Patents by Inventor Kevin B. Leigh

Kevin B. Leigh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150079815
    Abstract: A socket (130) employs a substrate (310) including a conductive network. As array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138) and the first contacts (136) include a roused first contact (136?) that the conductive network routes horizontally in or on the substrate (310).
    Type: Application
    Filed: April 30, 2012
    Publication date: March 19, 2015
    Inventors: Kevin B. Leigh, George D. Megason
  • Publication number: 20150063771
    Abstract: Connectors of a first removable modular optical connection assembly, having a first predefined arrangement of optical signal conduits, are connected to respective connectors on a support structure that are optically connected to corresponding devices. The first modular optical connection assembly is replaceable with a second modular optical connection assembly having a second, different predefined arrangement of optical signal conduits, to change a topology of a network.
    Type: Application
    Filed: March 14, 2012
    Publication date: March 5, 2015
    Inventors: Jeffrey Clifford Mogul, Dwight L. Barron, Kevin B. Leigh, Jayaram Mudigonda, Praveen Yalagandula, Guodong Zhang, Terrel Morris
  • Publication number: 20150058511
    Abstract: A system of implementing devices in a system. At least some of the illustrative embodiments are systems comprising a plurality of devices of a first type coupled to a coupling medium, and a first and second slots (where each slot enables coupling of a device of a second type to the coupling medium). The first and second slots accept second type devices one each in each slot, and the first and second slots accept a single device spanning both slots.
    Type: Application
    Filed: October 31, 2014
    Publication date: February 26, 2015
    Inventor: Kevin B. LEIGH
  • Patent number: 8964384
    Abstract: Embodiments provide methods, apparatuses, and systems for providing a cooling flow to a component. In various examples, a chip socket may include a cavity configured to couple to the component. The chip socket may include a first channel and a second channel. The first channel may act as an ingress channel while the second channel may act as an egress channel. The ingress and egress channels may be configured to facilitate cooling of the component.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: February 24, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B Leigh, George D Megason
  • Patent number: 8948166
    Abstract: A system of implementing switch devices in a server system. At least some of the illustrative embodiments are systems comprising a plurality of servers coupled to a midplane board, and a first and second switch slots (where each switch slot enables coupling of a switch device to the midplane board). The first and second switch slots accept switch devices one each in each switch slot, and the first and second switch slots accept a single switch device spanning both switch slots.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: February 3, 2015
    Assignee: Hewlett-Packard Development Company, LP.
    Inventor: Kevin B. Leigh
  • Publication number: 20150029495
    Abstract: A diagnostic module may include an inspection device, a cleaning device, and in various other examples, a verification device. The inspection device may inspect an optical fiber end-face of an optical fiber. The cleaning device may clean the optical fiber end-face of the optical fiber. The diagnostic module may automatically move from an optical connector to another optical connector.
    Type: Application
    Filed: March 8, 2012
    Publication date: January 29, 2015
    Inventors: Kevin B. Leigh, George D. Megason
  • Publication number: 20150016783
    Abstract: An electrical/optical connector system can include a first circuit board with a floating optical connector and a first electrical contact and a second circuit board with a second optical connector to blind mate with the floating optical connector and a second electrical contact to blind mate with the first electrical contact.
    Type: Application
    Filed: April 25, 2012
    Publication date: January 15, 2015
    Inventors: Kevin B. Leigh, George D. Megason, Paul K. Rosenberg
  • Patent number: 8922981
    Abstract: A user interface (UI) device is disclosed. The UI device has two displays (106 and 108) that can be moved between a first position and a second position. In the first position the two displays (106 and 108) are side-by-side and the display surface for each of the two displays forms a common plane. In the second position the display surfaces face away from each other.
    Type: Grant
    Filed: October 4, 2010
    Date of Patent: December 30, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B. Leigh, Belgie B. McClelland, Keith J. Kuehn
  • Publication number: 20140369653
    Abstract: In the present idsclosure inter-rack optical plenum may be used to route optical fibers between multiple racks of a system. An intra-rack optical plenum may be coupled to one of the racks and the inter-rack optical plenum. The intra-rack optical plenum may route an optical fiber between a first connector configured to mate with a first device and a second connector conifugred to mate with the inter-rack optical plenum.
    Type: Application
    Filed: April 11, 2012
    Publication date: December 18, 2014
    Inventors: Kevin B. Leigh, George D Megason, David W. Sherrod
  • Publication number: 20140369654
    Abstract: A plurality of connector modules are mounted to a support frame. The connector modules have respective optical connectors to optically connect with respective electronic devices, where the optical connectors are moveable between a retracted position and an extended position. The optical connector of a first of the connector modules is retractable and extendable independently of a second of the connector modules.
