Abstract: The present disclosure is related to providing a heat sink that exhibits an excellent cooling performance by preventing occurrence of a hot spot on a heat pipe. A heat sink comprising: a heat receiving plate to which a heating element is thermally connected; and a heat pipe thermally connected to the heat receiving plate, wherein a thermal conductivity of the heat receiving plate is higher than a thermal conductivity of a material of a container of the heat pipe.

Abstract: A heat sink includes a base plate thermally connectable to a heat generating element and having a flat plate shape, a first heat radiating fin thermally connected to the base plate, and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin and thermally connected to the base plate. A surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin.

Abstract: Provided is a vapor chamber that is extremely thin but nonetheless allows a working fluid to smoothly flow back, prevents dry-out and provides a superior heat transport capability, regardless of an installation orientation such as a top heat orientation or a change in the installation orientation.

Abstract: Provided is a heat sink structure which can reliably prevent blocking and narrowing of an inner space of the planar heat pipe thus having excellent heat transmission characteristics, and which can make cooling of a plurality of heat generating elements installed in a narrowed inner space uniform with a simple configuration. A heat sink structure has a planar heat pipe configured to be placed on a plurality of heat generating elements thus being thermally coupled to the plurality of heat generating elements; and a tubular heat pipe thermally coupled to a heat radiating portion of the planar heat pipe at a heat receiving portion of the tubular heat pipe.

Abstract: A heat pipe includes a container in which a corrugated portion is formed, the container having a hollow portion formed therein that is sealed, a wick structure provided on an inner peripheral surface of the hollow portion and a working fluid enclosed in the hollow portion. The wick structure has a vapor channel penetrating therethrough in a longitudinal direction of the hollow portion, the wick structure producing a capillary force. The wick structure is a sintered body of a powder metal material and projected into a crest portion of the corrugated portion. The wick structure is provided at a region in the crest portion of the corrugated portion and at a position of a trough portion of the corrugated portion.

Abstract: Provided is a heat sink having excellent heat dissipation efficiency by having excellent thermal diffusion characteristics in a planar direction of a heat receiving plate. The heat sink has the heat receiving plate that is thermally connected to a heating element, heat pipes that are thermally connected to the heat receiving plate and are formed from a tube body, and heat dissipation fins that are thermally connected to the heat receiving plate, wherein the heat pipes are provided in a plurality of layers in a vertical direction to a surface of the heat receiving plate, and in at least two layers of the plurality of layers, positions of the heat pipes on the surface of the heat receiving plate are not identical to each other.

Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.

Abstract: A heat sink includes a base plate thermally connectable to a heat generating element and having a flat plate shape, a first heat radiating fin thermally connected to the base plate, and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin and thermally connected to the base plate. A surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin.

Abstract: A heat pipe includes a container in which a corrugated portion is formed, the container having a hollow portion formed therein that is sealed, a wick structure provided on an inner peripheral surface of the hollow portion and a working fluid enclosed in the hollow portion. The wick structure has a vapor channel penetrating therethrough in a longitudinal direction of the hollow portion, the wick structure producing a capillary force. The wick structure is a sintered body of a powder metal material and projected into a crest portion of the corrugated portion. The wick structure is provided at a region in the crest portion of the corrugated portion and at a position of a trough portion of the corrugated portion.

Abstract: A heat sink that can reduce a load imposed on a heat pipe and enhance a heat transfer efficiency from a heating body to a heat radiation fin is provided. The heat sink has a base plate 21 having a heat receiving portion to which a semiconductor device 11 is thermally connected, a heat pipe disposed on the base plate 21 while partially brought into contact with the heat receiving portion, and a heat radiation fin arranged to be stacked on the base plate 21 and the heat pipe 22. The base plate 21 is formed of a metal plate and has an opening portion 35 at the site corresponding to the heat receiving portion, and the heat receiving plate 36 which is formed of a metal plate having higher thermal conductivity than the base plate 21 is arranged to form substantially the same plane with the base plate 21.

