Abstract: Systems and methods for providing distributed autonomous power management in a memory system. Embodiments include a memory system for storing and retrieving data for a processing system. The memory system includes a memory controller for receiving and responding to memory access requests, a memory bus in communication with the memory controller, a plurality of memory devices, and a control unit external to the memory controller. The memory devices are in communication with the memory controller via the memory bus, with one or more of the memory devices being associated with a group. The control unit autonomously manages power within and for the group of memory devices.

Abstract: A memory subsystem with a memory bus and a memory assembly. The memory bus includes multiple bitlanes. The memory assembly is in communication with the memory bus and includes instructions for receiving an error code correction (ECC) word in multiple packets via the memory bus. The ECC word includes data bits and ECC bits arranged into multiple multi-bit ECC symbols. Each of the ECC symbols is associated with one of the bitlanes on the memory bus. The memory assembly also includes instructions for utilizing one of the ECC symbols to perform error detection and correction for the bits in the ECC word received via the bitlane associated with the ECC symbol.

Abstract: Systems and methods for providing performance monitoring in a memory system. Embodiments include a memory system for storing and retrieving data for a processing system. The memory system includes a memory controller, a plurality of memory devices, a memory bus and a memory hub device. The memory controller receives and responds to memory access requests. The memory bus is in communication with the memory controller. The memory hub device is in communication with the memory bus. The memory hub device includes a memory interface for transferring one or more of address, control and data information between the memory hub device and the memory controller via the memory bus. The memory hub device also includes a memory device interface for communicating with the memory devices. The memory hub device further includes a performance monitor for monitoring and reporting one or more of memory bus utilization, memory device utilization, and performance characteristics over defined intervals during system operation.

Abstract: Memory systems are disclosed that include a memory controller and an outbound link with the memory controller connected to the outbound link. The outbound link typically includes a number of conductive pathways that conduct memory signals from the memory controller to memory buffer devices in a first memory layer; and at least two memory buffer devices in a first memory layer. Each memory buffer device in the first memory layer typically is connected to the outbound link to receive memory signals from the memory controller.

Abstract: Memory systems are disclosed that include a memory controller; a memory bus terminator; a high speed memory bus that interconnects the memory controller, the memory bus terminator, and at least one memory module, where memory module includes a memory hub device, high speed random access memory served by the memory hub device, two bus signal ports, and a segment of the high speed memory bus fabricated on the memory module so as to interconnect the bus signal ports and the memory hub device, with the high speed memory bus connected to the memory hub device by a negligible electrical stub.

Abstract: Systems are disclosed in which a first receiver circuit of an integrated circuit die, the die having conductive die pads for electrical signal transfer between conductive pathways inside the die and conductive pathways outside the die, the first receiver circuit having an input connected to a first die pad and an output connected to a first logic circuit of the die and a second receiver circuit of the integrated circuit die, the second receiver circuit having an input connected to a second die pad and an output connected to a second logic circuit of the integrated circuit die, where both receiver circuits are configured to receive the same signals.

Abstract: A cascaded interconnect system with one or more memory modules, a memory controller and a memory bus that utilizes periodic recalibration. The memory modules and the memory controller are directly interconnected by a packetized multi-transfer interface via the memory bus and provide scrambled data for use in the periodic recalibration.

Abstract: Systems and methods for providing distributed technology independent memory controllers. Systems include a computer memory system for storing and retrieving data. The system includes a memory bus, a main memory controller, one or more memory devices characterized by memory device protocols and signaling requirements, and one or more memory hub devices. The main memory controller is in communication with the memory bus for generating, receiving, and responding to memory access requests. The hub devices are in communication with the memory bus and with the memory devices for controlling the memory devices responsively to the memory access requests received from the main memory controller and for responding to the main memory controller with state or memory data.

Abstract: A system for implementing a memory subsystem command interface, the system including a cascaded interconnect system including one or more memory modules, a memory controller and a memory bus. The memory controller generates a data frame that includes a plurality of commands. The memory controller and the memory module are interconnected by a packetized multi-transfer interface via the memory bus and the frame is transmitted to the memory modules via the memory bus.

Abstract: A packetized cascade memory system including a plurality of memory assemblies, a memory bus including multiple segments, a bus repeater module and a segment level sparing module. The bus repeater module is in communication with two or more of the memory assemblies via the memory bus. The segment level sparing module provides segment level sparing for the communication bus upon segment failure.

