Patents by Inventor Kenzo Nakamura

Kenzo Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10352771
    Abstract: Provided are an infrared sensor and an infrared sensor device that are less susceptible to effects from the casing and lead wires, can be surface-mounted, and can measure the temperature of the object to be measured in a more accurate manner. This invention has: an insulating film; a first and a second heat sensitive element provided on the insulating film; a first and a second wiring film that are respectively connected to the heat sensitive elements; an infrared reflecting film; a terminal support body, arranged on the one face; and a plurality of mounting terminals provided to the terminal support body, wherein the mounting terminals have support convex parts protruding upward, the support convex parts are connected to the corresponding first and second wiring films, and the insulating film is supported such that a gap is provided between the terminal support body and the insulating film.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: July 16, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazuyoshi Tari, Mototaka Ishikawa, Keiji Shirata, Kenzo Nakamura
  • Publication number: 20190049308
    Abstract: To provide an infrared sensor apparatus that has a small profile and has a small heat capacity of the light guiding path member, and therefore can measure a temperature with high accuracy. The present infrared sensor apparatus includes: an infrared sensor body and a light guiding path member that is provided so as to surround at least the infrared receiving surface of the infrared sensor body and that has an opening immediately above the infrared receiving surface, wherein the light guiding path member is made of a plate material and at least one of the surfaces surrounding the infrared receiving surface is an infrared reflecting surface that is composed of an inclined plate part with the surface thereof on the infrared receiving surface side being inclined towards the opening side.
    Type: Application
    Filed: January 31, 2017
    Publication date: February 14, 2019
    Inventors: Shingo Hirano, Kazuyoshi Tari, Yusuke Hosokawa, Kenzo Nakamura, Masashi Nishiyama, Kenji Nakamura, Koji Yotsumoto, Isao Kobayashi, Yoshihiro Higuchi
  • Patent number: 10168232
    Abstract: A non-contact temperature sensor is provided, the sensor including: an insulating film, a thin film thermistor portion formed on a front-surface of the insulating film, a pair of comb shaped electrodes formed on the thin film thermistor portion, a pair of pad electrodes formed on the front-surface of the insulating film, a pair of pattern wiring portions, and a pair of lead frames that is adhered to the pair of pad electrodes on the front-surface side of the insulating film, wherein the thin film thermistor portion is formed in a thermistor forming region arranged on the front-end side of the insulating film, the pad electrodes are formed in an electrode forming region arranged on the base-end side of the insulating film, the front-end side of the pair of lead frames is arranged to surround the circumference of the thermistor forming region in a non-contact manner.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: January 1, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenzo Nakamura, Masashi Nishiyama, Fumio Matsumoto
  • Patent number: 9568371
    Abstract: Provided is an infrared sensor which is capable of measuring a temperature of an object to be measured with high accuracy even when lead wires are connected to one side thereof. The infrared sensor includes an insulating film; a first and a second heat sensitive element which are provided on one face of the insulating film; a first and a second wiring film that are respectively connected to the first and the second heat sensitive element; an infrared reflecting film; a plurality of terminal electrodes; and a thermal resistance adjusting film which is provided on the other face of the insulating film, is in opposition to at least a portion of the longer one of the first or the second wiring film in wiring distance from the terminal electrodes, and is formed of a material with greater heat dissipation than the insulating film.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: February 14, 2017
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazuyoshi Tari, Mototaka Ishikawa, Keiji Shirata, Kenzo Nakamura
  • Publication number: 20160363485
    Abstract: A non-contact temperature sensor is provided, the sensor including: an insulating film, a thin film thermistor portion formed on a front-surface of the insulating film, a pair of comb shaped electrodes formed on the thin film thermistor portion, a pair of pad electrodes formed on the front-surface of the insulating film, a pair of pattern wiring portions, and a pair of lead frames that is adhered to the pair of pad electrodes on the front-surface side of the insulating film, wherein the thin film thermistor portion is formed in a thermistor forming region arranged on the front-end side of the insulating film, the pad electrodes are formed in an electrode forming region arranged on the base-end side of the insulating film, the front-end side of the pair of lead frames is arranged to surround the circumference of the thermistor forming region in a non-contact manner.
