Patents by Inventor Kevin B. Leigh

Kevin B. Leigh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flow Control for a Serial Peripheral Interface Bus
    Publication number: 20140115209
    Abstract: Systems and methods for flow control within a Serial Peripheral Interface without additional signal lines are included herein. In one example, a method includes generating a flow control command. The method also includes sending the flow control command from a master device to a slave device with a Serial Peripheral Interface. In addition, the method includes sending a memory address from the master device to the slave device. Furthermore, the method includes detecting a ready indicator in the master device. The method also includes waiting to receive a ready indicator and communicating with the slave device in response to the ready indicator.
    Type: Application
    Filed: October 18, 2012
    Publication date: April 24, 2014
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: David F. Heinrich, Theodore F. Emerson, Kevin B. Leigh, Vincent Nguyen, Andrew Brown, Gary Thome
  • Blade device enclosure
    Patent number: 8670241
    Abstract: A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device.
    Type: Grant
    Filed: May 15, 2008
    Date of Patent: March 11, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David W. Sherrod, Kevin B. Leigh, Jonathan E. JamesOu, Kurt A. Manweiler, Joseph R. Allen, Tuan A. Pham
  • COMPONENT COOLING
    Publication number: 20140030900
    Abstract: Embodiments provide methods, apparatuses, and systems for providing a cooling flow to a component. In various examples, a chip socket may include a cavity configured to couple to the component. The chip socket may include a first channel and a second channel. The first channel may act as an ingress channel while the second channel may act as an egress channel. The ingress and egress channels may be configured to facilitate cooling of the component.
    Type: Application
    Filed: July 27, 2012
    Publication date: January 30, 2014
    Inventors: Kevin B. Leigh, George D. Megason
  • MULTI-CHIP SOCKET
    Publication number: 20140002979
    Abstract: Embodiments provide a multi-chip socket including multiple cavities. The multiple cavities include support surfaces. The support surfaces may be disposed at different heights relative to a reference plane. The different heights may be determined in response to a height of a first component to be disposed in the first cavity and a height of a second component to be disposed in a second cavity.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 2, 2014
    Inventors: Kevin B. Leigh, George D. Megason
  • FACEPLATE APPARATUS AND SYSTEM FOR COUPLING TO AN ELECTRONIC DEVICE
    Publication number: 20130294730
    Abstract: A system includes an external faceplate including a blind-mate connector and a swing arm removably connected to the blind-mate connector. The swing arm secures the blind-mate connector to an electronic device.
    Type: Application
    Filed: May 1, 2012
    Publication date: November 7, 2013
    Inventors: Kevin B. LEIGH, George D. MEGASON, Guodong ZHANG
  • RACK MOUNTED UI DEVICE
    Publication number: 20130114197
    Abstract: A user interface (UI) demo is disclosed. The UT device has two displays (106 and 108) that can be moved between a first position and a second position, In the first position the two displays (106 and 108) are side-by-side and the display surface for each of the two displays forms a common plane. In the second position the display surfaces face away from each other.
    Type: Application
    Filed: October 4, 2010
    Publication date: May 9, 2013
    Inventors: Kevin B. Leigh, Belgie B. McClelland, Keith J. Kuehn
  • Controller receiving a configuration command while receiving an auxiliary supply voltage
    Patent number: 8205016
    Abstract: In at least some embodiments, a system comprises a plurality of electrical devices and management logic coupled to the electrical devices. While the electrical devices are each in a pre-boot environment, the management logic obtains information from the electrical devices and uses the information to determine electrical compatibility of, and/or configure, the electrical devices.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: June 19, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B. Leigh, Paul R. Culley, Kevin G. Depew, Andrew Brown, Daniel N. Cripe, Jeffrey R. Hilland
  • Reconfigurable I/O card pins
    Patent number: 8037223
    Abstract: In accordance with the present technique, a system and method for configuring pins of an input/output (I/O) card in a host system are provided. The method includes reading configuration information from a card field replaceable unit memory and reading system configuration information from a system field replaceable unit memory. Additionally, the method includes configuring pins of a system logic of the host system to be compatible with the I/O device of the I/O card, and configuring pins of an I/O device on the I/O card to in turn configure the pins of the I/O card with a configuration setting compatible with the host system.
