Abstract: A composite enclosure for housing electronic devices, and methods related thereto, are provided. In particular, in some embodiments, a method of manufacturing a composite enclosure for housing electronic devices includes winding composite material about a mandrel and curing the composite material to create a composite hoop. A panel is formed in a separate process that includes stacking a plurality of composite layers in a mold and curing the composite layers to create a composite panel. The composite hoop and the composite panel are bonded together to form the composite enclosure.

Abstract: Certain embodiments disclosed herein relate to a smooth finish composite structure and methods for making the composite structure. In particular, in one embodiment, a method is provided that includes creating a first layer of a composite structure. The creation of the first layer includes positioning the first layer in a mold and curing the first layer. Additional layers of the composite structure are created and bonded to the first layer.

Abstract: A housing for an electronic device or other object formed in a layered configuration. The layer or sandwich construction imparts strength and rigidity while decreasing the overall weight to the housing. The case/housing may have a first layer and a second layer formed from a first material. The case may also include a core formed from a second material. Where the first layer may be bonded to a top surface of the core and the second layer may be bonded to a bottom surface of the core.

Abstract: A method for manufacturing an enclosure for an electronic device including forming the enclosure, forming one or more locating cavities on a surface of the enclosure, attaching one or more blanks to the enclosure using the one or more locating cavities, and processing the one or more attached blanks to form a desired shape thereof. The enclosure may be formed from a fiber-in-matrix material. A layered fiber-in-matrix type material, such as CFRP, may be used.

Abstract: Certain embodiments disclosed herein relate to apparatuses and methods for intricate cuts. In particular, in one embodiment, a cutting apparatus is provided. The cutting apparatus includes a base member and an elongate member extending from the base member. The elongate member includes a tapered region having an abrasive surface. The tapered region defines at least one vertex defining an angle of a desired cutout shape. Additionally, the tapered region is toothless.

Abstract: A housing for an electronic device or other object formed from a fiber-in-matrix material. A layered fiber-in-matrix type material, such as CFRP, may be used. A spine made from CFRP may support, and be attached to, a CFRP skin. The CFRP spine may be a unitary frame that imparts strength and rigidity to the overall housing and also form at least some of the corners of the frame. In some embodiments, the spine may be rectangular. The skin may be formed from multiple layers of CFRP type material stacked atop each other. Each layer may be cut at one or more corners to expose at least a portion of the layer beneath. The skin may thus have an overall cross shape, such that each arm of the cross may be wrapped around a different side of the aforementioned rectangular spine.