Abstract: A synchronous input to output protocol translator supporting multiple reference oscillator frequencies and fixed latency data computation and chip crossing circuits enables implementation of a method for delaying osc2 relative to osc1 in a configurable way to provide a constant, minimal Tptcc over a range of refosc frequencies between circuits for data transferred. It requires that the data transferred from a register R1 be sent over multiple wires via configurable delay circuitry for osc2, capture circuitry at the input to R2, and a circuit to transfer a synchronizing signal from a non-delayed clock domain to a delayed clock domain. Relative to osc1, osc2 is a delayed, synchronous clock.

Abstract: A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

Abstract: A cascaded interconnect system including a memory controller, one or more memory modules, an upstream memory bus and a downstream memory bus. The one or more memory modules include a first memory module with cache data. The memory modules and the memory controller are interconnected by a packetized multi-transfer interface via the downstream memory bus and the upstream memory bus. The first memory module and the memory controller are in direct communication via the upstream memory bus and the downstream memory bus.

Abstract: A high reliability dual inline memory module with a fault tolerant address and command bus for use in a server. The memory module is a card approximately 151.35 mm or 5.97 inches long provided with about a plurality of contacts of which some are redundant, a plurality of DRAMs, a phase lock loop, a 2 or 32K bit serial EE PROM and a 28 bit, a 1 to 2 register having error correction code (ECC), parity checking, a multi-byte fault reporting circuitry for reading via an independent bus, and real time error lines for determining and reporting both correctable errors and uncorrectable error conditions coupled to the server's memory interface chip and memory controller or processor such that the memory controller sends address and command information to the register via address/command lines together with check bits for error correction purposes to the ECC/Parity register.

Abstract: A dual inline memory module (DIMM) includes a card having a length of about 151.2 to about 151.5 millimeters, a plurality of individual local memory devices attached to the card, and a buffer device attached to the card, the buffer device configured for converting a packetized memory interface. The card includes at least 276 pins configured thereon.

Abstract: A memory built-in self test (MBIST) apparatus and method for testing dynamic random access memory (DRAM) arrays, the DRAM arrays in communication with a memory interface device that includes interface logic and mainline chip logic. The MBIST apparatus includes a finite state machine including a command generator and logic for incrementing data and addresses under test and a command scheduler in communication with the finite state machine. The command scheduler includes resource allocation logic for spacing commands to memory dynamically utilizing DRAM timing parameters. The MBIST apparatus also includes a test memory storing subtests of an MBIST test. Each of the subtests provides a full pass through a configured address range. The MBIST apparatus further includes a subtest pointer in communication with the test memory and the finite state machine. The finite state machine implements subtest sequencing of each of the subtests via the subtest pointer.

Abstract: Circuitry for delaying a signal includes a phase-locked loop comprising one or more output nodes for outputting one or more output signals in response to a reference signal. A buffer is coupled to the output nodes of the phase-locked loop for receiving phase-locked loop output signals and outputs one or more buffered output signals. A multiplexing element receives the buffered output signals and a control signal and generates an operative buffered output signal in response to the control signal. A delay line receives a delay control input signal and the operative buffered output signal from the multiplexing element. The delay line outputs a delayed output signal in response to the delay control input signal.

Abstract: A method of calibrating an elastic interface is provided to automatically achieve a minimal cycle delay through the interface. An existing self-alignment interface (i.e. elastic interface) is used to de-skew within a cycle and stage the data to have it arrive on a given, programmed target cycle. However, this target cycle must be calculated in advance and may be larger than it needs to be, causing more latency on the interface. This method is used to determine the earliest target cycle (with or without additional guard-band). This target cycle is used to adjust the interface automatically to achieve this earliest target cycle. The determination of earliest target cycle can be done once, continuously, or using a sample window. The method also can be used for interfaces that have frequency multipliers or phase shifts at its boundaries.

Abstract: An SMP computer system has an apparatus and method for recalibrating a self-timed, source-synchronous, pipelined interface while the computer system is running. The apparatus allows for quiescing the interface (ie. idling the processors to allow for no data transfers), raising fences (blocking interfaces), allowing for a quick clock centering recalibration step, and then unfencing and unquiescing to allow for the use of the interface again. The recalibration allows for compensating for drift over time on the interface to compensate for temperature, voltage, cycle time, and end-of-life degradation without bringing down and restarting the system.

Abstract: A circuit and method for reading data transfers that are sent with a source synchronous clock signal. The circuit has a data input for receiving data signals carrying data being transferred, a clock input for receiving synchronous clock signals, and a delay circuit connected to the clock input for generating a delayed clock signal which is delayed from said synchronous clock signal a predetermined time period. The circuit also includes a pipeline connected to the data input for sampling the data on the data input in response to said delayed clock signal thereby stretching the sampling of incoming data.