Abstract: A for fabricating a semiconductor device comprises forming a mask layer on a substrate, the mask layer defining a through hole that exposes an upper surface of the substrate, the mask layer comprising a first mask layer and a second mask layer, wherein the second mask layer is between the substrate and the first mask layer, and wherein the second mask layer comprises carbon. The method includes forming a liner layer on side walls of the through hole inside the second mask layer.

Abstract: This document describes apparatuses and techniques for multi-rail power transition. In various aspects, a power rail controller transitions a memory circuit (e.g., of a memory die) from a first power rail to a second power rail. The power rail controller then changes a voltage of the first power rail from a first voltage to a second voltage. The power rail controller may also adjust termination impedance or a clock frequency of the memory circuit before transitioning the memory circuit to the second power rail. The power rail controller then transitions the memory circuit from the second power rail to the first power rail to enable operation of the memory circuit at the second voltage. By so doing, the power rail controller may improve the reliability of memory operations when transitioning operation of the memory circuit from the first voltage to the second voltage.

Abstract: In one example, a semiconductor device, comprises a substrate having a top side and a conductor on the top side of the substrate, an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, a lid covering a top side of the electronic device, and a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.

Abstract: A walk-in apparatus for a vehicle seat includes a walk-in bracket rotatably coupled to a crossbar of a cushion frame and operable to release a fixing member by contacting the fixing member of a seat rail; a compensator bracket operably connected to the walk-in bracket through a hinge, the compensator bracket also being connected to a walk-in cable; and a compensator spring configured to support the walk-in bracket and the compensator bracket, rotate at least one of the walk-in bracket and the compensator bracket, and operate in such a manner as to return the compensator bracket. Even when the walk-in cable is released due to a seatback rebound phenomenon during a walk-in operation, the walk-in bracket maintains a pressing state of the fixing member to maintain continuously an unlocking state of the seat rail, allowing the vehicle seat to move forward smoothly to enable a walk-in operation.

Abstract: Methods, systems, and devices for managing address access information are described. A device may receive a command for an address of a memory array. Based on or in response to the command, the device may read a first set of tag bits from the memory array. The first set of tag bits may indicate access information for a set of addresses that includes the address. The device may determine a second set of tag bits based on the command and the address. The second set of tag bits may indicate updated access information for the address. The device may generate a codeword based on the first set of tag bits and the second set of tag bits and may store the codeword in the memory array.

Abstract: Described apparatuses and methods provide configurable error correction code (ECC) circuitry and schemes that can utilize a shared ECC engine between multiple memory banks of a memory, including a low-power double data rate (LPDDR) memory. A memory device may include one or more dies with multiple memory banks. The configurable ECC circuitry can use an ECC engine that services a memory bank by producing ECC values based on data stored in the memory bank when data-masking functionality is enabled. When data-masking functionality is disabled, the configurable ECC circuitry can use the shared ECC engine that services at least two memory banks by producing ECC values with a larger quantity of bits based on respective data stored in the at least two memory banks. By using the shared ECC engine responsive to the data-masking functionality being disabled, the ECC functionality can provide higher data reliability with lower die area utilization.

Abstract: In one example, a semiconductor device includes a substrate having a top side and a conductor on the top side of the substrate, an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, a lid covering a top side of the electronic device, and a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.

Abstract: The present invention provides a photosensitive composition comprising a copolymer of an organometallic compound and polysiloxane that may be used in a photosensitive material for a display or semiconductor, and a method for preparing the same.

Abstract: Disclosed is an apparatus for controlling shut-off of a fuel gun in a filler pipe of a fuel tank which inhibits early shut-off of the fuel gun before the fuel tank is fully filled with fuel while refueling. The apparatus includes: a retainer mounted in a filler neck of the fuel tank; a partition disposed in a space between an inner circumferential surface of the filler neck and an outer circumferential surface of the retainer and having a fuel intake hole formed in a lower end of the partition; and an early shut-off prevention valve disposed in the partition. The early shut-off prevention valve closes the fuel intake hole before the fuel tank is fully filled with fuel, and opens the fuel intake hole by fuel flowing to the filler neck from the fuel tank when the fuel tank is fully filled with the fuel.

