Patents by Inventor Kerem Akarvardar

Kerem Akarvardar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942146
    Abstract: Various embodiments provide methods for configuring a phase-change random-access memory (PCRAM) structures, such as PCRAM operating in a single-level-cell (SLC) mode or a multi-level-cell (MLC) mode. Various embodiments may support a PCRAM structure being operating in a SLC mode for lower power and a MLC mode for lower variability. Various embodiments may support a PCRAM structure being operating in a SLC mode or a MLC mode based at least in part on an error tolerance for a neural network layer.
    Type: Grant
    Filed: February 13, 2023
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Win-San Khwa, Kerem Akarvardar, Yu-Sheng Chen
  • Publication number: 20240069971
    Abstract: An artificial intelligence (AI) accelerator device may include a plurality of on-chip mini buffers that are associated with a processing element (PE) array. Each mini buffer is associated with a subset of rows or a subset of columns of the PE array. Partitioning an on-chip buffer of the AI accelerator device into the mini buffers described herein may reduce the size and complexity of the on-chip buffer. The reduced size of the on-chip buffer may reduce the wire routing complexity of the on-chip buffer, which may reduce latency and may reduce access energy for the AI accelerator device. This may increase the operating efficiency and/or may increase the performance of the AI accelerator device. Moreover, the mini buffers may increase the overall bandwidth that is available for the mini buffers to transfer data to and from the PE array.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Xiaoyu SUN, Xiaochen PENG, Murat Kerem AKARVARDAR
  • Publication number: 20240053899
    Abstract: A circuit includes a data buffer configured to sequentially output first and second pluralities of bits, a plurality of memory macros having a total number, and a distribution network coupled between the data buffer and the plurality of memory macros. The distribution network separates the first plurality of bits into the total number of first subsets, and outputs each first subset to a corresponding memory macro, and either outputs an entirety of the second plurality of bits to each memory macro, or separates the second plurality of bits into a number of second subsets less than or equal to the total number, and outputs each second subset to one or more corresponding memory macros. Each memory macro outputs a product of the corresponding first subset and the one of the entirety of the second plurality of bits or the corresponding second subset of the second plurality of bits.
    Type: Application
    Filed: May 2, 2023
    Publication date: February 15, 2024
    Inventors: Xiaoyu SUN, Murat Kerem AKARVARDAR
  • Patent number: 11901004
    Abstract: A memory array, a memory structure and an operation method of a memory array are provided. The memory array includes memory cells, floating gate transistors, bit lines and word lines. The memory cells each comprise a capacitor and an electrically programmable non-volatile memory (NVM) serially connected to the capacitor, and further comprise a write transistor with a first source/drain terminal coupled to a common node of the capacitor and the electrically programmable NVM. The floating gate transistors respectively have a gate terminal electrically floated and coupled to the capacitors of a column of the memory cells. The bit lines respectively coupled to the electrically programmable NVMs of a row of the memory cells. The word lines respectively coupled to gate terminals of the write transistors in a row of the memory cells.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: February 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kerem Akarvardar, Win-San Khwa, Rawan Naous, Jin Cai, Meng-Fan Chang, Hon-Sum Philip Wong
  • Publication number: 20240028869
    Abstract: A reconfigurable processing circuit of an AI accelerator and a method of operating the same are disclosed. In one aspect, the reconfigurable processing circuit includes a first memory configured to store an input activation state, a second memory configured to store a weight, a multiplier configured to multiply the weight and the input activation state and output a product, a first multiplexer (mux) configured to, based on a first selector, output a previous sum from a previous reconfigurable processing element, a third memory configured to store a first sum, a second mux configured to, based on a second selector, output the previous sum or the first sum, an adder configured to add the product and the previous sum or the first sum to output a second sum, and a third mux configured to, based on a third selector, output the second sum or the previous sum.
    Type: Application
    Filed: July 21, 2022
    Publication date: January 25, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xiaoyu Sun, Rawan Naous, Murat Kerem Akarvardar
  • Publication number: 20240013042
    Abstract: Systems and methods for a pipelined heterogeneous dataflow for an artificial intelligence accelerator are disclosed. A pipelined processing core includes a first processing core configured to have a first type of dataflow and a second processing core configured to have a second type of dataflow. The first processing core includes a matrix array of PEs arranged in columns and rows, each of the PEs configured to perform a MAC operation based on an input and a weight. The second processing core is configured to receive an output from the first processing core. The second processing core includes a column of PEs configured to perform MAC operations.
    Type: Application
    Filed: July 7, 2022
    Publication date: January 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xiaoyu Sun, Kerem Akarvardar
  • Publication number: 20230377614
    Abstract: Disclosed herein are related to a circuit and a method of reading or sensing multiple bits of data stored by a multi-level cell. In one aspect, a first reference circuit is selected from a first set of reference circuits, and a second reference circuit is selected from a second set of reference circuits. Based at least in part on the first reference circuit and the second reference circuit, one or more bits of multiple bits of data stored by a multi-level cell can be determined. According to the determined one or more bits, a third reference circuit from the first set of reference circuits and a fourth reference circuit from the second set of reference circuits can be selected. Based at least in part on the third reference circuit and the fourth reference circuit, additional one or more bits of the multiple bits of data stored by the multi-level cell can be determined.
