Abstract: A new die insert for an extrusion machine and a method of using the invention that includes a continuous strand of fiber reinforcing material to be statically drawn directly to the center of the molten flow of polymer base matrix. The insert is placed in line with the discharge end of an injection molding apparatus. A molten flow of polymer base matrix proceeds in a straight linear fashion through the die. A fiber feed tube is centered on the interior of the die. As the polymer flows past the feed tube the molten polymer draws a continuous strand of fiber reinforcing into the center of the flow. The polymer is then extruded and cooled and the extrusion is further pelletized to produce injection molding feed stock material having continuous fiber reinforcing. The result provides a continuous extrusion process that allows the formation of a continuous fiber-reinforced product employing brittle fibers in one-step process.

Abstract: A conforming heat sink assembly for removing heat from heat generating components, having respective top surfaces defining different heights is provided with a flexible thermally conductive base member with a top surface and a bottom surface. The bottom surface is adapted to be positioned in flush thermal communication with the top surfaces of each of the components. The bottom portions of a heat dissipating element are embedded in a flexible thermally conductive base member. The heat dissipating member is corrugated to define a number of lower contact points and upstanding fin members. The lower contact points are movable relative to one another in accordance with the top surface of the flexible thermally conductive base member. The heat dissipating element is affixed to the flexible thermally conductive base member at its lower contact points to form a conforming heat sink assembly.

Abstract: A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.

Abstract: An insert molded heat sink assembly for dissipating heat from a heat generating source includes a polymer base that contacts the heat generating source with a heat dissipating element array embedded therein. A pin grid array, fins or other structures are embedded directly into the polymer base using a molding process. In accordance with the present invention the heat dissipating elements are insert molded around to produce a completed heat sink. Moreover, the polymer base is preferably a highly thermally conductive polymer composition. Also, the geometry of the heat dissipating members, such as a pin or fin array, is optimized to improve the overall performance of the heat sink assembly.

Abstract: A net-shape molded elastomeric gasket for dissipating heat and providing electro-magnetic interference (EMI) shielding for an electronic device is formed by loading a base elastomeric matrix material with thermally conductive filler and EMI reflective metallic filler and injecting the mixture into a mold cavity. The gasket of the present invention provides superior sealing between the case sections of an electronic device by shielding the device from EMI infiltration along the seam between the sections. In addition, the gasket of the present invention is in thermal communication with the case sections of the electronic device to provide thermal transfer and dissipation between the separate parts of the device.

Abstract: The present invention discloses a conductive injection molding composition. The thermally conductive composition includes a metallic base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. In addition, an alternative embodiment of the composition mixture includes a second thermally conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.

Abstract: A conforming heat sink assembly for removing heat from heat generating components, having respective top surfaces defining different heights is provided with a flexible thermally conductive base member with a top surface and a bottom surface. The bottom surface is adapted to be positioned in flush thermal communication with the top surfaces of each of the components. The bottom portions of a heat dissipating element are embedded in a flexible thermally conductive base member. The heat dissipating member is corrugated to define a number of lower contact points and upstanding fin members. The lower contact points are movable relative to one another in accordance with the top surface of the flexible thermally conductive base member. The heat dissipating element is affixed to the flexible thermally conductive base member at its lower contact points to form a conforming heat sink assembly.

Abstract: A method of manufacturing a heat pipe construction includes first providing a tubular pipe with an open end. A thermally conductive material, such as a metallic material or a filled polymer composite material is overmolded over or cast around the tubular pipe. Additional heat dissipating elements, such as insert molded pins, may be provided in the overmolded or cast material to enhance thermal conductivity of the heat sink assembly. The tubular pipe is then filled with heat pipe media, such as water or ammonia, and then immediately sealed therein to effectively form an embedded heat pipe within a thermally conductive cast or overmolded structure. With the method of the present invention, an heat pipes can be overmolded with or cast into other heat dissipating material structure to improve overall performance of the heat pipe without damaging the heat pipe.

Abstract: The present invention provides an overmolded electronic device cover assembly and method of manufacturing the same. The device cover assembly is molded directly over an electronic device, such as a resistor or a capacitor, that requires both electrical isolation and effective cooling. The device cover assembly is overmolded about and in direct contact with the electronic device package and is formed from a thermally conductive and electrically insulative moldable polymer composition. The molded device cover assembly is positioned in thermal communication with at least the front side, the rear side, the left side, the right side and the top side of the electronic device package for cooling thereof while providing electrical isolation and sealing the device against the effects of dust and moisture infiltration. The direct molding of the device cover assembly to the heat generating device obviates the need for interface materials, adhesives and other assembly operations.

