil, comprising: an imaging section configured to acquire an image in which the edible oil is captured; a first input section configured to input first information which is information on a fried food to be fed into the edible oil and cooked; a first identification section configured to analyze the image and identify a state of the edible oil; and a second identification section configured to identify the cooking environment in which the fried food is to be cooked based on the first information and the state.
    Type: Application
    Filed: March 11, 2022
    Publication date: May 16, 2024
    Inventors: Kenya ITO, Takeshi SUZUKI, Masami INOUE, Ryohei WATANABE, Ayato TAKASAKI, Kenichi KAKIMOTO
  • Publication number: 20230317501
    Abstract: The present invention relates to a tape sticking system for sticking a protective tape for protecting a peripheral portion of a substrate, such as a wafer. The tape sticking apparatus (10) includes a substrate holder (21) for sticking, a side roller (43), a first roller (46), a second roller (47), a roller-driving motor (49) coupled to the second roller (47), and a nipping mechanism (60) for nipping the peripheral portion of the substrate (W) with the first roller (46) and the second roller (47). The tape sticking apparatus (10) is configured to cause the second roller (47) to be rotated by use of the roller-driving motor (49) while nipping the peripheral portion of the substrate, held to the substrate holder (21) for sticking, with the first roller (46) and the second roller (47), to thereby rotate the substrate.
    Type: Application
    Filed: August 4, 2021
    Publication date: October 5, 2023
    Inventors: Kenya ITO, Takumi YAMADA, Mahito SHIBUYA, Daisuke NAGUMO
  • Patent number: 11446784
    Abstract: The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: September 20, 2022
    Assignees: EBARA CORPORATION, FUJIMI INCORPORATED
    Inventors: Yu Ishii, Kenya Ito, Hitoshi Morinaga, Kazusei Tamai, Shingo Ohtsuki, Hiroshi Asano
  • Patent number: 11396714
    Abstract: To stably convey a substrate (workpiece) while suppressing the workpiece from bending. A treatment device is provided. This treatment device includes: a conveying part that conveys a workpiece in a state where a flat surface of the workpiece is inclined around a conveying directional axis relative to a horizontal plane; and a treatment part in which at least one of polishing and cleaning is performed on the flat surface of the workpiece, wherein the conveying part has a drive part configured to be brought into physical contact with an end part of the workpiece and apply force in a conveying direction to the workpiece, a first Bernoulli chuck arranged to face the flat surface of the workpiece, and a second Bernoulli chuck arranged to face an end face of an opposite end part to the end part of the workpiece.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: July 26, 2022
    Assignee: EBARA CORPORATION
    Inventors: Kenya Ito, Hirohiko Ueda
  • Patent number: 11192147
    Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: December 7, 2021
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Hiroyuki Kawasaki, Kenichi Nagaoka, Kenya Ito
  • Publication number: 20210138769
    Abstract: A laminated film preferable as a PPF material. The laminated film is formed, in which a coating layer formed of a cured material of a photopolymerizable coating liquid, a base material layer formed of thermoplastic polyurethane, and an adhesive layer formed of a pressure sensitive adhesive are formed in contact with each other in the order, the photopolymerizable coating liquid is composed of component (a): urethane acrylate and component (b): photopolymerizable acrylic compounds having no urethane unit and containing a fluorine atom, and component (a) and component (b) are mixed at a proportion of (a): 20% by weight or more and less than 50% by weight and (b): 50% by weight or more and less than 80% by weight, based on 100 parts by weight of the photopolymerizable coating liquid.
    Type: Application
    Filed: May 25, 2018
    Publication date: May 13, 2021
    Applicant: JNC CORPORATION
    Inventors: Shino SATO, KENYA ITO, HIROYUKI IIZUKA
  • Patent number: 10926376
    Abstract: A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: February 23, 2021
    Assignee: Ebara Corporation
    Inventors: Masayuki Nakanishi, Yu Ishii, Kenya Ito, Keisuke Uchiyama, Makoto Kashiwagi
  • Patent number: 10854473
    Abstract: A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: December 1, 2020
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Kenya Ito, Keisuke Uchiyama, Masayuki Nakanishi
  • Patent number: 10799917
    Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: October 13, 2020
    Assignees: EBARA CORPORATION, Toshiba Memory Corporation
    Inventors: Yu Ishii, Hiroyuki Kawasaki, Kenichi Nagaoka, Kenya Ito, Masako Kodera, Hiroshi Tomita, Takeshi Nishioka
  • Publication number: 20200298540
    Abstract: The problem is to produce automotive interior and exterior parts that are excellent in performance and designability. The means for solving the problem is a surface-modified film for automotive interior and exterior parts, in which a surface protective layer is laminated on one side of a polycarbonate base material film, the surface protective layer is a cured product of a photopolymerizable urethane acrylate composition, the photopolymerizable urethane acrylate composition contains photopolymerizable urethane acrylate mixture (A), photopolymerization initiator (C), and further, when necessary, filler (B), and component (A) contains photopolymerizable urethane acrylic polymer (a1), polyfunctional acrylate compound (a2), fluorine-containing photopolymerizable acrylic compound (a3) and photopolymerizable acrylate oligomer having a fluorosilsesquioxane derivative unit (a4).