    Type: Application
    Filed: July 24, 2023
    Publication date: November 23, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Qing Dong, Mahmut Sinangil, Yen-Ting Lin, Kerem Akarvardar, Carlos H. Diaz, Yih Wang
  • Publication number: 20230376273
    Abstract: A compute-in-memory device may include a Booth encoder configured to receive at least one input of first bits, a Booth decoder configured to receive at least one weight of second bits and to output a plurality of partial products of the at least one input and the at least one weight, an adder configured to add a first partial product of the plurality of the partial products and a second partial product of the plurality of partial products before the Booth decoder generates a third partial product of the plurality of the partial products and to generate a plurality of sums of partial products, and a carry-lookahead adder configured to add the plurality of sums of partial products and to generate a final sum.
    Type: Application
    Filed: May 20, 2022
    Publication date: November 23, 2023
    Inventors: Rawan Naous, Kerem Akarvardar, Hidehiro Fujiwara, Haruki Mori, Mahmut Sinangil, Yu-Der Chih
  • Publication number: 20230367497
    Abstract: A memory system, an operating method and a controller are provided. The memory system comprises a memory array and a controller. The memory array comprises a probing memory block and a plurality of memory blocks. The controller is configured to perform; write a probing data to the probing memory block; detect a strength of the probing data from the probing memory block to obtain an aging condition of the memory array; and control each memory block to be enabled or disabled according to the aging condition.
    Type: Application
    Filed: May 10, 2022
    Publication date: November 16, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xiaoyu Sun, Kerem Akarvardar, Rawan Naous
  • Publication number: 20230368014
    Abstract: A design method, an operating method and an electronic system are provided. The method comprises receiving a training dataset having a plurality of training data, wherein each training data is labeled to one of a plurality of classes; selecting at least one first class from the plurality of classes and establishing a first category having the at least one selected first class; training a first model with the training dataset, and using the at least one first class within the first category for verification; and implementing the first model on the accelerator.
    Type: Application
    Filed: May 10, 2022
    Publication date: November 16, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kerem Akarvardar, Rawan Naous, Xiaoyu Sun
  • Publication number: 20230352393
    Abstract: A semiconductor monolithic IC includes a semiconductor substrate having a rectangular shape in plan view, multiple chiplets each comprising a circuit, wherein the multiple chiplets are disposed over the semiconductor substrate and are separated from each other by die-to-die spaces filled with a dielectric material, and a plurality of conductive connection patterns electrically connecting the multiple chiplets so that a combination of the circuit of the multiple chiplet function as one functional circuit. The chip region has a larger area than a maximum exposure area of a lithography apparatus used to fabricate the first and second circuits.
    Type: Application
    Filed: June 30, 2023
    Publication date: November 2, 2023
    Inventors: Murat Kerem AKARVARDAR, Hon-Sum Philip WONG
  • Publication number: 20230326525
    Abstract: A memory array, a memory structure and an operation method of a memory array are provided. The memory array includes memory cells, floating gate transistors, bit lines and word lines. The memory cells each comprise a capacitor and an electrically programmable non-volatile memory (NVM) serially connected to the capacitor, and further comprise a write transistor with a first source/drain terminal coupled to a common node of the capacitor and the electrically programmable NVM. The floating gate transistors respectively have a gate terminal electrically floated and coupled to the capacitors of a column of the memory cells. The bit lines respectively coupled to the electrically programmable NVMs of a row of the memory cells. The word lines respectively coupled to gate terminals of the write transistors in a row of the memory cells.
    Type: Application
    Filed: April 8, 2022
    Publication date: October 12, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kerem Akarvardar, Win-San Khwa, Rawan Naous, Jin Cai, Meng-Fan Chang, Hon-Sum Philip Wong
  • Patent number: 11735235
    Abstract: Disclosed herein are related to a circuit and a method of reading or sensing multiple bits of data stored by a multi-level cell. In one aspect, a first reference circuit is selected from a first set of reference circuits, and a second reference circuit is selected from a second set of reference circuits. Based at least in part on the first reference circuit and the second reference circuit, one or more bits of multiple bits of data stored by a multi-level cell can be determined. According to the determined one or more bits, a third reference circuit from the first set of reference circuits and a fourth reference circuit from the second set of reference circuits can be selected. Based at least in part on the third reference circuit and the fourth reference circuit, additional one or more bits of the multiple bits of data stored by the multi-level cell can be determined.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: August 22, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Qing Dong, Mahmut Sinangil, Yen-Ting Lin, Kerem Akarvardar, Carlos H. Diaz, Yih Wang
  • Patent number: 11735515
    Abstract: A semiconductor monolithic IC includes a semiconductor substrate having a rectangular shape in plan view, multiple chiplets each comprising a circuit, wherein the multiple chiplets are disposed over the semiconductor substrate and are separated from each other by die-to-die spaces filled with a dielectric material, and a plurality of conductive connection patterns electrically connecting the multiple chiplets so that a combination of the circuit of the multiple chiplet function as one functional circuit. The chip region has a larger area than a maximum exposure area of a lithography apparatus used to fabricate the first and second circuits.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: August 22, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Murat Kerem Akarvardar, Hon-Sum Philip Wong
  • Publication number: 20230263081
    Abstract: A semiconductor structure includes a first dielectric layer, an electrode in the first dielectric layer, a second dielectric layer in the electrode, and a phase change material over the first dielectric layer, the electrode, and the second dielectric layer. According to some embodiments, an uppermost surface of the electrode is at least one of above an uppermost surface of the first dielectric layer, above an uppermost surface of the second dielectric layer, or above a lowermost surface of the phase change material.