    Type: Grant
    Filed: June 13, 2007
    Date of Patent: October 11, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B. Leigh, John D. Nguyen, James R. Duncan, Binh Nguyen
  • Server infrastructure having independent backplanes to distribute power and to route signals
    Patent number: 8009438
    Abstract: Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: August 30, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B. Leigh, Jonathan E. James Ou, David W. Sherrod, Kurt A. Manweiler, Miles B. Reyes, Gregory L. Gibson, Stephen A. Kay, Vincent W. Michna
  • DETERMINING ELECTRICAL COMPATIBILITY AND/OR CONFIGURATION OF DEVICES IN A PRE-BOOT ENVIRONMENT
    Publication number: 20110161651
    Abstract: In at least some embodiments, a system comprises a plurality of electrical devices and management logic coupled to the electrical devices. While the electrical devices are each in a pre-boot environment, the management logic obtains information from the electrical devices and uses the information to determine electrical compatibility of, and/or configure, the electrical devices.
    Type: Application
    Filed: March 11, 2011
    Publication date: June 30, 2011
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B. LEIGH, Paul R. Culley, Kevin G. Depew, Andrew Brown, Daniel N. Cripe, Jeffrey R. Hilland
  • Determining electrical compatibility and/or configuration of devices in a pre-boot environment
    Patent number: 7930440
    Abstract: In at least some embodiments, a system comprises a plurality of electrical devices and management logic coupled to the electrical devices. While the electrical devices are each in a pre-boot environment, the management logic obtains information from the electrical devices and uses the information to determine electrical compatibility of, and/or configure, the electrical devices.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: April 19, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B. Leigh, Paul R. Culley, Kevin G. Depew, Andrew Brown, Daniel N. Cripe, Jeffrey R. Hilland
  • MODULAR SYSTEM AND RETRACTABLE ASSEMBLY FOR ELECTRONIC DEVICES
    Publication number: 20110007464
    Abstract: A retractable assembly for electronic devices can include at least one retractable device configured to extend from and retract into a frame. The retractable device can be configured to hold at least one electronic device. The retractable assembly also can include a connection device configured to form an interface between at least one of the electronic device and the retractable device and at least one of the frame and a component of a modular system for housing the retractable assembly. The connection - device can be configured to maintain the interface when the retractable device is both extended from and retracted into the frame. A modular system can be configured to house multiple retractable assemblies.
    Type: Application
    Filed: February 29, 2008
    Publication date: January 13, 2011
    Inventor: Kevin B. Leigh
  • Configurable backplane connectivity for an electrical device
    Patent number: 7793089
    Abstract: A method comprises obtaining connectivity information from a plurality of electrical devices. Each such electrical device is separately coupled to a backplane, and at least one electrical device comprises a plurality of electrical interfaces adapted to be selectively coupled to each of multiple other electrical devices. Based on connectivity information from the at least one electrical device, the method further comprises providing configuration information to the at least one electrical device to cause the at least one electrical device to electrically couple to a target other electrical device via the backplane.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: September 7, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B. Leigh, Michael L. Sabotta, Albert H. Chang
  • System having primary and secondary backplanes
    Patent number: 7780455
    Abstract: A system comprises a primary backplane and a secondary backplane. The primary backplane has a surface region substantially devoid of components and a plurality of connectors to which electronic devices can be mated. The secondary backplane is removably mated to the primary backplane within the region. The secondary backplane has at least two connectors adapted to mate to at least two of the electronic devices. At least two electronic devices communicatively interconnect through the primary and secondary backplanes.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: August 24, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B. Leigh, David W. Sherrod, Kurt A. Manweiler
  • Comparing characteristics prior to booting devices
    Patent number: 7783876
    Abstract: A system that comprises a first electronic device comprising a non-volatile memory. The system also comprises another electronic device in communication with the first electronic device and comprising a second non-volatile memory. The system further comprises a control logic coupled to the first and second electronic devices. Each of the non-volatile memories stores electrical characteristics associated with a corresponding electronic device. Prior to booting up the first or second electronic device, the control logic obtains and compares at least some of the electrical characteristics and disables the communication as a result of the comparison.
