Patents by Inventor Keun Soo Kim

Keun Soo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11282763
    Abstract: In one example, a semiconductor device, includes a substrate having a top side and a conductor on the top side of the substrate, an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, a lid covering a top side of the electronic device, and a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: March 22, 2022
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Keun Soo Kim, Young Ik Kwon, Yu Jin Jeon, Mi Kyoung Choi
  • Patent number: 11215150
    Abstract: The fuel filling system of a fuel pump reservoir includes: a reservoir mounted in a fuel tank; a fuel pump mounted in the reservoir and configured to deliver the fuel in the reservoir to an engine and to discharge a portion of the fuel to a fuel branch line; a relief valve disposed on a fuel supply line and configured to release pressure applied to the fuel supply line; a first jet pump configured to fill the reservoir with the fuel using fuel jet flow from the fuel branch line; a second jet pump configured to fill the reservoir with the fuel using fuel jet flow from a fuel return line; and a fuel pump control module (FPCM) configured to control operation of the second jet pump based on a driving mode of a vehicle.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: January 4, 2022
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Keun Soo Kim, Jung Hoon Park, Dong Hyun Kim
  • Publication number: 20210293185
    Abstract: A valve system of a vehicle fuel pump includes: a reservoir cup disposed within a fuel tank storing fuel in the reservoir cup; a fuel pump configured to pump fuel from the reservoir cup to the engine while supplying fuel to a jet pump through a first discharge port; a jet pump configured to charge the reservoir cup with fuel by drawing fuel from the fuel tank by using a pressure of fuel supplied by the fuel pump; and a jet pump control valve disposed on the first discharge port and configured to control a flow of fuel discharged from the fuel pump to the jet pump.
    Type: Application
    Filed: November 24, 2020
    Publication date: September 23, 2021
    Inventors: Keun Soo Kim, Jung Hoon Park, Dong Hyun Kim
  • Patent number: 11121071
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: September 14, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • Publication number: 20210167264
    Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
    Type: Application
    Filed: February 9, 2021
    Publication date: June 3, 2021
    Applicant: NICHIA CORPORATION
    Inventors: Masafumi KURAMOTO, Satoru OGAWA, Katsuaki SUGANUMA, Keun-Soo KIM
  • Publication number: 20210101472
    Abstract: A valve system of a fuel system for a vehicle may close a jet pump-side flow path when a pressure of fuel supplied from a fuel pump to an engine is lower than a prescribed fuel pressure at engine start-up, and open the jet pump-side flow path when the pressure of fuel is equal to or higher than the prescribed fuel pressure at the engine start-up, thereby improving cold startability of an engine, and may also allow the jet pump-side flow path to be kept in an opened state between a low load region and a high load region of the engine after the engine start-up, thereby smoothly keeping a function of the jet pump after the engine start-up.
    Type: Application
    Filed: September 29, 2020
    Publication date: April 8, 2021
    Inventors: Keun Soo Kim, Jung Hoon Park, Dong Hyun Kim, Seung Kyun Lee
  • Patent number: 10950770
    Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: March 16, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Masafumi Kuramoto, Satoru Ogawa, Katsuaki Suganuma, Keun-Soo Kim
  • Patent number: 10947113
    Abstract: The present disclosure relates to a manufacturing method of a graphene fiber, a graphene fiber manufactured by the same method, and use thereof. The graphene fiber formed by using graphenes of linear pattern can be applied to various fields such as an electric wire and coaxial cable.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: March 16, 2021
    Assignee: GRAPHENE SQUARE INC.
    Inventors: Byung Hee Hong, Keun Soo Kim, Hyeong Keun Kim, Su Kang Bae
  • Publication number: 20200402885
    Abstract: In one example, a semiconductor device, comprises a substrate having a top side and a conductor on the top side of the substrate, an electronic device on the top side of the substrate connected to the conductor on the top side of the substrate via an internal interconnect, a lid covering a top side of the electronic device, and a thermal material between the top side of the electronic device and the lid, wherein the lid has a through-hole. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: June 24, 2019
    Publication date: December 24, 2020
    Applicant: Amkor Technology Korea, Inc.
    Inventors: Keun Soo Kim, Young Ik Kwon, Yu Jin Jeon, Mi Kyoung Choi
  • Publication number: 20200350241
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Application
    Filed: March 9, 2020
    Publication date: November 5, 2020
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • Patent number: 10794537
    Abstract: A system for filling an LPG vehicle with LPG using an auxiliary bombe is provided. The system may be configured for easily filling a main bombe with LPG even in the hot season (summertime) or the like during which the outside temperature rapidly rises, by using an auxiliary bombe in addition to using the main bombe. The system may also be capable of always smoothly refilling the main bombe with LPG by moving a portion of the LPG in the main bombe to the auxiliary bombe, when the pressure in the main bombe is higher than the LPG filling pressure of a filling gun in the hot season during which the outside temperature rapidly rises, so that the pressure in the main bombe becomes lower than the filling pressure.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: October 6, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Chang Han Kim, Jae Hwa Park, Jong Ki Kim, Jae Min Lee, Keun Soo Kim
  • Patent number: 10719209
    Abstract: An electronic device is provided. The electronic device includes a memory, a display, and a processor electrically connected to the memory and the display. The processor is configured to transparently output a first screen related to a first application, if receiving a user input, change a transparency of at least a partial area of the first screen in correspondence to the user input, and output the first screen on the display.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: July 21, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keun Soo Kim, Hyun Woong Kwon, Jeong Hoon Kim, Byung Hyuk Moon, Yong Kwon Kim, Jong Wu Baek
  • Publication number: 20200199261
    Abstract: Provided is an oxime ester phenylcarbazole compound useful as a photoinitiator for photocrosslinking. Specifically, the carbon atom forming a double bond with the nitrogen atom in the oxime ester moiety of the oxime ester phenylcarbazole compound is bonded to the phenylcarbazole group and is directly bonded to a (C1-C20)alkyl or (C6-C20)aryl group. Also provided is a photopolymerizable composition including the oxime ester phenylcarbazole compound. The oxime ester phenylcarbazole compound and the photopolymerizable composition have improved solubilities, are highly photosensitive, and exhibit excellent physical properties in terms of residual film ratio, pattern stability, resist adhesiveness. Due to these advantages, the oxime ester phenylcarbazole compound and the photopolymerizable composition are suitable for use in black resists, color resists, overcoats, column spacers, and organic insulating films of LCDs.
