Abstract: The present disclosure generally relates to optical molecules, including but not limited to 1,3-thiazolidin-4-ones and other molecules comprising an aza-heterocyclic ring system containing a chalcogen. In some embodiments, the molecules may absorb light between 300 nm and 800 nm, e.g., appearing as various colors, depending on the absorbance. In some cases, the optical molecules can be used as color additives, pigments, dyes, or the like. Other embodiments of the disclosure are generally directed to systems and devices using such compounds, methods of using such compounds, kits involving such compounds, or the like.

Abstract: Methods and systems are disclosed for building a few-shot logo recognition system that includes accessing an image with several regions of interest and identifying several objects within the regions of interest using a logo detector neural network. For each object, the logo detector neural network indicates whether the object is a logo. The methods and systems also generate a first and second set of image feature data and a first and second ranked list of logos. A final ranked list of logos is generated based on the first and second ranked list of logos and a category associated with each logo in the final ranked list of logos is identified.

Abstract: Systems and methods for object-based content recommendation are described. A camera feed comprising a plurality of image frames is caused to be displayed at a client device. An object is detected within an image frame from the camera feed, the object corresponding with an object category. Responsive to detecting the object, an icon associated with the object category is selected and displayed at a position upon the camera feed. The icon corresponds with a media collection related to the object category. An input is received selecting the icon. Responsive to the input, a presentation of media items from the media collection is displayed at the client device. By detecting real-world objects and surfacing relevant virtual icons that link to associated media, an augmented reality experience is provided allowing virtual content to be overlaid and anchored to objects in reality.

Abstract: The disclosed systems and methods provide a framework for a proactive prediction of the toxic propensity of an article. Prior to the publication and/or reception of comments to online content, the disclosed framework determines the toxic propensity of the content's context and/or specific words, sentences, sentiments, tone or other messages receivable from consumption of the content. Thus, disclosed framework performs proactive forecasting of the content's toxicity propensity”, which quantifies how likely the content is prone to incur or attract toxic comments. The framework can function and/or be configured to operate in a manner that can perform specifically adherent moderation actions that correspond to the content and control how the content can be interacted with, based on the toxic propensity determination, prior to the content's publication in an effort to thwart, prevent or stop toxic environments surrounding or stemming from the content from coming into existence.

Abstract: Materials and methods for using polypeptides containing fragments and variants of the antibody(ies) or portion(s) thereof that bind CD25 to treat cancer alone or in combination with other anti-neoplastic agents.

Abstract: A device including a first circuit, a second circuit. The first circuit to receive a first signal, a second signal, and a third signal, and the first circuit to provide a fourth signal and a fifth signal. The second circuit to receive the fourth signal and the fifth signal, and the second circuit to control a first set of components to maintain a difference between a first amount of power provided to a first terminal of a driver and a second amount of power provided to a second terminal of the driver or to control a second set of components to maintain the difference between the first amount of power provided to the first terminal of the driver and the second amount of power provided to the second terminal of the driver.

Abstract: A system and method for assessing digital interactions with a digital third party accounts can include receiving user account credentials for authentication with an external computing system, storing the user account credentials in association with a authentication token and communicating the authentication token to a computing device of an external application service; receiving, through a programmatic communication interface, a request that references the authentication token and digital interaction details; programmatically authenticating, using the stored user account credentials, as a user account with the external computing system and retrieving account data; processing the account data in combination with the digital interaction details and thereby generating a digital interact assessment; and initiating execution of a digital interaction based in part on the digital interaction assessment.

Abstract: A fluidic device, instrument, and method for processing a biological sample is disclosed herein. An example of the fluidic device includes structures (e.g., sample holder(s), reaction chamber(s), reagent storage zone(s), metering compartment(s), reaction well(s), detection well(s), channel(s), etc.) for efficiently processing sample components and providing expression levels of various biomarker components for characterization of a sample.

Abstract: A system and method for assessing digital interactions with a digital third party accounts can include receiving user account credentials for authentication with an external computing system, storing the user account credentials in association with a authentication token and communicating the authentication token to a computing device of an external application service; receiving, through a programmatic communication interface, a request that references the authentication token and digital interaction details; programmatically authenticating, using the stored user account credentials, as a user account with the external computing system and retrieving account data; processing the account data in combination with the digital interaction details and thereby generating a digital interact assessment; and initiating execution of a digital interaction based in part on the digital interaction assessment.

Abstract: A fluidic device, instrument, and method for processing a biological sample is disclosed herein. An example of the fluidic device includes structures (e.g., sample holder(s), reaction chamber(s), reagent storage zone(s), metering compartment(s), reaction well(s), detection well(s), channel(s), etc.) for efficiently processing sample components and providing expression levels of various biomarker components for characterization of a sample.

Abstract: An apparatus for detecting the presence of assembly related defects on a semiconductor device including an edge ring having a resistance value and including one or more layers configured to at least partially cover the semiconductor device in a first direction. The one or more layers are divided into a first section and a second section. Each layer of the one or more layers are in electrical communication with one another. The resistance value of the edge ring is at a first resistance value associated with the first and second sections being intact. At least one of the first section and second section is configured to break in response to an assembly related defect, and the resistance value of the edge ring is configured to change from the first resistance value to a second resistance value in response to at least one of the first and second sections being broken.

