Abstract: The semiconductor portion of a circuit includes a plurality of flip chip devices which are arranged in a planar fashion in a common housing. The plurality of flip chip devices are connected to each other without wire bonding. The common housing includes a packaging structure, the packaging structure including a connective portion and at least one web portion, which aids in the thermal management of the heat emitted by the plurality of flip chip devices and which connects the flip chip devices to each other. Passive devices in the circuit may also be arranged in a planar fashion in the common housing.

Abstract: Disclosed is a method of modifying one or more colors contained in an Encapsulated PostScript (EPS) file in a computer program such as a desktop publishing program (50). After an EPS file has been imported into a publication, all identifiable colors in the EPS file, i.e., spot colors and, in some instances, process colors, are displayed to a color palette (84). The color palette allows a user to see those colors (or inks) that are needed to print the publication, and subsequently modify the colors without having to return to the originating program that exported the EPS file. The method includes creating a publication color list that contains those colors that have been modified, generating a PostScript (PS) color table from the publication color list after the modifications are complete, and changing the attributes of those colors in the PS table while printing the publication to a file or to a printer.