Patents by Inventor Kenya Kawabata
Kenya Kawabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11933543Abstract: A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.Type: GrantFiled: October 21, 2022Date of Patent: March 19, 2024Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Kenya Kawabata, Masahiro Meguro, Ryo Tsubata, Hirofumi Aoki, Yoshikatsu Inagaki, Hiroshi Sakai, Hideaki Kawabata
-
Patent number: 11867467Abstract: A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.Type: GrantFiled: June 23, 2021Date of Patent: January 9, 2024Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Shinichi Ito, Masahiro Meguro, Kenya Kawabata, Yoshikatsu Inagaki
-
Publication number: 20230324091Abstract: The evaporation unit structure of a heat transport member that is an evaporation unit structure of the heat transport member in which a container including an internal space in which the working fluid is enclosed includes an evaporation unit in which the working fluid in a liquid phase changes in phase, and a condensation unit in which the working fluid in a gas phase changes in phase, wherein a sintered body layer is provided on an inner surface of the evaporation unit, the sintered body layer with an average thickness n is composed of a first site that is a region of n/2 on an inner surface side of the container, and a second site that is a region of n/2 on the internal space side, and a percentage of voids of the first site is less than a percentage of voids of the second site.Type: ApplicationFiled: June 13, 2023Publication date: October 12, 2023Applicant: Furukawa Electric Co., Ltd.Inventors: Hirofumi AOKI, Kenya KAWABATA, Hideaki KAWABATA, Yoshinori NAKAMURA
-
Publication number: 20230269910Abstract: A vapor chamber including a container having a cavity portion formed inside, and including a first surface and a second surface opposing the first surface, a working fluid sealed in the cavity portion, and a vapor flow path through which the working fluid in a gas phase flows, the vapor flow path being provided in the cavity portion, wherein a container inner surface area increasing unit including a protruding part is formed on an inner surface of the first surface, and a first wick structure is provided on a surface of the protruding part.Type: ApplicationFiled: April 27, 2023Publication date: August 24, 2023Applicant: Furukawa Electric Co., Ltd.Inventors: Kenya KAWABATA, Yoshikatsu INAGAKI, Hirofumi AOKI, Hiroshi OKADA, Yosuke WATANABE, Hideaki KAWABATA
-
Patent number: 11725883Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.Type: GrantFiled: October 28, 2022Date of Patent: August 15, 2023Assignee: Furukawa Electric Co., Ltd.Inventors: Yasuyuki Tochigi, Masahiro Meguro, Hiroshi Sakai, Kenya Kawabata
-
Publication number: 20230106794Abstract: A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.Type: ApplicationFiled: October 21, 2022Publication date: April 6, 2023Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Kenya Kawabata, Masahiro Meguro, Ryo Tsubata, Hirofumi Aoki, Yoshikatsu Inagaki, Hiroshi Sakai, Hideaki Kawabata
-
Publication number: 20230102800Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.Type: ApplicationFiled: October 28, 2022Publication date: March 30, 2023Applicant: Furukawa Electric Co., Ltd.Inventors: Yasuyuki TOCHIGI, Masahiro MEGURO, Hiroshi SAKAI, Kenya KAWABATA
-
Patent number: 11543189Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.Type: GrantFiled: July 21, 2020Date of Patent: January 3, 2023Assignee: Furukawa Electric Co., Ltd.Inventors: Yasuyuki Tochigi, Masahiro Meguro, Hiroshi Sakai, Kenya Kawabata
-
Patent number: 11337336Abstract: A cooling device including a container to which at least one heating element is thermally connected, a primary refrigerant, and a condensation tube through which a secondary refrigerant flows, wherein a container inner surface area increasing portion is formed on an inner surface of the container to which the heating element is thermally connected, and a plate-shaped member is provided, that includes a shielding portion that is located above the container inner surface area increasing portion in a direction of gravity and below the condensation tube in the direction of gravity, with at least a part of the shielding portion not immersed in the primary refrigerant in a liquid phase, and the plate-shaped member includes a support portion extending from the shielding portion, in a part of a periphery along an orthogonal direction to the direction of gravity, of the container inner surface area increasing portion.Type: GrantFiled: June 24, 2021Date of Patent: May 17, 2022Assignee: Furukawa Electric Co., Ltd.Inventors: Hirofumi Aoki, Yoshikatsu Inagaki, Kenya Kawabata, Yoshinori Nakamura
-
Publication number: 20220128314Abstract: The disclosure provides a vapor chamber that has excellent fixing stability of a wick structure inside a container and also has excellent circulation properties for a liquid-phase working fluid due to excellent capillary force of the wick structure. The vapor chamber includes a container in which a cavity portion is formed by one plate-shaped body and another plate-shaped body facing the one plate-shaped body, a working fluid enclosed in the cavity portion, and a wick structure contained in the cavity portion and welded to the container so that a welded portion is formed in the wick structure.Type: ApplicationFiled: January 7, 2022Publication date: April 28, 2022Applicant: Furukawa Electric Co., Ltd.Inventors: Yoshikatsu INAGAKI, Kenya KAWABATA, Hirofumi AOKI
-