Abstract: An apparatus for detecting the presence of assembly related defects on a semiconductor device including an edge ring having a resistance value and including one or more layers configured to at least partially cover the semiconductor device in a first direction. The one or more layers are divided into a first section and a second section. Each layer of the one or more layers are in electrical communication with one another. The resistance value of the edge ring is at a first resistance value associated with the first and second sections being intact. At least one of the first section and second section is configured to break in response to an assembly related defect, and the resistance value of the edge ring is configured to change from the first resistance value to a second resistance value in response to at least one of the first and second sections being broken.

Abstract: A system and method for assessing digital interactions with a digital third party accounts can include receiving user account credentials for authentication with an external computing system, storing the user account credentials in association with a authentication token and communicating the authentication token to a computing device of an external application service; receiving, through a programmatic communication interface, a request that references the authentication token and digital interaction details; programmatically authenticating, using the stored user account credentials, as a user account with the external computing system and retrieving account data; processing the account data in combination with the digital interaction details and thereby generating a digital interact assessment; and initiating execution of a digital interaction based in part on the digital interaction assessment.

Abstract: A neural network may be trained on a training corpus that comprises a large number of dataset-visualization pairs. Each pair in the training corpus may consist of a dataset and a visualization of the dataset. The visualization may be a chart, plot or diagram. In each dataset-visualization pair in the training corpus, the visualization may be created by a human making design choices. The neural network may be trained to predict, for a given dataset, a visualization that a human would create to represent the given dataset. During training, features and design choices may be extracted from the dataset and visualization, respectively, in each dataset-visualization pair in the training corpus. After the neural network is trained, features may be extracted from a new dataset, and the trained neural network may predict design choices that a human would make to create a visualization that represents the new dataset.

Abstract: A handle for easily and quickly deploying a shelter wherein a conventional “instant” type shelter is provided having a deployment handle made of webbing material attached to the upper corner of diagonally opposed shelter frame comers, allowing the users to grasp the deployment handles and move outward from each other to expand the shelter frame to its full footprint prior to raising the frame to its desired height and locking it in place.

Abstract: Reconstitution techniques for semiconductor packages are provided. One reconstitution technique is used to encapsulate a plurality of semiconductor packages into a single multi-chip module. Solder balls coupled to each package may be partially exposed after reconstitution, which enables the packages to be coupled to another device. Another reconstitution technique is used to couple a plurality of semiconductor packages into a package-on-package module using self-alignment feature(s). The self-alignment feature(s) are exposed solder ball(s) that are included in the bottom package of the package-on-package module. The exposed solder ball(s) serve as a frame of reference to other solder balls that are encapsulated by an encapsulation material. After the location of these other solders balls are determined, through-mold vias may be formed in the encapsulation material at locations corresponding to the other solder balls.

Abstract: Methods, systems, and apparatuses for printing under bump metallization (UBM) features on chips/wafers are provided. A wafer is received that has a surface defined by a plurality of integrated circuit regions. Each integrated circuit region has a passivation layer and a plurality of terminals on the surface of the wafer accessible through openings in the passivation layer. A plurality of UBM features are formed on the surface of the wafer in the form of an ink such that each UBM feature is formed electrically coupled with a corresponding terminal of the plurality of terminals. An ink jet printer may be used to print the ink in the form of the UBM feature. A UBM feature may be formed directly on a corresponding terminal, or on routing that is coupled to the corresponding terminal. A bump interconnect may be formed on the UBM feature.

Abstract: Methods, systems, and apparatuses for an integrated circuit package assembly process are provided. A wafer is received having a surface defined by a plurality of integrated circuit regions. Electrical conductors are accessible through corresponding first openings in a first passivation layer on the surface of the wafer. Solderable metal layer features are formed on the electrical conductors through the first openings. The wafer is singulated to form a plurality of flip chip dies. A plurality of package substrates is received. Each package substrate has a plurality of solder on pad (SOP) features on a respective surface. Each flip chip die is mounted to a corresponding package substrate such that each SOP feature is coupled to a corresponding solderable metal layer feature, to form a plurality of integrated circuit packages.

Abstract: Methods, systems, and apparatuses for printing under bump metallization (UBM) features on chips/wafers are provided. A wafer is received that has a surface defined by a plurality of integrated circuit regions. Each integrated circuit region has a passivation layer and a plurality of terminals on the surface of the wafer accessible through openings in the passivation layer. A plurality of UBM features are formed on the surface of the wafer in the form of an ink such that each UBM feature is formed electrically coupled with a corresponding terminal of the plurality of terminals. An ink jet printer may be used to print the ink in the form of the UBM feature. A UBM feature may be formed directly on a corresponding terminal, or on routing that is coupled to the corresponding terminal. A bump interconnect may be formed on the UBM feature.

Abstract: Methods, systems, and apparatuses for an integrated circuit package assembly process are provided. A wafer is received having a surface defined by a plurality of integrated circuit regions. Electrical conductors are accessible through corresponding first openings in a first passivation layer on the surface of the wafer. Solderable metal layer features are formed on the electrical conductors through the first openings. The wafer is singulated to form a plurality of flip chip dies. A plurality of package substrates is received. Each package substrate has a plurality of solder on pad (SOP) features on a respective surface. Each flip chip die is mounted to a corresponding package substrate such that each SOP feature is coupled to a corresponding solderable metal layer feature, to form a plurality of integrated circuit packages.