    Type: Application
    Filed: February 10, 2015
    Publication date: December 15, 2016
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenzo Nakamura, Masashi Nishiyama, Fumio Matsumoto
  • Patent number: 9435691
    Abstract: A lightweight infrared sensor that detects a temperature at a portion spaced apart from a circuit substrate with high accuracy, is installed on the circuit substrate easily and stably, and includes an insulating film; a first and a second heat sensitive elements are disposed on one surface of the insulating film separately; a first conductive film on the insulating film that is connected to the first heat sensitive element; a second conductive film connected to the second heat sensitive element; an infrared reflection film on the other surface of the insulating film so as to face the second heat sensitive element; a plurality of terminal electrodes formed on one end of the insulating film and fitted into an external connector; an edge reinforcing plate adhered to one end of one surface of the insulating film; and a mounting hole that is formed on the other end.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: September 6, 2016
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenzo Nakamura, Mototaka Ishikawa, Gakuji Uozumi
  • Patent number: 9279729
    Abstract: A lightweight infrared sensor which is readily and stably erected to a substrate, the infrared sensor includes an insulating film; a first and second heat sensitive element are disposed on one surface of the insulating film separately; a first and second conductive film on one surface of the insulating film and are respectively connected to the first and the second heat sensitive element; an infrared reflection film on the other surface of the insulating film so as to face the second heat sensitive element; a reinforcing plate on which a sensor part window corresponding to a sensor part is formed and which is adhered to the insulating film; and a first and a second terminal electrode are respectively connected to the first and the second wiring film and formed on the edge of the insulating film.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: March 8, 2016
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenzo Nakamura, Mototaka Ishikawa, Gakuji Uozumi
  • Patent number: 9228091
    Abstract: To provide a ferrite thin film-forming composition material that is a composition material for forming a ferrite thin film by using the sol-gel method which can form a thin ferrite thin film having a uniform thickness and, furthermore, has excellent long-term storage stability, a method of forming a ferrite thin film using the above composition material, and a ferrite thin film formed by using the above method. A ferrite thin film-forming composition material is a composition material for forming a NiZn ferrite, CuZn ferrite, or NiCuZn ferrite thin film by using a sol-gel method, in which the composition material is formed by dissolving metallic raw materials in a solvent including acetonitrile, and the fraction of acetonitrile is 30 mass % to 60 mass % with respect to 100 mass % of the composition material.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: January 5, 2016
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshihiro Doi, Hideaki Sakurai, Kenzo Nakamura, Kazunori Igarashi, Nobuyuki Soyama
  • Patent number: 9182286
    Abstract: An infrared sensor allows for a large temperature difference between a temperature sensor for the detection of infrared rays and a temperature sensor for temperature compensation; a reduction in size; and a low manufacturing cost. The infrared sensor comprises: an electrical insulating film sheet; first temperature sensor and second temperature sensor which are provided on one side of the electrical insulating film sheet, and are located at a distance from each other; first foil conductor patterns formed on one side face of the electrical insulating film sheet, and are connected to the first temperature sensor; second foil conductor patterns formed on the one side of the electrical insulating film sheet, and are connected to the second temperature sensor; and an infrared reflector film provided on the other side of the electrical insulating film sheet, and is opposite the second temperature sensor across the electrical insulating film sheet.
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: November 10, 2015
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenzo Nakamura, Sei Kitaguchi, Mototaka Ishikawa
  • Publication number: 20150171421
    Abstract: An electrode for a lithium ion secondary cell includes a conductive auxiliary agent, a binder and an active material. The conductive auxiliary agent includes carbon black and carbon nanofibers. The carbon nanofibers are configured to electrically crosslink the active material and the carbon black so that the carbon nanofibers coat part or all of a surface of the active material to be secured by a binder. In addition, by defining the entire surface of the active material as 100%, 10 to 100% of the surface of the active material is coated with the carbon nanofibers. By bonding the carbon black to the carbon nanofibers with which the surface of the active material is coated, the active material and the carbon black are electrically crosslinked.
