Patents by Inventor Kenya Kawabata

Kenya Kawabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11933543
    Abstract: A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.
    Type: Grant
    Filed: October 21, 2022
    Date of Patent: March 19, 2024
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kenya Kawabata, Masahiro Meguro, Ryo Tsubata, Hirofumi Aoki, Yoshikatsu Inagaki, Hiroshi Sakai, Hideaki Kawabata
  • Patent number: 11867467
    Abstract: A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: January 9, 2024
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shinichi Ito, Masahiro Meguro, Kenya Kawabata, Yoshikatsu Inagaki
  • Publication number: 20230324091
    Abstract: The evaporation unit structure of a heat transport member that is an evaporation unit structure of the heat transport member in which a container including an internal space in which the working fluid is enclosed includes an evaporation unit in which the working fluid in a liquid phase changes in phase, and a condensation unit in which the working fluid in a gas phase changes in phase, wherein a sintered body layer is provided on an inner surface of the evaporation unit, the sintered body layer with an average thickness n is composed of a first site that is a region of n/2 on an inner surface side of the container, and a second site that is a region of n/2 on the internal space side, and a percentage of voids of the first site is less than a percentage of voids of the second site.
    Type: Application
    Filed: June 13, 2023
    Publication date: October 12, 2023
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Hirofumi AOKI, Kenya KAWABATA, Hideaki KAWABATA, Yoshinori NAKAMURA
  • Publication number: 20230269910
    Abstract: A vapor chamber including a container having a cavity portion formed inside, and including a first surface and a second surface opposing the first surface, a working fluid sealed in the cavity portion, and a vapor flow path through which the working fluid in a gas phase flows, the vapor flow path being provided in the cavity portion, wherein a container inner surface area increasing unit including a protruding part is formed on an inner surface of the first surface, and a first wick structure is provided on a surface of the protruding part.
    Type: Application
    Filed: April 27, 2023
    Publication date: August 24, 2023
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Kenya KAWABATA, Yoshikatsu INAGAKI, Hirofumi AOKI, Hiroshi OKADA, Yosuke WATANABE, Hideaki KAWABATA
  • Patent number: 11725883
    Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: August 15, 2023
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki Tochigi, Masahiro Meguro, Hiroshi Sakai, Kenya Kawabata
  • Publication number: 20230106794
    Abstract: A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.
    Type: Application
    Filed: October 21, 2022
    Publication date: April 6, 2023
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kenya Kawabata, Masahiro Meguro, Ryo Tsubata, Hirofumi Aoki, Yoshikatsu Inagaki, Hiroshi Sakai, Hideaki Kawabata
  • Publication number: 20230102800
    Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.
    Type: Application
    Filed: October 28, 2022
    Publication date: March 30, 2023
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki TOCHIGI, Masahiro MEGURO, Hiroshi SAKAI, Kenya KAWABATA
  • Patent number: 11543189
    Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: January 3, 2023
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yasuyuki Tochigi, Masahiro Meguro, Hiroshi Sakai, Kenya Kawabata
  • Patent number: 11337336
    Abstract: A cooling device including a container to which at least one heating element is thermally connected, a primary refrigerant, and a condensation tube through which a secondary refrigerant flows, wherein a container inner surface area increasing portion is formed on an inner surface of the container to which the heating element is thermally connected, and a plate-shaped member is provided, that includes a shielding portion that is located above the container inner surface area increasing portion in a direction of gravity and below the condensation tube in the direction of gravity, with at least a part of the shielding portion not immersed in the primary refrigerant in a liquid phase, and the plate-shaped member includes a support portion extending from the shielding portion, in a part of a periphery along an orthogonal direction to the direction of gravity, of the container inner surface area increasing portion.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: May 17, 2022
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Hirofumi Aoki, Yoshikatsu Inagaki, Kenya Kawabata, Yoshinori Nakamura
  • Publication number: 20220128314
    Abstract: The disclosure provides a vapor chamber that has excellent fixing stability of a wick structure inside a container and also has excellent circulation properties for a liquid-phase working fluid due to excellent capillary force of the wick structure. The vapor chamber includes a container in which a cavity portion is formed by one plate-shaped body and another plate-shaped body facing the one plate-shaped body, a working fluid enclosed in the cavity portion, and a wick structure contained in the cavity portion and welded to the container so that a welded portion is formed in the wick structure.
