Abstract: A representation of a surface of one or more objects is positioned in a virtual space is obtained in a computer animation system. Thereafter, a guide curve specification of a guide curve in the virtual space relative to the surface is received. Thereafter, the computer animation system computes a first set of tangent vector values for differentiable locations along the guide curve and computes a second set of tangent vector values for nondifferentiable locations along the guide curve. Using the first set and second set, the computer animation system computes a third set of tangent vector values for locations on the surface other than locations along the guide curve and computes a tangent vector field over the surface from at least the first set of tangent vector values, the second set of tangent vector values, and the third set of tangent vector values.

Abstract: A representation of a surface of one or more objects is positioned in a virtual space is obtained in a computer animation system. Thereafter, a guide curve specification of a guide curve in the virtual space relative to the surface is received. Thereafter, the computer animation system computes a first set of tangent vector values for differentiable locations along the guide curve and computes a second set of tangent vector values for nondifferentiable locations along the guide curve. Using the first set and second set, the computer animation system computes a third set of tangent vector values for locations on the surface other than locations along the guide curve and computes a tangent vector field over the surface from at least the first set of tangent vector values, the second set of tangent vector values, and the third set of tangent vector values.

Abstract: A representation of a surface of one or more objects is positioned in a virtual space is obtained in a computer animation system. Thereafter, a guide curve specification of a guide curve in the virtual space relative to the surface is received. Thereafter, the computer animation system computes a first set of tangent vector values for differentiable locations along the guide curve and computes a second set of tangent vector values for nondifferentiable locations along the guide curve. Using the first set and second set, the computer animation system computes a third set of tangent vector values for locations on the surface other than locations along the guide curve and computes a tangent vector field over the surface from at least the first set of tangent vector values, the second set of tangent vector values, and the third set of tangent vector values.

Abstract: A variable size marker or sizer for garment hangers is disclosed. A gear-shaped wheel with cogs has various size indicia on each cog, and is inserted into a hanger to display the correct size indicia. The hanger has tabs to retain the sizer in place by mating with slits in the sizer. For example, if a displayed garment is size ‘large’, the user chooses the cog with “L” facing upwardly, and inserts the sizer into the hanger through the bottom of the hanger until the hanger's tabs click into the sizer's slits corresponding with the “L”. The “L” is then visible at the top of the hanger. The hanger is made of resilient material to flex outwardly to allow the sizer to be inserted and removed, yet hold the sizer in place when the hanger is in use.

Abstract: A variable size marker or sizer for garment hangers is disclosed. A gear-shaped wheel with cogs has various size indicia on each cog, and is inserted into a hanger to display the correct size indicia. The hanger has tabs to retain the sizer in place by mating with slits in the sizer. For example, if a displayed garment is size ‘large’, the user chooses the cog with “L” facing upwardly, and inserts the sizer into the hanger through the bottom of the hanger until the hanger's tabs click into the sizer's slits corresponding with the “L”. The “L” is then visible at the top of the hanger. The hanger is made of resilient material to flex outwardly to allow the sizer to be inserted and removed, yet hold the sizer in place when the hanger is in use.

Abstract: A garment manikin (mannequin) limb catcher to prevent damage to manikin limbs caused by accidental bumps once the limb is attached to a manikin torso. In situations where a manikin limb is attached to a torso by magnets, a bump to the limb can break the magnetic holding force, thus causing the limb to fall. This invention describes a limb with lead-in pin that has a bent tip, the pin being inserted into a hole on the torso. If bumped, the bent tip will catch on the hole's rim and prevent the limb from falling. In another variant, the torso can have the lead-in pin with a bend, and the limb has a hole. The pin with a bent tip acts as a catching element, and the hole acts as a stopping element.

Abstract: Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniques or fixtures allow application of monolithic semiconductor wafer processing for interconnecting different die. High density I/O connections between different IC die can be obtained using structures and techniques for aligning vias to I/O structures, and programmably routing IC I/O lines to appropriate vias. Existing IC die can be retrofitted for such interconnection to other IC die, such as by using similar techniques or tools.

Abstract: Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniques or fixtures allow application of monolithic semiconductor wafer processing for interconnecting different die. High density I/O connections between different IC die can be obtained using structures and techniques for aligning vias to I/O structures, and programmably routing IC I/O lines to appropriate vias. Existing IC die can be retrofitted for such interconnection to other IC die, such as by using similar techniques or tools.

Abstract: A manikin (mannequin) with limbs that magnetically attach to the torso by an assembly of an attach base mounted on the torso and a lead-in base on the limb. Magnets of one Pole are accommodated within the attach base, and of the opposite Pole within the lead-in base. The magnets attract corresponding magnets of the opposite Pole, facilitating self-aligning of the magnets, whose depth-of-pull force is not over 80 Gauss. The attach and lead-in bases can regulate the attraction force via a layer of flux shield over the magnets for various applications. Attach and lead-in bases have complimentary guiding means to give an assembler a sense of touch through fabric to understand where the limbs are with respect to the torso when forming a joint. The lead-in pin hooks the limb into the torso, allowing limbs to pivot and return to their original position if bumped.

Abstract: Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniques or fixtures allow application of monolithic semiconductor wafer processing for interconnecting different die. High density I/O connections between different IC die can be obtained using structures and techniques for aligning vias to I/O structures, and programmably routing IC I/O lines to appropriate vias. Existing IC die can be retrofitted for such interconnection to other IC die, such as by using similar techniques or tools.

Abstract: A manikin (mannequin) with limbs that magnetically attach to the torso by an assembly of an attach base mounted on the torso and a lead-in base on the limb. Magnets of one Pole are accommodated within the attach base, and of the opposite Pole within the lead-in base. The magnets attract corresponding magnets of the opposite Pole, thus facilitating self-aligning action of the magnets, whose depth-of-pull force is not more then 80 Gauss. The attach and lead-in bases have regulating force means, being a layer of flux shield placed over the magnets, that can adjust the attachment force of the magnets for different situations. The flux shield controls magnetic flux density and attachment force of the magnets. Attach and lead-in bases are provided with a complimentary guiding means to give an assembler a sense of touch through fabric to understand where a terminus of the limbs is with respect to the torso when forming a joint.

Abstract: Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniques or fixtures allow application of monolithic semiconductor wafer processing for interconnecting different die. High density I/O connections between different IC die can be obtained using structures and techniques for aligning vias to I/O structures, and programmably routing IC I/O lines to appropriate vias. Existing IC die can be retrofitted for such interconnection to other IC die, such as by using similar techniques or tools.

Abstract: Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniques or fixtures allow application of monolithic semiconductor wafer processing for interconnecting different die. High density I/O connections between different IC die can be obtained using structures and techniques for aligning vias to I/O structures, and programmably routing IC I/O lines to appropriate vias. Existing IC die can be retrofitted for such interconnection to other IC die, such as by using similar techniques or tools.