    Type: Application
    Filed: May 17, 2013
    Publication date: June 18, 2015
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Jun Akikusa, Shigenari Yanagi, Kenzo Nakamura, Shin Tsuchiya
  • Publication number: 20150118555
    Abstract: An electrode of a lithium-ion secondary battery includes: an electrode film that contains a conductive auxiliary agent, a binder and an active material; and an electrode foil, on a surface of which the electrode film is formed. The conductive auxiliary agent is carbon nano-fibers and the carbon nano-fibers are contained in the range of 0.1 to 3.0% by mass relative to 100% by mass of the electrode film. Further, when using an organic solvent as a solvent, 1.0 to 8.0% by mass of the binder excluding the organic solvent is contained. The active material is made of a mixed powder of a coarse particle powder having an average particle size of 1 to 20 ?m and a fine particle powder having an average particle size of ? to 1/10 of an average particle size of the coarse particle powder, and the porosity of the electrode film is 10 to 30%.
    Type: Application
    Filed: May 20, 2013
    Publication date: April 30, 2015
    Applicant: Mitsubishi Materials Corporation
    Inventors: Jun Akikusa, Shigenari Yanagi, Kenzo Nakamura, Shin Tsuchiya
  • Publication number: 20150043614
    Abstract: Provided are an infrared sensor and an infrared sensor device that are less susceptible to effects from the casing and lead wires, can be surface-mounted, and can measure the temperature of the object to be measured in a more accurate manner. This invention has: an insulating film; a first and a second heat sensitive element provided on the insulating film; a first and a second wiring film that are respectively connected to the heat sensitive elements; an infrared reflecting film; a terminal support body, arranged on the one face; and a plurality of mounting terminals provided to the terminal support body, wherein the mounting terminals have support convex parts protruding upward, the support convex parts are connected to the corresponding first and second wiring films, and the insulating film is supported such that a gap is provided between the terminal support body and the insulating film.
    Type: Application
    Filed: January 1, 2013
    Publication date: February 12, 2015
    Inventors: Kazuyoshi Tari, Mototaka Ishikawa, Keiji Shirata, Kenzo Nakamura
  • Publication number: 20140374596
    Abstract: Provided is an infrared sensor which is capable of measuring a temperature of an object to be measured with high accuracy even when lead wires are connected to one side thereof. The infrared sensor includes an insulating film; a first and a second heat sensitive element which are provided on one face of the insulating film; a first and a second wiring film that are respectively connected to the first and the second heat sensitive element; an infrared reflecting film; a plurality of terminal electrodes; and a thermal resistance adjusting film which is provided on the other face of the insulating film, is in opposition to at least a portion of the longer one of the first or the second wiring film in wiring distance from the terminal electrodes, and is formed of a material with greater heat dissipation than the insulating film.
    Type: Application
    Filed: January 29, 2013
    Publication date: December 25, 2014
    Inventors: Kazuyoshi Tari, Mototaka Ishikawa, Keiji Shirata, Kenzo Nakamura
  • Publication number: 20140284515
    Abstract: This ferrite thin film-forming composition is a composition for forming a thin film of NiZn ferrite, CuZn ferrite, or NiCuZn ferrite using a sol-gel method, and the composition includes: metal raw materials; and a solvent containing N-methyl pyrrolidone, wherein a ratio of an amount of N-methyl pyrrolidone to 100 mass % of the total amount of the composition is in a range of 30 to 60 mass %.
    Type: Application
    Filed: February 14, 2014
    Publication date: September 25, 2014
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshihiro Doi, Hideaki Sakurai, Nobuyuki Soyama, Kenzo Nakamura, Kazunori Igarashi
  • Patent number: 8814426
    Abstract: An infrared sensor comprises: an electrical insulating film sheet; first and second temperature sensor devices which are provided on one side of the electrical insulating film sheet, and are located at a distance from each other; a pair of contact electrodes, with which the first and second temperature sensor devices are attached respectively, formed on one side of the electrical insulating film sheet; an infrared absorbing film provided on the other side of the electrical insulating film sheet opposite the first temperature sensor device; and an infrared reflector film provided on the same side as the infrared absorbing film opposite the second temperature sensor device. The first and second temperature sensor devices respectively comprise: a thermistor element; and a pair of electrode layers, in which one of them is in contact with the contact electrode, formed both on the upper and lower surfaces of the thermistor element.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: August 26, 2014
    Assignee: Mitsubishi Materials Corporation
    Inventors: Kenzo Nakamura, Sei Kitaguchi, Mototaka Ishikawa
  • Publication number: 20140061468
    Abstract: Provided is a lightweight infrared sensor which is readily and stably erected to a substrate. The infrared sensor includes an insulating film; a first and a second heat sensitive element are disposed on one surface of the insulating film separately; a first and second conductive film on one surface of the insulating film and are respectively connected to the first and the second heat sensitive element; and an infrared reflection film on the other surface of the insulating film so as to face the second heat sensitive element. The infrared sensor further includes a reinforcing plate on which a sensor part window corresponding to a sensor part is formed and which is adhered to the insulating film; and a first and a second terminal electrode are respectively connected to the first and the second wiring film, are formed on the edge of the insulating film.