Abstract: A system for controlling shut-off of a fuel pump nozzle in a fuel tank includes: a fuel evaporation gas blocking unit configured to separate an outer space of a fuel injection part of the fuel pump nozzle inserted inside the filler pipe into a first space into which external air is introduced and a second space into which fuel evaporation gas that is discharged from the fuel tank is introduced and to block the evaporation gas from being introduced into the first space; an external air suction jet pump mounted in the fuel tank and configured to suck external air thereinto and discharge the external air into the fuel tank, by receiving a portion of fuel transmitted from the fuel pump in the fuel tank as a working fluid; and a jet pump connection hose configured to connect the first space and the external air suction jet pump.

Abstract: A fuel measurement system and a fuel gauge error reduction method are provided. The fuel gauge error reduction method includes determining a driving mode of a vehicle based on an external input condition; calculating a remaining amount of fuel using a different manner corresponding to each driving mode; and providing the calculated remaining amount of fuel.

Abstract: A valve system of a vehicle fuel pump includes: a reservoir cup disposed within a fuel tank storing fuel in the reservoir cup; a fuel pump configured to pump fuel from the reservoir cup to the engine while supplying fuel to a jet pump through a first discharge port; a jet pump configured to charge the reservoir cup with fuel by drawing fuel from the fuel tank by using a pressure of fuel supplied by the fuel pump; and a jet pump control valve disposed on the first discharge port and configured to control a flow of fuel discharged from the fuel pump to the jet pump.

Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.

Abstract: A system for controlling shut-off of a fuel pump nozzle in a fuel tank includes: a fuel evaporation gas blocking unit configured to separate an outer space of a fuel injection part of the fuel pump nozzle inserted inside the filler pipe into a first space into which external air is introduced and a second space into which fuel evaporation gas that is discharged from the fuel tank is introduced and to block the evaporation gas from being introduced into the first space; an external air suction jet pump mounted in the fuel tank and configured to suck external air thereinto and discharge the external air into the fuel tank, by receiving a portion of fuel transmitted from the fuel pump in the fuel tank as a working fluid; and a jet pump connection hose configured to connect the first space and the external air suction jet pump.

Abstract: The present invention relates to a polysiloxane copolymer including a structural unit derived from a siloxane-based polymer and a structural unit derived from a silane-based monomer, and a method for preparing the same. The polysiloxane copolymer of the present invention has excellent heat resistance, flexibility, transparency, photosensitivity, durability and the like, and may be widely used as a material in an optical field or/and an electronic field.

Abstract: One form of an apparatus for controlling a fuel gauge in a circuit mode of a vehicle includes: a vehicle mode determiner configured to compare a damping time with a response time, and to determine whether a driving mode of the vehicle is a general mode or a circuit mode; a fuel amount calculator configured to calculate a current fuel amount of the vehicle based on fuel consumption (FCO) by the engine or a change in the resistance of a fuel sender based on the driving mode of the vehicle; and a fuel gauge controller configured to control the fuel gauge based on the calculated current fuel amount, wherein the response time is a time taken for the fuel gauge to actually descend to a state ‘empty’ from a state ‘full’ due to fuel consumption by an engine.

Abstract: A selectively shielded and/or three-dimensional semiconductor device and a method of manufacturing thereof. For example and without limitation, various aspects of this disclosure provide a semiconductor device that comprises a composite plate for selective shielding and/or a three-dimensional embedded component configuration.

Abstract: In one example, a semiconductor device, comprises a substrate having a top side and a conductor on the top side of the substrate, an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, a lid covering a top side of the electronic device, and a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole. Other examples and related methods are also disclosed herein.