    Type: Application
    Filed: October 9, 2018
    Publication date: September 24, 2020
    Applicant: JNC CORPORATION
    Inventors: Shino SATO, KENYA ITO
  • Patent number: 10739647
    Abstract: The present invention aims to provide a sealant for sealing liquid crystal and a liquid crystal display device, which can sufficiently reduce image sticking and stains at the periphery of a liquid crystal display. The sealant for sealing liquid crystal of the present invention contains a curable resin and a radical polymerization initiator, wherein the radical polymerization initiator contains a silsesquioxane group. The silsesquioxane group is preferably a group represented by the following formula (I) or (II): wherein R1s are the same as or different from each other and each represent a monovalent organic group; R2 represents a divalent linking group; R3s are the same as or different from each other and each represent a monovalent organic group; and R4 represents a divalent linking group.
    Type: Grant
    Filed: November 24, 2016
    Date of Patent: August 11, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Masanobu Mizusaki, Hiroshi Tsuchiya, Kenya Ito
  • Patent number: 10696865
    Abstract: A laminated film appropriate as a PPF material which has a three-layer structure in which a top coating layer including a urethane acrylate cured product, a substrate layer including polycarbonate thermoplastic polyurethane, and an adhesive layer including a pressure sensitive adhesive are in contact in that order. Preferably, the top coating layer includes a unit derived from ?-methacryloxypropylhepta(trifluoropropyl)-T8-silsesquioxane.
    Type: Grant
    Filed: September 30, 2017
    Date of Patent: June 30, 2020
    Assignee: JNC CORPORATION
    Inventors: Kenya Ito, Hiroyuki Iizuka, Shino Sato, Yasuhiro Shiraishi
  • Publication number: 20200095380
    Abstract: Provided is a coating agent that can be formed into a surface layer having excellent self-restoring properties and stain-proof properties by applying the coating agent onto a surface of a base material (for example, thermoplastic polyurethane) and curing the resulting material. The coating agent according to the present application contains urethane (meth)acrylate-based resin (a), fluorine-based compound (b) and photopolymerization initiator (d). Urethane (meth)acrylate-based resin (a) has weight average molecular weight (Mw) of 10,000 to 800,000. Fluorine-based compound (b) has at least two polymerizable functional groups. The surface layer formed of the coating agent has excellent self-restoring properties of a scratch, stain-proof properties and stretchability.
    Type: Application
    Filed: November 27, 2019
    Publication date: March 26, 2020
    Applicant: JNC CORPORATION
    Inventors: KYOKO KONDO, KENYA ITO, HIROYUKI IIZUKA, AKI KUROMATSU
  • Patent number: 10513586
    Abstract: Provided is a coating agent that can be formed into a surface layer having excellent self-restoring properties and stain-proof properties by applying the coating agent onto a surface of a base material (for example, thermoplastic polyurethane) and curing the resulting material. The coating agent according to the present application contains urethane (meth)acrylate-based resin (a), fluorine-based compound (b) and photopolymerization initiator (d). Urethane (meth)acrylate-based resin (a) has weight average molecular weight (Mw) of 10,000 to 800,000. Fluorine-based compound (b) has at least two polymerizable functional groups. The surface layer formed of the coating agent has excellent self-restoring properties of a scratch, stain-proof properties and stretchability.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: December 24, 2019
    Assignee: JNC CORPORATION
    Inventors: Kyoko Kondo, Kenya Ito, Hiroyuki Iizuka, Aki Kuromatsu
  • Publication number: 20190376203
    Abstract: To stably convey a substrate (workpiece) while suppressing the workpiece from bending. A treatment device is provided. This treatment device includes: a conveying part that conveys a workpiece in a state where a flat surface of the workpiece is inclined around a conveying directional axis relative to a horizontal plane; and a treatment part in which at least one of polishing and cleaning is performed on the flat surface of the workpiece, wherein the conveying part has a drive part configured to be brought into physical contact with an end part of the workpiece and apply force in a conveying direction to the workpiece, a first Bernoulli chuck arranged to face the flat surface of the workpiece, and a second Bernoulli chuck arranged to face an end face of an opposite end part to the end part of the workpiece.
    Type: Application
    Filed: September 12, 2017
    Publication date: December 12, 2019
    Applicant: EBARA CORPORATION
    Inventors: Kenya ITO, Hirohiko UEDA
  • Patent number: 10449705
    Abstract: The transfer film for in-mold molding of the invention has transfer layer 11 being a transfer layer to be transferred onto a transfer object in in-mold molding and cured by irradiation with an active energy ray after being transferred; and film-like base L0. Transfer layer 11 has topcoat layer L2 laminated on base L0 to be arranged on a surface of a molded product after in-mold molding; and conductor layer L4 laminated on a side opposite to a base L0 side of topcoat layer L2, and laminated on topcoat layer L2. Topcoat layer L2 is composed of a mixed composition containing an active energy ray-curable resin and a thermosetting resin, and conductor layer L4 is formed of at least one kind selected from the group of a flexible metal, carbon and conductive polymer.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: October 22, 2019
    Assignee: JNC CORPORATION
    Inventors: Kenya Ito, Koji Ohguma
  • Patent number: 10403505
    Abstract: A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: September 3, 2019
    Assignee: EBARA CORPORATION
    Inventors: Kenya Ito, Masaya Seki, Kenichi Kobayashi, Michiyoshi Yamashita
  • Publication number: 20190262968
    Abstract: The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Inventors: Yu ISHII, Kenya ITO, Hitoshi MORINAGA, Kazusei TAMAI, Shingo OHTSUKI, Hiroshi ASANO
  • Publication number: 20190262869
    Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.
    Type: Application
    Filed: May 7, 2019
    Publication date: August 29, 2019
    Inventors: Yu Ishii, Hiroyuki Kawasaki, Kenichi Nagaoka, Kenya Ito, Masako Kodera, Hiroshi Tomita, Takeshi Nishioka