    Type: Grant
    Filed: May 1, 2007
    Date of Patent: August 24, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Paul R. Culley, Kevin B. Leigh
  • System and method to conjoin blade modules
    Patent number: 7623356
    Abstract: Embodiments of the present technique are directed to a blade system. The blade system may include a first blade module comprising a first conjoining channel, and a second blade module comprising a second conjoining channel aligned with the first conjoining channel, wherein the first blade module and the second blade module are symmetrical and mechanically coupled to form a conjoined blade, wherein electrical components of the first blade module and electrical components of the second blade module are electrically coupled via an electrical coupler routed through the aligned first conjoining channel and second conjoining channel.
    Type: Grant
    Filed: April 25, 2007
    Date of Patent: November 24, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B. Leigh, Thomas T. Hardt, Timothy A. McCree
  • Reconfigurable I/O card pins
    Publication number: 20080313381
    Abstract: In accordance with the present technique, a system and method for configuring pins of an input/output (I/O) card in a host system are provided. The method includes reading configuration information from a card field replaceable unit memory and reading system configuration information from a system field replaceable unit memory. Additionally, the method includes configuring pins of a system logic of the host system to be compatible with the I/O device of the I/O card, and configuring pins of an I/O device on the I/O card to in turn configure the pins of the I/O card with a configuration setting compatible with the host system.
    Type: Application
    Filed: June 13, 2007
    Publication date: December 18, 2008
    Inventors: Kevin B. Leigh, John D. Nguyen, James R. Duncan, Binh Nguyen
  • Blade Device Enclosure
    Publication number: 20080310097
    Abstract: A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device.
    Type: Application
    Filed: May 15, 2008
    Publication date: December 18, 2008
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: David W. Sherrod, Kevin B. Leigh, Jonathan E. JamesOu, Kurt A. Manweiler, Joseph R. Allen, Tuan A. Pham
  • COMPARING CHRACTERISTICS PRIOR TO BOOTING DEVICES
    Publication number: 20080276082
    Abstract: A system that comprises a first electronic device comprising a non-volatile memory. The system also comprises another electronic device in communication with the first electronic device and comprising a second non-volatile memory. The system further comprises a control logic coupled to the first and second electronic devices. Each of the non-volatile memories stores electrical characteristics associated with a corresponding electronic device. Prior to booting up the first or second electronic device, the control logic obtains and compares at least some of the electrical characteristics and disables the communication as a result of the comparison.
    Type: Application
    Filed: May 1, 2007
    Publication date: November 6, 2008
    Inventors: Paul R. Culley, Kevin B. Leigh
  • System and method to conjoin blade modules
    Publication number: 20080266815
    Abstract: Embodiments of the present technique are directed to a blade system. The blade system may include a first blade module comprising a first conjoining channel, and a second blade module comprising a second conjoining channel aligned with the first conjoining channel, wherein the first blade module and the second blade module are symmetrical and mechanically coupled to form a conjoined blade, wherein electrical components of the first blade module and electrical components of the second blade module are electrically coupled via an electrical coupler routed through the aligned first conjoining channel and second conjoining channel.
    Type: Application
    Filed: April 25, 2007
    Publication date: October 30, 2008
    Inventors: Kevin B. Leigh, Thomas T. Hardt, Timothy A. McCree