Abstract: A heat sink to be used with a heat source can include a base portion and a fin portion. The base portion can include a plurality of heat pipes and a space formed at least partially between adjacent heat pipes. The base portion can also include a first plate thermally connected to the heat source and a second plate thermally connected to the fin portion. The plurality of heat pipes contacts the first plate and the second plate. The plurality of heat pipes can also include a first portion that is closer than a second portion to the heat source. Additionally, a distance between adjacent heat pipes is smaller at the first portion than at the second portion.

Abstract: The heat sink has a first heat transfer plate member that has one surface thermally connected to a heat generating component and is thermally connected to a first heat dissipating fin section having thin plate fins; a second heat transfer plate member that has one surface thermally connected to a second heat dissipating fin section having thin plate fins; a heat pipe section that is provided between an opposite surface of the first heat transfer plate member and an opposite surface of the second heat transfer plate member to be thermally connected thereto; and a heat transfer block that is thermally connected to a side surface and an upper surface of the heat pipe section and arranged to sandwich the heat pipe section between the heat transfer block and the second heat transfer plate member.

Abstract: Provided is a heat sink capable of improving heat dissipating characteristics and saving space with a reduced fin size. The heat sink is provided with: a base plate which has one surface thermally connected to a heat generating component and which has thermally connected thereto a first heat dissipating fin section composed of a thin plate fin; an upper plate which has a second heat dissipating fin section thermally connected on one surface, the second heat dissipating fin section being composed of two kinds of thin plate fins having different heights; and a plurality of heat pipes which are disposed between the other surface of the base plate and the other surface of the upper plate by being thermally connected to the surfaces and which include a heat pipe that has at least a part thereof inserted into a part of the second heat dissipating fin section.

Abstract: A heat sink to be used with a heat source can include a base portion and a fin portion. The base portion can include a plurality of heat pipes and a space formed at least partially between adjacent heat pipes. The base portion can also include a first plate thermally connected to the heat source and a second plate thermally connected to the fin portion. The plurality of heat pipes contacts the first plate and the second plate. The plurality of heat pipes can also include a first portion that is closer than a second portion to the heat source. Additionally, a distance between adjacent heat pipes is smaller at the first portion than at the second portion.

Abstract: A heat sink to be used with a heat source can include a base portion and a fin portion. The base portion can include a plurality of heat pipes and a space formed at least partially between adjacent heat pipes. The base portion can also include a first plate thermally connected to the heat source and a second plate thermally connected to the fin portion. The plurality of heat pipes contacts the first plate and the second plate. The plurality of heat pipes can also include a first portion that is closer than a second portion to the heat source. Additionally, a distance between adjacent heat pipes is smaller at the first portion than at the second portion.

Abstract: A heat sink to be used with a heat source can include a base portion and a fin portion. The base portion can include a plurality of heat pipes and a space formed at least partially between adjacent heat pipes. The base portion can also include a first plate thermally connected to the heat source and a second plate thermally connected to the fin portion. The plurality of heat pipes contacts the first plate and the second plate. The plurality of heat pipes can also include a first portion that is closer than a second portion to the heat source. Additionally, a distance between adjacent heat pipes is smaller at the first portion than at the second portion.

Abstract: A heat sink with fins comprising a pillar-shaped base member, and a plurality of fins which are inserted into a plurality of grooves formed in the side face of said base member and then both sides of each of said grooves are plastic-deformed to joint said fins in said base member.

Abstract: A heat sink including a base portion and a fin portion thermally contacted with the base portion. The inside of the base portion has at least one heat pipe, and a space (e.g., an air passage) formed around part of the peripheral portion of the heat pipe. The base portion is constructed of a first plate member that is contacted with a heat source, and a second plate thermally contacted with the fin portion. The heat pipe is placed between the first plate member and the second plate and is thermally contacted with them.

Abstract: There is provided a heat sink comprising a base plate provided with a plurality grooves and concave portions, each of which has a substantially trapezoidal cross section having a flat bottom face and inclined side faces and is formed into a tapered shape, formed between the adjacent grooves by plastic deformation; and a plurality of thin-sheet fins which are inserted in the grooves and are crimped from both sides by the inclined side faces formed by the plastic deformation of the concave portion.

Abstract: A heat sink with fins comprising a group of heat dissipating fins which comprise combination of heat dissipating fins made of at least two kinds of metals having different heat conductivity, and a metal base plate on which surface portion the group of heat dissipating fins are densely jointed.