    Type: Application
    Filed: January 6, 2012
    Publication date: December 18, 2014
    Inventors: George D. Magason, Kevin B. Leigh, David W. Sherrod
  • Publication number: 20140334783
    Abstract: A connector module includes a module optical connector and an engagement member to engage with a device having a device optical connector. The engagement member upon engagement with the device is to cause movement of the module optical connector towards the device optical connector.
    Type: Application
    Filed: January 6, 2012
    Publication date: November 13, 2014
    Inventors: George D. Megason, Kevin B. Leigh, Everett R. Salinas
  • Publication number: 20140334782
    Abstract: A modular connector infrastructure includes device connector modules having optical connectors to optically connect to respective subsets of electronic devices in a system. The device connector modules are removably connected to the electronic devices.
    Type: Application
    Filed: January 6, 2012
    Publication date: November 13, 2014
    Inventors: Kevin B. Leigh, George D. Megason, David W. Sherrod, Christopher C. Wanner
  • Publication number: 20140334779
    Abstract: An optical blind-mate connector can include a housing that holds a ferrule block, a carrier coupled to the housing, a reversibly retractable sleeve including a sleeve tab extending therefrom, to receive a force to transition the reversibly retractable sleeve from an extended position to a retracted position, and a door coupled to the reversibly retractable sleeve, the door having a closed position and an open position, wherein in the extended position the door is in the closed position to cover a portion of the ferrule block and in the retracted position the door is in the open position to uncover the portion of the ferrule block.
    Type: Application
    Filed: February 24, 2012
    Publication date: November 13, 2014
    Inventors: George D. Megason, Kevin B. Leigh
  • Publication number: 20140321810
    Abstract: A connector module includes a detection circuit. The connector module may also include an alignment detector. In various examples, the detection circuit is to detect presence of a connector, and the alignment detector is to detect alignment of a plurality of ferrules within the connector module.
    Type: Application
    Filed: January 31, 2012
    Publication date: October 30, 2014
    Inventors: Kevin B. Leigh, George D. Megason
  • Publication number: 20140314417
    Abstract: An optical connection infrastructure has optical conduits between first devices and at least one second device. Dynamic reconfiguration of the optical connection infrastructure can be performed from a first connection topology to a second, different connection topology based on programming of the first devices.
    Type: Application
    Filed: April 12, 2012
    Publication date: October 23, 2014
    Inventors: Kevin B. Leigh, David Jay Koenen, Guodong Zhang, Michael Steven Schlansker, Jean Tourrilhes, Gary William Thome, Ian Moray McLaren
  • Publication number: 20140315435
    Abstract: A multi-chip socket includes a first cavity having a first support surface to support a first component including a first chip, the first support surface arranged to contact and support the first chip. A second cavity has a second support surface to support a second component including a second chip, the second support surface arranged to contact and support the second chip. The first support surface is in a first plane, and the second support surface is in a second plane, where the first plane is angled with respect to the second plane.
    Type: Application
    Filed: July 3, 2014
    Publication date: October 23, 2014
    Inventors: Kevin B. Leigh, George D. Megason
  • Publication number: 20140313686
    Abstract: A multi-chip socket including multiple cavities. The multiple cavities include support surfaces. The support surfaces may be disposed at different heights relative to a reference plane. A first thermal interface is to thermally contact a top surface of the first component, and a second thermal interface is to thermally contact a top surface of the second component.
    Type: Application
    Filed: July 3, 2014
    Publication date: October 23, 2014
    Inventors: Kevin B. Leigh, George D. Megason
  • Patent number: 8864388
    Abstract: A system includes an external faceplate including a blind-mate connector and a swing arm removably connected to the blind-mate connector. The swing arm secures the blind-mate connector to an electronic device.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: October 21, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B. Leigh, George D. Megason, Guodong Zhang
  • Publication number: 20140301701
    Abstract: A plurality of connector modules are disclosed. The connector modules have respective various indicia including topside indicia to indicate orientation and ferrule indicia to indicate ferrule position. Ferrules may be removably inserted into the connector modules, and may include seated indicia that indicates if the ferrules are seated.
    Type: Application
    Filed: January 31, 2012
    Publication date: October 9, 2014
    Inventors: Kevin B. Leigh, George D. Megason
  • Patent number: 8779578
    Abstract: A multi-chip socket includes multiple cavities. The multiple cavities include support surfaces. The support surfaces may be disposed at different heights relative to a reference plane. The different heights may be based on a height of a first component to be disposed in the first cavity and a height of a second component to be disposed in a second cavity.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: July 15, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B. Leigh, George D. Megason