    Type: Application
    Filed: January 7, 2022
    Publication date: April 28, 2022
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yoshikatsu INAGAKI, Kenya KAWABATA, Hirofumi AOKI
  • Publication number: 20220132697
    Abstract: A vapor chamber is provided that allows space-saving and weight reduction of a device in which the vapor chamber is to be mounted. The vapor chamber has a container in which a cavity portion is formed by one plate-shaped body and another plate-shaped body facing the one plate-shaped body, and a working fluid enclosed in the cavity portion. The container includes a heat transfer portion that transfers heat by a phase change of the working fluid, and an extending portion that extends outwards from the heat transfer portion and has a function other than a heat transfer function.
    Type: Application
    Filed: January 7, 2022
    Publication date: April 28, 2022
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yoshikatsu INAGAKI, Kenya KAWABATA, Hirofumi AOKI
  • Patent number: 11287192
    Abstract: Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: March 29, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yasuyuki Tochigi, Hung Wei Tseng, Kuang Yu Chu, Masahiro Meguro, Kenya Kawabata
  • Publication number: 20220046825
    Abstract: The vapor chamber includes a container having a cavity formed of one plate-shaped body to which a heating element is thermally connected and another plate-shaped body facing the one plate-shaped body, a working fluid enclosed in the cavity, and a wick structure that is enclosed in the cavity and separated from the container. The container includes a support part protruding from an inner surface of the other plate-shaped body toward the one plate-shaped body, the support part being formed of a recessed part provided to an outer surface of the other plate-shaped body. At the rising base portion of the support part from the inner surface of the other plate-shaped body, the defined angle between the support part and the inner surface of the other plate-shaped body is an obtuse angle.
    Type: Application
    Filed: October 22, 2021
    Publication date: February 10, 2022
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yoshikatsu INAGAKI, Kenya KAWABATA, Hirofumi AOKI
  • Patent number: 11246239
    Abstract: The present disclosure provides a heatsink that can improve heat radiation efficiency of a heat radiating fin and equalize a heat input in a heat receiving portion while securing sufficient volumes of the heat receiving portion, a heat insulating portion, and a heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a width direction of the heatsink is limited.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: February 8, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
  • Patent number: 11150028
    Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: October 19, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shinichi Ito, Masahiro Meguro, Kenya Kawabata
  • Publication number: 20210321538
    Abstract: A cooling device including a container to which at least one heating element is thermally connected, a primary refrigerant, and a condensation tube through which a secondary refrigerant flows, wherein a container inner surface area increasing portion is formed on an inner surface of the container to which the heating element is thermally connected, and a plate-shaped member is provided, that includes a shielding portion that is located above the container inner surface area increasing portion in a direction of gravity and below the condensation tube in the direction of gravity, with at least a part of the shielding portion not immersed in the primary refrigerant in a liquid phase, and the plate-shaped member includes a support portion extending from the shielding portion, in a part of a periphery along an orthogonal direction to the direction of gravity, of the container inner surface area increasing portion.
    Type: Application
    Filed: June 24, 2021
    Publication date: October 14, 2021
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Hirofumi AOKI, Yoshikatsu INAGAKI, Kenya KAWABATA, Yoshinori NAKAMURA
  • Publication number: 20210318072
    Abstract: A cooling device includes a heat-radiating fin group having a plurality of heat-radiating fins that are arranged parallel to each other in a first direction; first heat pipes, one end of each first heat pipe being configured to be thermally connected to a first heat-generating element, another end of each first heat pipe being thermally connected to the heat-radiating fin group; and second heat pipes, one end of each second heat pipe being configured to be thermally connected to a second heat-generating element, another end of each second heat pipe being thermally connected to the heat-radiating fin group, wherein respective inserted another ends of the first and second heat pipes are disposed on a plane parallel to the first direction and defined in the heat-radiating fin group and have portions parallel to the first direction.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 14, 2021
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shinichi ITO, Masahiro MEGURO, Kenya KAWABATA, Yoshikatsu INAGAKI
  • Patent number: 11112186
    Abstract: A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; and a heat radiating fin group which is connected to a heat radiating portion of the heat transport member and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to the heat radiating portion and that is filled with a working fluid, a heat receiving portion inner surface area increasing portion and a supporting member are provided in an internal space of the heat receiving portion, and the supporting member is in surface contact with the heat receiving portion inner surface area increasing portion.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: September 7, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
  • Patent number: 11085703
    Abstract: The present disclosure is to provide a heatsink that can improve heat radiation performance of a heat radiating fin while preventing dry-out of a heat receiving portion and that can equalize a heat input in the heat receiving portion in an environment in which an installation space of the heatsink is limited even when a forbidden region exists in the installation space.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: August 10, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura
  • Patent number: 10996001
    Abstract: The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: May 4, 2021
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Kenya Kawabata, Yoshikatsu Inagaki, Tatsuro Miura, Kazuaki Aotani, Toshiaki Nakamura