Abstract: Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniques or fixtures allow application of monolithic semiconductor wafer processing for interconnecting different die. High density I/O connections between different IC die can be obtained using structures and techniques for aligning vias to I/O structures, and programmably routing IC I/O lines to appropriate vias. Existing IC die can be retrofitted for such interconnection to other IC die, such as by using similar techniques or tools.

Abstract: Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniques or fixtures allow application of monolithic semiconductor wafer processing for interconnecting different die. High density I/O connections between different IC die can be obtained using structures and techniques for aligning vias to I/O structures, and programmably routing IC I/O lines to appropriate vias. Existing IC die can be retrofitted for such interconnection to other IC die, such as by using similar techniques or tools.

Abstract: Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniques or fixtures allow application of monolithic semiconductor wafer processing for interconnecting different die. High density I/O connections between different IC die can be obtained using structures and techniques for aligning vias to I/O structures, and (programmably routing IC I/O lines to appropriate vias. Existing IC die can be retrofitted for such interconnection to other IC die, such as by using similar techniques or tools.

Abstract: Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniques or fixtures allow application of monolithic semiconductor wafer processing for interconnecting different die. High density I/O connections between different IC die can be obtained using structures and techniques for aligning vias to I/O structures, and (programmably routing IC I/O lines to appropriate vias. Existing IC die can be retrofitted for such interconnection to other IC die, such as by using similar techniques or tools.

Abstract: Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniques or fixtures allow application of monolithic semiconductor wafer processing for interconnecting different die. High density I/O connections between different IC die can be obtained using structures and techniques for aligning vias to I/O structures, and programmably routing IC I/O lines to appropriate vias. Existing IC die can be retrofitted for such interconnection to other IC die, such as by using similar techniques or tools.

Abstract: Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniques or fixtures allow application of monolithic semiconductor wafer processing for interconnecting different die. High density I/O connections between different IC die can be obtained using structures and techniques for aligning vias to I/O structures, and programmably routing IC I/O lines to appropriate vias. Existing IC die can be retrofitted for such interconnection to other IC die, such as by using similar techniques or tools.

Abstract: A field-programmable object array integrated circuit employs a course gain architecture comprising a core array of highly optimized silicon objects that are individually programmed and synchronously connected via high performance parallel communications structures permitting the user to configure the device to implement a variety of very high performance algorithms. The high level functions available in the objects combined with the unique interconnect structures enables performance superior to existing field programmable solutions while maintaining and enhancing the flexibility. A consistent peripheral “donut” structure around the core of each object makes them interchangeable to build up complex circuits without redesign of standard objects.

Abstract: Techniques for achieving linear monotonic output power with piecewise non-linear and/or non-monotonic circuits are described. A coarse gain is selected for a first circuit having non-linear and/or non-monotonic characteristics. A fine gain is selected for a second circuit used to account for output power error due to the coarse gain. First and second look-up tables may store output power versus gain for the first and second circuits, respectively. An output power in the first look-up table may be selected based on the requested output power, and the gain corresponding to the selected output power may be provided as the coarse gain. An output power in the second look-up table may be selected based on the output power error, and the gain corresponding to the selected output power may be provided as the second gain.

Abstract: The invention is directed to a tracking system for tracking the use of an object on a work piece within a predetermined work space comprising a target, at least one video imaging source and a computer. The target is attached to the object and calibrated to derive an “Object Tracking Point”. Each target has a predetermined address space and a predetermined anchor. At least one video imaging source is arranged such that the work piece is within the field of view. Each video imaging source is adapted to record images within its field of view. The computer is for receiving the images from each video imaging source and comparing the images with the predetermined anchor and the predetermined address, calculating the location of the target and the tool attached thereto in the work space relative to the work piece.

Abstract: An apparatus and method of (input/output) I/O design, utilizing a predetermined relationship, whereby the outer ring area of an integrated circuit die are set aside for the I/O circuits which are contained in I/O cells. The height of the I/O cell is first reduced from the prior art cell heights, and the width of the cell is then varied according to the particular need of the circuit. When the drive strength of the I/O circuit is high, and the circuit is more complicated, a wider cell is assigned. Conversely, for a circuit that is relatively simple, a narrower cell will be assigned. Each I/O cell has one associated bonding pad which is placed directly below the starting point of that cell. The height of the cells may also be varied on each side of the chip in order to be able to place more I/O cells along one or more sides or edges of the chip.

Abstract: An apparatus and method of (input/output) I/O design, utilizing a predetermined relationship, whereby the outer ring area of an integrated circuit die are set aside for the I/O circuits which are contained in I/O cells. The height of the I/O cell is first reduced from the prior art cell heights, and the width of the cell is then varied according to the particular need of the circuit. When the drive strength of the I/O circuit is high, and the circuit is more complicated, a wider cell is assigned. Conversely, for a circuit that is relatively simple, a narrower cell will be assigned. Each I/O cell has one associated bonding pad which is placed directly below the starting point of that cell. The height of the cells may also be varied on each side of the chip in order to be able to place more I/O cells along one or more sides or edges of the chip.

Abstract: An aerodynamic toy adapted for spinning and throwing having a cylindrical ring with at least one retaining element thereon and a tether for engaging at least one of the retaining elements, which tether can be also gripped by the thrower's hand to enable the thrower to impart a spin to the ring thereby moving the toy in a forward direction generally parallel to the axis of spin. The spin of the cylindrical toy imparts an inertial stability and the cylindrical shape causes the ring to glide through the air over great distances.