Abstract: A method includes, responsive to an application of power to an IC, self-initializing the IC by asserting a reset signal for a reset period. Self-initializing the IC also includes, in response to an expiration of the reset period, deasserting the reset signal. Self-initializing the IC also includes, responsive to deasserting the reset signal, automatically obtaining first temperature data from at least one thermal sensing device associated with a die of the IC, and storing the first temperature data in a storage component of the IC.

Abstract: A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.

Abstract: A controller configured to detect fault conditions in a circuit that operates an electrical-load includes a gate-driver and a voltage-detector. The gate-driver is configured to control a gate-current to a switching-device. The gate-current is controlled such that the switching-device is operated in a linear-state when the switching-device transitions from an on-state to an off-state. The voltage-detector is configured to determine a voltage-drop across the switching-device. The controller is configured to indicate a no-fault condition when the voltage-drop is greater than a voltage-threshold for more time than a no-fault interval after the switching device is operated from the on-state to the linear-state.

Abstract: A controller configured to detect fault conditions in a circuit that operates an electrical-load includes a gate-driver and a voltage-detector. The gate-driver is configured to control a gate-current to a switching-device. The gate-current is controlled such that the switching-device is operated in a linear-state when the switching-device transitions from an on-state to an off-state. The voltage-detector is configured to determine a voltage-drop across the switching-device. The controller is configured to indicate a no-fault condition when the voltage-drop is greater than a voltage-threshold for more time than a no-fault interval after the switching device is operated from the on-state to the linear-state.

Abstract: A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.

Abstract: A sensing circuit for detecting open and short circuit conditions in sensors is provided. The sensing circuit includes switching circuitry, a voltage supply, a test capacitor, and an operational amplifier. The switching circuitry is electrically coupled to the voltage supply, test capacitor, operational amplifier, and a sensor. The sensing circuit is configured to provide for a normal operating mode in which the sensing circuit provides an output indicative of a voltage across the sensor, and a charging mode in which the test capacitor is coupled to the sensor and operational amplifier and charged to a steady state, and in which the output of the operational amplifier is a function of the test capacitor capacitance and the capacitance of the sensor. A method for detecting open and short circuit conditions in sensors is also provided.

Abstract: A power electronic module includes heat generating power electronic devices mounted on a circuit board within a connector outline circumscribing circuit board through-holes for receiving pin terminals of a connector assembly. The power electronic devices are thermally and electrically coupled to the circuit board through-holes and connector pin terminals to dissipate heat generated by the power electronic devices.

Abstract: A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.

Abstract: A sensor interface filter having adjustable gain and Q is provided. The sensor interface includes a first operational amplifier coupled to gain circuitry, a gain stage, and a resistor. The gain circuitry and gain stage are electrically coupled to each other. The gain stage includes a gain stage switch, and is coupled to control circuitry. The control circuitry controls the state of the gain stage switch to vary the number of feedback current paths providing feedback to the inverting input of the first operational amplifier, altering the gain provided by the first operational amplifier. The sensor interface further includes a second operational amplifier coupled to filter circuitry and feedback switches. The feedback switches are coupled to the control circuitry, which controls the state of the feedback switches to vary the gain provided by the second operational amplifier and the filter Q of the sensor interface. A method is also provided.

Abstract: A sensor interface filter having adjustable gain and Q is provided. The sensor interface includes a first operational amplifier coupled to gain circuitry, a gain stage, and a resistor. The gain circuitry and gain stage are electrically coupled to each other. The gain stage includes a gain stage switch, and is coupled to control circuitry. The control circuitry controls the state of the gain stage switch to vary the number of feedback current paths providing feedback to the inverting input of the first operational amplifier, altering the gain provided by the first operational amplifier. The sensor interface further includes a second operational amplifier coupled to filter circuitry and feedback switches. The feedback switches are coupled to the control circuitry, which controls the state of the feedback switches to vary the gain provided by the second operational amplifier and the filter Q of the sensor interface. A method is also provided.

Abstract: An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.

Abstract: A sensing circuit for detecting open and short circuit conditions in sensors is provided. The sensing circuit includes switching circuitry, a voltage supply, a test capacitor, and an operational amplifier. The switching circuitry is electrically coupled to the voltage supply, test capacitor, operational amplifier, and a sensor. The sensing circuit is configured to provide for a normal operating mode in which the sensing circuit provides an output indicative of a voltage across the sensor, and a charging mode in which the test capacitor is coupled to the sensor and operational amplifier and charged to a steady state, and in which the output of the operational amplifier is a function of the test capacitor capacitance and the capacitance of the sensor. A method for detecting open and short circuit conditions in sensors is also provided.

Abstract: An assembly for a sealed electronic component includes at least one electronic device mounted on a substrate, and a metal enclosure comprising first and second housing components that are welded together to define a sealed enclosure. The resulting assembly provides a reliable seal that eliminates the need for mechanical fasteners, adhesives, and equipment for applying and curing adhesives.

Abstract: A high-side driver circuit for driving a load, including a low-side driver IC having a drive output and a feedback input, a first transistor coupled to the drive output, and a second transistor coupled between a power source and the load. The second transistor is configured to enter an “OFF” state when the first transistor is driven into an “OFF” state by the drive output, and to enter an “ON” state when the first transistor is driven into an “ON” state by the drive output.

Abstract: An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.

Abstract: An electronic control unit (ECU) includes a central processing unit (CPU), a non-volatile memory bank, a volatile memory bank and a state machine. The state machine is in communication with the CPU and functions to selectively capture information available on an internal bus of the CPU on a cycle-by-cycle basis and store the captured information in the volatile memory, which is also coupled to the CPU.

Abstract: An oxygen sensor interface circuit is configurable on the fly by an electronic controller such as an engine controller to support oxygen sensors having unique interface requirements, to reliably identify various oxygen sensor faults, and to enable rapid detection of a warmed up sensor. The interface circuit is configurable in a first respect to enable operation with any of a number of different sensors, and in a second respect to enable more reliable fault detection, including measurement of leakage to ground or battery.

Abstract: A method for computer memory calibration includes flashing a calibration from a processor into two flash memory sections. Either the same or an alternate processor requests data stored in one of the flash memory sections. Subsequently, exception handler logic within an exception mechanism activates and generates an exception for the data stored in the aforementioned flash memory section. The calibration in the other flash memory section then transfers to the processor through the functioning of the exception.

Abstract: An oxygen sensor interface circuit is configurable on the fly by an electronic controller such as an engine controller to support oxygen sensors having unique interface requirements, to reliably identify various oxygen sensor faults, and to enable rapid detection of a warmed up sensor. The interface circuit is configurable in a first respect to enable operation with any of a number of different sensors, and in a second respect to enable more reliable fault detection, including measurement of leakage to ground or battery.

Abstract: An improved method of operation for a motor vehicle microcontroller uses flash memory (FM) for storing generic data and emulating an EE memory device. The FM is divided into first and second banks, with the first bank being utilized for generic data and the second bank being utilized for EE data, allowing EE data to be updated while the microcontroller accesses stored generic data. The second bank is partitioned into sectors that are individually erasable, and EE data is updated by storing the updated EE data into an unused sector, flagging the old sector to indicate that it contains invalid data, and later erasing the old sector to make it available for future updates of EE data.