Abstract: A self-heating sealant or adhesive may be formed using multi-compartment microcapsules dispersed within a sealant or adhesive. The multi-compartment microcapsules produce heat when subjected to a stimulus (e.g., a compressive force, a magnetic field, or combinations thereof). In some embodiments, the multi-compartment microcapsules have first and second compartments separated by an isolating structure adapted to rupture in response to the stimulus, wherein the first and second compartments contain reactants that come in contact and react to produce heat when the isolating structure ruptures. In some embodiments, the multi-compartment microcapsules are shell-in-shell microcapsules each having an inner shell contained within an outer shell, wherein the inner shell defines the isolating structure and the outer shell does not allow the heat-generating chemistry to escape the microcapsule upon rupture of the inner shell.

Abstract: A multi-compartment microcapsule produces heat when subjected to a stimulus (e.g., a compressive force, a magnetic field, or combinations thereof). In some embodiments, the multi-compartment microcapsules have first and second compartments separated by an isolating structure adapted to rupture in response to the stimulus, wherein the first and second compartments contain reactants that come in contact and react to produce heat when the isolating structure ruptures. In some embodiments, the multi-compartment microcapsules are shell-in-shell microcapsules each having an inner shell contained within an outer shell, wherein the inner shell defines the isolating structure and the outer shell does not allow the heat-generating chemistry to escape the microcapsule upon rupture of the inner shell.

Abstract: A self-heating thermal interface material (TIM) may be formed using heating components dispersed within the TIM. The heating components may produce heat when the TIM is compressed. The heating components may be formed from microcapsules and the microcapsules may contain exothermic reactants. The reactants may be isolated from contact within the microcapsule until a compressive force is applied.

Abstract: A circuit apparatuses include at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

Abstract: An apparatus and system for measuring electromagnetic radiation emitted by one or more electronic components included on a first substrate, and an associated method of controlling the emitted radiation. The apparatus includes a cap member having an interior surface and an exterior surface, the interior surface defining an interior cavity and arranged to receive at least a portion of the one or more electronic components within the interior cavity. The apparatus further includes at least one sensor device coupled with the cap member and configured to detect electromagnetic radiation emitted by the one or more electronic components. The apparatus further includes at least one conductive pad disposed on the cap member and coupled with the at least one sensor device, wherein the conductive pad is configured to couple with external circuitry to transmit a sensor signal generated by the at least one sensor device responsive to the detected electromagnetic radiation.

Abstract: An apparatus for providing security for an integrated circuit (IC) chip is disclosed. The apparatus may include the IC chip, attached to a surface of a printed circuit board (PCB). The PCB may include a first, electrically insulative, conformal coating layer attached to the PCB surface and to exposed IC chip surfaces. The PCB may also include a Wheatstone bridge circuit to indicate changes to a second, X-ray opaque, optically opaque and electrically resistive, conformal coating layer. The circuit may include four resistors, formed from second conformal coating layer regions, four sets of electrically conductive pads on the PCB, each set electrically connected to a resistor of the four resistors. The circuit may also include a voltage source, connected to two conductive pads and a monitoring device, connected to another two conductive pads and configured to detect a change of resistance of the Wheatstone bridge.

Abstract: A circuit apparatuses include at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

Abstract: A circuit apparatuses include at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.

Abstract: In an example, a method includes storing thermoset resin rheology data associated with a thermoset resin at a memory. The thermoset resin rheology data includes a plurality of sets of dynamic fluid flow properties that are measured for the thermoset resin. The method includes receiving, at a computing device, information associated with a printed circuit board (PCB) laminate design. The method also includes receiving, at the computing device, a first set of PCB lamination parameters. The method further includes storing, at the computing device, a first thermoset resin flow model. The first thermoset resin flow model is generated based on the thermoset resin rheology data, the information associated with the PCB laminate design, and the first set of PCB lamination parameters.

Abstract: An apparatus includes a spray module with at least one column of spray nozzles. Each spray nozzle is configured to deliver a processing substance on a semiconductor substrate during a process for semiconductor manufacturing as the semiconductor substrate moves past the spray module. The at least one column of spray nozzles is arranged with respect to a direction of travel of the semiconductor substrate so the semiconductor substrate passes the spray nozzles. A location module identifies a location of the semiconductor substrate with respect to the spray module. A spray pattern module determines a spray pattern of where a processing substance is to be delivered to the semiconductor substrate and a nozzle control module actuates each spray nozzle independently based on the spray pattern and a location of the semiconductor identified by the location module.