Publication number: 20220132697Abstract: A vapor chamber is provided that allows space-saving and weight reduction of a device in which the vapor chamber is to be mounted. The vapor chamber has a container in which a cavity portion is formed by one plate-shaped body and another plate-shaped body facing the one plate-shaped body, and a working fluid enclosed in the cavity portion. The container includes a heat transfer portion that transfers heat by a phase change of the working fluid, and an extending portion that extends outwards from the heat transfer portion and has a function other than a heat transfer function.Type: ApplicationFiled: January 7, 2022Publication date: April 28, 2022Applicant: Furukawa Electric Co., Ltd.Inventors: Yoshikatsu INAGAKI, Kenya KAWABATA, Hirofumi AOKI
-
Patent number: 11287192Abstract: Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.Type: GrantFiled: October 4, 2016Date of Patent: March 29, 2022Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yasuyuki Tochigi, Hung Wei Tseng, Kuang Yu Chu, Masahiro Meguro, Kenya Kawabata
-
Publication number: 20220046825Abstract: The vapor chamber includes a container having a cavity formed of one plate-shaped body to which a heating element is thermally connected and another plate-shaped body facing the one plate-shaped body, a working fluid enclosed in the cavity, and a wick structure that is enclosed in the cavity and separated from the container. The container includes a support part protruding from an inner surface of the other plate-shaped body toward the one plate-shaped body, the support part being formed of a recessed part provided to an outer surface of the other plate-shaped body. At the rising base portion of the support part from the inner surface of the other plate-shaped body, the defined angle between the support part and the inner surface of the other plate-shaped body is an obtuse angle.Type: ApplicationFiled: October 22, 2021Publication date: February 10, 2022Applicant: Furukawa Electric Co., Ltd.Inventors: Yoshikatsu INAGAKI, Kenya KAWABATA, Hirofumi AOKI
-
Patent number: 11246239Abstract: The present disclosure provides a heatsink that can improve heat radiation efficiency of a heat radiating fin and equalize a heat input in a heat receiving portion while securing sufficient volumes of the heat receiving portion, a heat insulating portion, and a heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a width direction of the heatsink is limited.Type: GrantFiled: September 21, 2020Date of Patent: February 8, 2022Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
-
Patent number: 11150028Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.Type: GrantFiled: February 21, 2020Date of Patent: October 19, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Shinichi Ito, Masahiro Meguro, Kenya Kawabata
-
Publication number: 20210321538Abstract: A cooling device including a container to which at least one heating element is thermally connected, a primary refrigerant, and a condensation tube through which a secondary refrigerant flows, wherein a container inner surface area increasing portion is formed on an inner surface of the container to which the heating element is thermally connected, and a plate-shaped member is provided, that includes a shielding portion that is located above the container inner surface area increasing portion in a direction of gravity and below the condensation tube in the direction of gravity, with at least a part of the shielding portion not immersed in the primary refrigerant in a liquid phase, and the plate-shaped member includes a support portion extending from the shielding portion, in a part of a periphery along an orthogonal direction to the direction of gravity, of the container inner surface area increasing portion.Type: ApplicationFiled: June 24, 2021Publication date: October 14, 2021Applicant: Furukawa Electric Co., Ltd.Inventors: Hirofumi AOKI, Yoshikatsu INAGAKI, Kenya KAWABATA, Yoshinori NAKAMURA
-
Publication number: 20210318072Abstract: A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.Type: ApplicationFiled: June 23, 2021Publication date: October 14, 2021Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Shinichi ITO, Masahiro MEGURO, Kenya KAWABATA, Yoshikatsu INAGAKI
-
Patent number: 11112186Abstract: A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; and a heat radiating fin group which is connected to a heat radiating portion of the heat transport member and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to the heat radiating portion and that is filled with a working fluid, a heat receiving portion inner surface area increasing portion and a supporting member are provided in an internal space of the heat receiving portion, and the supporting member is in surface contact with the heat receiving portion inner surface area increasing portion.Type: GrantFiled: September 2, 2020Date of Patent: September 7, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
-
Patent number: 11085703Abstract: The present disclosure is to provide a heatsink that can improve heat radiation performance of a heat radiating fin while preventing dry-out of a heat receiving portion and that can equalize a heat input in the heat receiving portion in an environment in which an installation space of the heatsink is limited even when a forbidden region exists in the installation space.Type: GrantFiled: September 2, 2020Date of Patent: August 10, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
-
Patent number: 10996001Abstract: The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited.Type: GrantFiled: September 1, 2020Date of Patent: May 4, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura