Abstract: A connector assembly comprises a first connector, a locking lever rotatably attached to the first connector, and a second connector engageable with the first connector. The second connector defines a first guide protrusion extending from a surface thereof. In a closed position, the locking lever engages with the second connector and prevents the second connector from disengaging from the first connector. The first guide protrusion disconnects the locking lever from the first connector and biases the locking lever in an opening direction toward an open position.

Abstract: A self-healing alloy contains 5 to 11% by weight of molybdenum (Mo), iron (Fe) as a remainder, and unavoidable impurities. A method for manufacturing the self-healing alloy includes heat treating the alloy or preparing an alloy raw material powder and sintering, homogenizing, and cooling the alloy raw material powder.

Abstract: Provided is a stacked semiconductor package including a package base substrate including a plurality of signal wires and at least one power wire, wherein a plurality of top surface connecting pads and a plurality of bottom surface connecting pads are on a top surface and a bottom surface of the package base substrate, respectively; and a plurality of semiconductor chips that are sequentially stacked on the package base substrate and are electrically connected to the top surface connecting pads, the plurality of semiconductor chips including a first semiconductor chip that is a bottommost semiconductor chip, and a second semiconductor chip that is on the first semiconductor chip, wherein the signal wires are arranged apart from a portion of the package base substrate, the first portion that overlaps a first edge of the first semiconductor chip, the first edge overlapping the second semiconductor chip in a vertical direction.

Abstract: Provided is a stacked semiconductor package including a package base substrate including a plurality of signal wires and at least one power wire, wherein a plurality of top surface connecting pads and a plurality of bottom surface connecting pads are on a top surface and a bottom surface of the package base substrate, respectively; and a plurality of semiconductor chips that are sequentially stacked on the package base substrate and are electrically connected to the top surface connecting pads, the plurality of semiconductor chips including a first semiconductor chip that is a bottommost semiconductor chip, and a second semiconductor chip that is on the first semiconductor chip, wherein the signal wires are arranged apart from a portion of the package base substrate, the first portion that overlaps a first edge of the first semiconductor chip, the first edge overlapping the second semiconductor chip in a vertical direction.

Abstract: Provided is a composite separator for an electrochemical device, and the composite separator according to the present invention includes a porous substrate and a crystalline metal salt. The composite separator may serve as a salt source to a liquid electrolyte of the electrochemical device, and additionally or independently, may have flame retardancy by the metal salt.

Abstract: Provided is a stacked semiconductor package including a package base substrate including a plurality of signal wires and at least one power wire, wherein a plurality of top downsurface connecting pads and a plurality of bottom surface connecting pads are on a top surface and a bottom surface of the package base substrate, respectively; and a plurality of semiconductor chips that are sequentially stacked on the package base substrate and are electrically connected to the top surface connecting pads, the plurality of semiconductor chips including a first semiconductor chip that is a bottommost semiconductor chip, and a second semiconductor chip that is on the first semiconductor chip, wherein the signal wires are arranged apart from a portion of the package base substrate, the first portion that overlaps a first edge of the first semiconductor chip, the first edge overlapping the second semiconductor chip in a vertical direction.

Abstract: Provided is a thin lithium battery and a method for manufacturing the same. Specifically, the present invention relates to a thin lithium battery having a tabless current collecting structure that does not require a separate tab or terminal unit because a current collector is exposed to the outside, and a method for manufacturing the same. In addition, the present invention relates to a thin lithium battery and a method for manufacturing the same, wherein the thin lithium battery has flexibility and can thus be applied to flexible devices, and does not require a separate terminal unit and can thus be manufactured into a wide variety of dimensions and designs by punching, such as by cutting, stamping, or laser cutting.

Abstract: The present invention relates to an electrochemical element and a method for producing same, the electrochemical element comprising: electrodes comprising a composite of active material and conductive material having a nanofiber structure; and a cellulose nanofiber separator combined with the electrodes. The electrochemical element according to the present invention obviates the need for separate binder and electrode current collector, has a stable interfacial surface due to the physical union of the separator and electrode, can assure superb mechanical and physical properties, and can maintain stable battery performance even against deformations due to a variety of external impact.

Abstract: A bonding wire for connecting a first pad to a second pad is provided. The bonding wire includes a ball part bonded to the first pad, a neck part formed on the ball part, and a wire part extending from the neck part to the second pad. Less than an entire portion of a top surface of the neck part is covered by the wire part, and the wire part is in contact with the neck part, the ball part, and the first pad.

Abstract: A bonding wire for connecting a first pad to a second pad is provided. The bonding wire includes a ball part bonded to the first pad, a neck part formed on the ball part, and a wire part extending from the neck part to the second pad. Less than an entire portion of a top surface of the neck part is covered by the wire part, and the wire part is in contact with the neck part, the ball part, and the first pad.

Abstract: Provided is a stacked semiconductor package including a package base substrate including a plurality of signal wires and at least one power wire, wherein a plurality of top surface connecting pads and a plurality of bottom surface connecting pads are on a top surface and a bottom surface of the package base substrate, respectively; and a plurality of semiconductor chips that are sequentially stacked on the package base substrate and are electrically connected to the top surface connecting pads, the plurality of semiconductor chips including a first semiconductor chip that is a bottommost semiconductor chip, and a second semiconductor chip that is on the first semiconductor chip, wherein the signal wires are arranged apart from a portion of the package base substrate, the first portion that overlaps a first edge of the first semiconductor chip, the first edge overlapping the second semiconductor chip in a vertical direction.

Abstract: A bonding wire for connecting a first pad to a second pad is provided. The bonding wire includes a ball part bonded to the first pad, a neck part formed on the ball part, and a wire part extending from the neck part to the second pad. Less than an entire portion of a top surface of the neck part is covered by the wire part, and the wire part is in contact with the neck part, the ball part, and the first pad.

Abstract: The present invention relates to an electrochemical element and a method for producing same, the electrochemical element comprising: electrodes comprising a composite of active material and conductive material having a nanofiber structure; and a cellulose nanofiber separator combined with the electrodes. The electrochemical element according to the present invention obviates the need for separate binder and electrode current collector, has a stable interfacial surface due to the physical union of the separator and electrode, can assure superb mechanical and physical properties, and can maintain stable battery performance even against deformations due to a variety of external impact.

Abstract: Provided is a cable-type secondary battery having a predetermined-shaped horizontal cross section and extending in a longitudinal direction, which includes a hollow core portion having a gel polymer electrolyte injected thereinto, an inner electrode which includes an inner current collector surrounding an outer surface of the hollow core portion and an inner electrode active material layer formed on a surface of the inner current collector, a separation layer surrounding an outer surface of the inner electrode, an outer electrode which includes an outer electrode active material layer surrounding an outer surface of the separation layer and an outer current collector surrounding an outer surface of the outer electrode active material layer, and a protective coating layer.

Abstract: The present invention provides user equipment, a method of controlling the user equipment, and a recording medium having a computer program. That is, the present invention makes infants actively check their attending and leaving by arousing their interest in order to sense their attending/leaving through NFC tagging, lets their parents know it in real time, and outputs greeting messages set for each infant on the basis of attending/leaving management data for infants and medical data of infants, so it can improve convenience of use. Further, the present invention provides a user with a list of actually available hospitals in consideration of time to be taken to reach hospitals and to register in the hospitals and provides information about the closest hospital in the available hospitals, thereby improving convenience in used.

Abstract: A semiconductor package, comprising: a package substrate including chip regions, a separation region between the chip regions, and an edge region around the chip and separation regions; semiconductor chips disposed on the chip regions of the package substrate; and signal patterns. The package substrate comprises an upper layer substantially adjacent to the semiconductor chips, a lower layer including interconnection structures disposed in the chip regions, and an intermediate layer between the upper and lower layers, the intermediate layer includes through holes disposed only outside of the separation region; and the signal patterns are in contact with the interconnection structures through the through holes.

Abstract: A semiconductor package includes a mounting board including a bonding pad, first and second semiconductor chips sequentially stacked on the mounting board, a first wire connecting a first region of the bonding pad to a chip pad of the first semiconductor chip, and a second wire connecting the first region of the bonding pad to a chip pad of the second semiconductor chip, the second wire having a reverse loop configuration.

Abstract: A multi-chip package may include a bonding finger. The bonding finger may have a bonding portion having a wide width so that lower ends of conductive wires may be accurately connected to the wide bonding portion. Thus, an electrical connection between a package substrate and semiconductor chips may be improved.

Abstract: A semiconductor package, comprising: a package substrate including chip regions, a separation region between the chip regions, and an edge region around the chip and separation regions; semiconductor chips disposed on the chip regions of the package substrate; and signal patterns. The package substrate comprises an upper layer substantially adjacent to the semiconductor chips, a lower layer including interconnection structures disposed in the chip regions, and an intermediate layer between the upper and lower layers, the intermediate layer includes through holes disposed only outside of the separation region; and the signal patterns are in contact with the interconnection structures through the through holes.

Abstract: Provided is a cable-type secondary battery having a predetermined-shaped horizontal cross section and extending in a longitudinal direction, which includes a hollow core portion having a gel polymer electrolyte injected thereinto, an inner electrode which includes an inner current collector surrounding an outer surface of the hollow core portion and an inner electrode active material layer formed on a surface of the inner current collector, a separation layer surrounding an outer surface of the inner electrode, an outer electrode which includes an outer electrode active material layer surrounding an outer surface of the separation layer and an outer current collector surrounding an outer surface of the outer electrode active material layer, and a protective coating layer.