    Type: Application
    Filed: March 21, 2012
    Publication date: March 6, 2014
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenzo Nakamura, Mototaka Ishikawa, Gakuji Uozumi
  • Publication number: 20140010262
    Abstract: Provided is a lightweight infrared sensor that detects a temperature at a portion spaced apart from a circuit substrate with high accuracy, and is installed on the circuit substrate easily and stably. The infrared sensor includes an insulating film; a first and a second heat sensitive elements are disposed on one surface of the insulating film separately; a first conductive film on the insulating film that is connected to the first heat sensitive element; a second conductive film connected to the second heat sensitive element; an infrared reflection film on the other surface of the insulating film so as to face the second heat sensitive element; a plurality of terminal electrodes formed on one end of the insulating film and fitted into an external connector; an edge reinforcing plate adhered to one end of one surface of the insulating film; and a mounting hole that is formed on the other end.
    Type: Application
    Filed: March 22, 2012
    Publication date: January 9, 2014
    Applicant: Mitsubishi Materials Corporation
    Inventors: Kenzo Nakamura, Mototaka Ishikawa, Gakuji Uozumi
  • Publication number: 20130256582
    Abstract: To provide a ferrite thin film-forming composition material that is a composition material for forming a ferrite thin film by using the sol-gel method which can form a thin ferrite thin film having a uniform thickness and, furthermore, has excellent long-term storage stability, a method of forming a ferrite thin film using the above composition material, and a ferrite thin film formed by using the above method. A ferrite thin film-forming composition material is a composition material for forming a NiZn ferrite, CuZn ferrite, or NiCuZn ferrite thin film by using a sol-gel method, in which the composition material is formed by dissolving metallic raw materials in a solvent including acetonitrile, and the fraction of acetonitrile is 30 mass % to 60 mass % with respect to 100 mass % of the composition material.
    Type: Application
    Filed: March 14, 2013
    Publication date: October 3, 2013
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshihiro Doi, Hideaki Sakurai, Kenzo Nakamura, Kazunori Igarashi, Nobuyuki Soyama
  • Publication number: 20130256585
    Abstract: A method of forming a ferrite thin film by carrying out a process for forming a coated film by coating a ferrite thin film-forming composition on a heat-resistant substrate and a process for calcining the coated film once or a plurality of times so that the thickness of the calcined film on the substrate becomes a desired thickness, and firing the calcined film formed on the substrate, in which the conditions for firing the calcined film formed on the substrate are under the atmosphere or an oxygen gas or inert gas atmosphere, a temperature-rise rate of 1° C./minute to 50° C./minute, a holding temperature of 500° C. to 800° C., and a holding time of 30 minutes to 120 minutes.
    Type: Application
    Filed: March 15, 2013
    Publication date: October 3, 2013
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshihiro Doi, Hideaki Sakurai, Kenzo Nakamura, Kazunori Igarashi, Nobuyuki Soyama
  • Publication number: 20120269228
    Abstract: An infrared sensor allows for a large temperature difference between a temperature sensor for the detection of infrared rays and a temperature sensor for temperature compensation; a reduction in size; and a low manufacturing cost. The infrared sensor comprises: an electrical insulating film sheet; first temperature sensor and second temperature sensor which are provided on one side of the electrical insulating film sheet, and are located at a distance from each other; first foil conductor patterns formed on one side face of the electrical insulating film sheet, and are connected to the first temperature sensor; second foil conductor patterns formed on the one side of the electrical insulating film sheet, and are connected to the second temperature sensor; and an infrared reflector film provided on the other side of the electrical insulating film sheet, and is opposite the second temperature sensor across the electrical insulating film sheet.
    Type: Application
    Filed: October 14, 2010
    Publication date: October 25, 2012
    Applicant: Mitsubishi Materials Corporation
    Inventors: Kenzo Nakamura, Sei Kitaguchi, Mototaka Ishikawa