    Type: Application
    Filed: July 5, 2017
    Publication date: June 25, 2020
    Applicants: Korea Research Institute of Chemical Technology, TAKOMA TECHNOLOGY CO., LTD.
    Inventors: Chang Jin LEE, Jae Min LEE, Shahid AMEEN, Song Yun CHO, Sung Cheol YOON, Young Cheul LEE, Mi Sun RYU, Bok Joo SONG, Keun Soo KIM, So Youn NAM
  • Patent number: 10670188
    Abstract: A system for filling an LPG vehicle with LPG using an auxiliary bombe is provided. The system may be configured for easily filling a main bombe with LPG even in the hot season (summertime) or the like during which the outside temperature rapidly rises, by using an auxiliary bombe in addition to using the main bombe. The system may also be capable of always smoothly refilling the main bombe with LPG by moving a portion of the LPG in the main bombe to the auxiliary bombe, when the pressure in the main bombe is higher than the LPG filling pressure of a filling gun in the hot season during which the outside temperature rapidly rises, so that the pressure in the main bombe becomes lower than the filling pressure.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: June 2, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Chang Han Kim, Jae Hwa Park, Jong Ki Kim, Jae Min Lee, Keun Soo Kim
  • Patent number: 10586761
    Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: March 10, 2020
    Assignee: Amkor Technology, Inc.
    Inventors: Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park
  • Patent number: 10573795
    Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: February 25, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Masafumi Kuramoto, Satoru Ogawa, Katsuaki Suganuma, Keun-Soo Kim
  • Publication number: 20190326493
    Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 ?m to 15 ?m in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
    Type: Application
    Filed: June 25, 2019
    Publication date: October 24, 2019
    Applicant: NICHIA CORPORATION
    Inventors: Masafumi KURAMOTO, Satoru OGAWA, Katsuaki SUGANUMA, Keun-Soo KIM
  • Patent number: 10438758
    Abstract: A trunk switch module for a vehicle includes: a housing, of which a rear side is partially inserted into a trunk lid of the vehicle, having a mounting space at a front side of the housing; a trunk switch disposed in the mounting space to selectively open the trunk lid according to an operation of a user; a cover assembly attached to a front edge of the housing to close the opened front side of the housing, the cover assembly having a button sealing unit which corresponds to the trunk switch; a protection film attached to the front surface of the cover assembly; and an emblem mounted on the cover assembly at a front side of the protection film.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: October 8, 2019
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Won Ho Kim, Keun Soo Kim, Jong Il Shin
  • Patent number: 10428766
    Abstract: An apparatus for filling a liquefied petroleum gas (LPG) vehicle with LPG may include an auxiliary chamber disposed in an LPG bombe of the LPG vehicle, an auxiliary injection line branched from a fuelling line extending to the LPG bombe from a fuel inlet port for connection to the auxiliary chamber, a solenoid valve mounted in the auxiliary injection line to selectively allow or block a flow of LPG to the auxiliary chamber, a temperature sensor to detect a temperature in the bombe, and a controller to control the solenoid valve to be opened when the temperature detected by the temperature sensor is equal to or higher than a critical temperature.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: October 1, 2019
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Chang Han Kim, Jae Hwa Park, Jong Ki Kim, Jae Min Lee, Keun Soo Kim
  • Patent number: 10344917
    Abstract: A liquefied petroleum gas (LPG) filling system of a bi-fuel vehicle is provided. The LPG filling system may be configured for reducing the temperature and pressure in an LPG bombe for storing LPG in the case in which the external temperature is very high, e.g. in the hot season, whereby it is possible to easily refill the LPG bombe with LPG. The LPG filling system is configured to cool the inside of an LPG bombe and to reduce the vapor pressure of LPG by supplying some gasoline from a gasoline tank into the LPG bombe using the fact that the temperature of gasoline in the gasoline tank is lower than the temperature of LPG in the LPG bombe, whereby it is possible to easily refill the LPG bombe with LPG even in the case in which the external temperature is very high, e.g. in the hot season.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: July 9, 2019
    Assignee: Hyundai Motor Company
    Inventors: Chang Han Kim, Keun Soo Kim, Jong Ki Kim, Jin Su Jeong