Abstract: In an example, an apparatus includes a biological analysis component and a control component. The biological analysis component is configured to obtain an expected biological sample value. The expected biological sample value indicates an expected concentration of a material biologically processed by a courier. The biological analysis component is further configured to determine whether a measured biological sample value is associated with the courier based on a comparison of the expected biological sample value to the measured biological sample value. The control component is configured to perform a first set of operations based on the result of the comparison indicating that the measured biological sample value is associated with the courier. The control component is configured to perform a second set of operations based on the result of the comparison indicating that the measured biological sample value is outside an acceptable range of the biological sample value.

Abstract: In an example, a method includes obtaining an expected biological sample value at a computing device. The expected biological sample value indicates an expected concentration of a material biologically processed by a courier. The computing device determines whether the measured biological sample value is associated with the courier based on a comparison of the expected biological sample value to the measured biological sample value. The method also includes determining a particular set of operations to be performed at the computing device based on a result of the comparison.

Abstract: An apparatus for providing security for an integrated circuit (IC) chip is disclosed. The apparatus may include the IC chip, attached to a surface of a printed circuit board (PCB). The PCB may include a first, electrically insulative, conformal coating layer attached to the PCB surface and to exposed IC chip surfaces. The PCB may also include a Wheatstone bridge circuit to indicate changes to a second, X-ray opaque, optically opaque and electrically resistive, conformal coating layer. The circuit may include four resistors, formed from second conformal coating layer regions, four sets of electrically conductive pads on the PCB, each set electrically connected to a resistor of the four resistors. The circuit may also include a voltage source, connected to two conductive pads and a monitoring device, connected to another two conductive pads and configured to detect a change of resistance of the Wheatstone bridge.

Abstract: An apparatus for providing security for an integrated circuit (IC) chip is disclosed. The apparatus may include the IC chip, attached to a surface of a printed circuit board (PCB). The PCB may include a first, electrically insulative, conformal coating layer attached to the PCB surface and to exposed IC chip surfaces. The PCB may also include a Wheatstone bridge circuit to indicate changes to a second, X-ray opaque, optically opaque and electrically resistive, conformal coating layer. The circuit may include four resistors, formed from second conformal coating layer regions, four sets of electrically conductive pads on the PCB, each set electrically connected to a resistor of the four resistors. The circuit may also include a voltage source, connected to two conductive pads and a monitoring device, connected to another two conductive pads and configured to detect a change of resistance of the Wheatstone bridge.

Abstract: An apparatus for providing security for an integrated circuit (IC) chip is disclosed. The apparatus may include the IC chip, attached to a surface of a printed circuit board (PCB). The PCB may include a first, electrically insulative, conformal coating layer attached to the PCB surface and to exposed IC chip surfaces. The PCB may also include a Wheatstone bridge circuit to indicate changes to a second, X-ray opaque, optically opaque and electrically resistive, conformal coating layer. The circuit may include four resistors, formed from second conformal coating layer regions, four sets of electrically conductive pads on the PCB, each set electrically connected to a resistor of the four resistors. The circuit may also include a voltage source, connected to two conductive pads and a monitoring device, connected to another two conductive pads and configured to detect a change of resistance of the Wheatstone bridge.

Abstract: A system for use with optical and electrical signaling is disclosed. The system may include a printed circuit board (PCB) that includes a plurality of layers vertically stacked between a first face and a second face and a first optical signal transmission path within a first internal layer of the plurality of layers. The PCB may also include an electrical signal transmission path and a via extending through the plurality of layers. The via may include a first reflective surface that is configured to reflect light between the first optical signal transmission path and an opening of the via on the first face and an electrically conductive material that is configured to electrically connect the electrical signal transmission path to a portion of the via on the first face.

Abstract: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip.

Abstract: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip, and a heat removal device thermally connected to the thermal interface material pad.

Abstract: A system for use with optical and electrical signaling is disclosed. The system may include a printed circuit board (PCB) that includes a plurality of layers vertically stacked between a first face and a second face and a first optical signal transmission path within a first internal layer of the plurality of layers. The PCB may also include an electrical signal transmission path and a via extending through the plurality of layers. The via may include a first reflective surface that is configured to reflect light between the first optical signal transmission path and an opening of the via on the first face and an electrically conductive material that is configured to electrically connect the electrical signal transmission path to a portion of the via on the first face.

Abstract: The method includes applying a magnetic etching ferrofluid, that contains an aqueous etchant solution within one or more reverse micelles responsive to a magnetic field, onto the substrate at a first depth. The method also includes creating a magnetic field at a first strength that causes the reverse micelle to move in a first direction at a first rate. The method also includes determining whether the substrate is at a second depth. The method also includes reducing, in response to the substrate being at a second depth, the magnetic field to a second strength to cause the reverse micelle to move in the first direction at a second rate.