    Type: Application
    Filed: February 15, 2022
    Publication date: August 17, 2023
    Inventors: Kerem Akarvardar, Yu Chao LIN, Wei-Sheng Yun, Shao-Ming Yu, Tzu-Chiang Chen, Tung Ying Lee
  • Publication number: 20230229922
    Abstract: A training method, an operating method and a memory system are provided. The operating method comprises using a first memory block of the memory system for computation; obtaining an aging condition of the memory system; determining whether the aging condition meets a predetermined aging condition; and when it is determined that the aging condition meets the predetermined aging condition, enabling the second memory block and using the first memory block and the second memory block for computation.
    Type: Application
    Filed: January 17, 2022
    Publication date: July 20, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xiaoyu Sun, Kerem Akarvardar, Rawan Naous
  • Publication number: 20230197150
    Abstract: Various embodiments provide methods for configuring a phase-change random-access memory (PCRAM) structures, such as PCRAM operating in a single-level-cell (SLC) mode or a multi-level-cell (MLC) mode. Various embodiments may support a PCRAM structure being operating in a SLC mode for lower power and a MLC mode for lower variability. Various embodiments may support a PCRAM structure being operating in a SLC mode or a MLC mode based at least in part on an error tolerance for a neural network layer.
    Type: Application
    Filed: February 13, 2023
    Publication date: June 22, 2023
    Inventors: Win-San KHWA, Kerem AKARVARDAR, Yu-Sheng CHEN
  • Publication number: 20230133360
    Abstract: Systems and methods for floating-point processors and methods for operating floating-point processors are provided. A floating-point processor includes a quantizer, a compute-in-memory device, and a decoder. The floating-processor is configured to receive an input array in which the values of the input array are represented in floating-point format. The floating-point processor may be configured to convert the floating-point numbers into integer format so that multiply-accumulate operations can be performed on the numbers. The multiply-accumulate operations generate partial sums, which are in integer format. The partial sums can be accumulated until a full sum is achieved, wherein the full sum can then be converted to floating-point format.
    Type: Application
    Filed: May 26, 2022
    Publication date: May 4, 2023
    Inventors: Rawan Naous, Kerem Akarvardar, Mahmut Sinangil, Yu-Der Chih, Saman Adham, Nail Etkin Can Akkaya, Hidehiro Fujiwara, Yih Wang, Jonathan Tsung-Yung Chang
  • Publication number: 20230125070
    Abstract: An integrated circuit (IC) device includes a first terminal, a second terminal, a resistive memory device configured to have a first resistance level in a first state and a second resistance level in a second state, and a switching device including a control terminal and a current path. The resistive memory device and the current path are coupled in series between the first and second terminals, and the switching device is configured to, responsive to a first voltage level at the control terminal, control the current path to have a first conductance level in a first programmed state and a second conductance level in a second programmed state.
    Type: Application
    Filed: January 18, 2022
    Publication date: April 27, 2023
    Inventors: Kerem AKARVARDAR, Hon-Sum Philip WONG
  • Publication number: 20230050279
    Abstract: An integrated circuit includes a first encoder, a compute in-memory (CIM) array and a de-encoder. The first encoder is configured to quantize a first received signal into a first signal. The first received signal has a first floating point number format. The first signal has an integer number format. The compute in-memory (CIM) array is coupled to the first encoder. The CIM array is configured to generate a CIM signal in response to at least the first signal. The CIM signal has the integer number format. The de-encoder is coupled to the CIM array, and is configured to generate a first output signal in response to the CIM signal. The first output signal has a second floating point number format.
    Type: Application
    Filed: January 31, 2022
    Publication date: February 16, 2023
    Inventors: Rawan NAOUS, Kerem AKARVARDAR, Hidehiro FUJIWARA, Haruki MORI, Yu-Der CHIH, Mahmut SINANGIL, Yih WANG, Jonathan Tsung-Yung CHANG