Abstract: A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with a thermally conductive polymer composition that is filled with thermally conductive filler material. The molded heat sink is freely convecting through the part which makes it more efficient and has an optimal thermal configuration.

Abstract: A thermally conductive and electromagnetic interference and radio frequency reflective polymer composition and a method for creating the same is disclosed. Thermally conductive filler material is coated with a thermally conductive and electromagnetic interference and radio frequency reflective coating material and mixed with a base polymer matrix. The mixture is molded into the desired shape. The electromagnetic interference and radio frequency reflective coating material prevents the absorption and transfer of EMI and RF waves through the filler material thus resulting in an EMI and RF reflective composition.

Abstract: A method of overmolding a heat pipe includes providing an injection mold apparatus having a cavity, an input gate, a bleed off overflow gate in communication with the cavity and a tubular heat pipe charged with phase change media which is capable of being collapsed by imparting an external collapsing pressure. The tubular heat pipe is placed into the cavity in the injection mold apparatus. A net shape moldable thermally conductive material is introduced into the cavity and around the tubular pipe. The bleed off overflow gate is set to open at a predetermined pressure which less than the external collapsing pressure which would damage the heat pipe to be overmolded. Pressure is relieved in the cavity of the mold apparatus through the bleed off overflow gate when pressure in the bleed off overflow gate reaches the predetermined pressure. As a result, delicate heat pipes can be overmolded in an injection mold apparatus without damage to the heat pipe during the molding process.

Abstract: A plunger machine for molding reinforced polymer is provided. The plunger machine has particular application in molding polymer that is reinforced with particles having an aspect ratio greater than 1:1. The plunger machine includes a barrel housing with a smooth barrel bore that defines a main melt chamber. A plunger housing, having a plunger bore, defines an initial melt chamber that is in communication with the main melt chamber. A plunger resides in the plunger bore and is reciprocatable therein. The barrel bore is continuously inwardly to provide a smooth transition and alignment of reinforcing members in the polymer mixture during the melt process. The smooth bore ensures substantial alignment of the reinforcement members with the longitudinal axis of the bore to avoid excessive breakage of the reinforcing particles and prepare the polymer mixture for extrusion into a mold assembly.

Abstract: A conductive net-shape moldable molding composition, with a thermal conductivity above 22 W/m°K and a volume electrical resistivity of 0.1 ohm-cm or lower and a surface electrical resistivity of 1.0 ohm or lower, is provided. The thermally and electrically conductive composition includes a polymer base matrix of, by volume, between 30 and 60 percent. A first conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.

Abstract: A method of forming a phase change passive heat sink, with a base member and heat dissipating members, is provided. The base member is hollow and defines an evaporation chamber therein. A number of heat dissipating members are connected to the base member. Each of the heat dissipating members are substantially tubular in configuration with a closed end and an open end and defining respective condensation chambers therein. The open ends of the heat dissipating members are connected to the base member with the condensation chambers and are in fluid communication with the evaporation chamber. A heat transporting media resides in the base member which is movable into the condensation chambers upon application of heat to the base member. Heat is dissipated through the heat dissipating members.

Abstract: A method of molding a reinforced article for optimizing heat transfer, electrical conductivity and/or structural integrity is provided. A mold assembly is first provided which is capable of forming an article of a desired configuration. The desired positioning of the filler within the molded article is determined according to the thermal, electrical or structural needs of the article. An input gate and output gate vent is formed in the mold assembly to ensure positioning of the filler as desired. Polymer, loaded with reinforced filler, is introduced into the mold assembly via the input gate. Polymer is positioned in the mold assembly with the reinforcing filler being substantially parallel and aligned with the flow path. Finally, the molded article is ejected from the mold assembly. With the molding method of the present invention, thermal and electrical conductivity and structural integrity of articles may be increased several times over articles molding with conventional molding methods.

Abstract: A heat sink assembly, having a number of mounting holes therethrough, is installed on a heat generating surface of an electronic component for removing heat therefrom. A heat dissipating member having a base portion having a bottom surface and an upper surface with heat dissipating elements connected thereto is provided. The bottom surface is adapted to be matable in flush thermal communication with a heat generating surface of an electronic component. A cam assembly includes a support body as well as a connection body that is pivotally connected thereto about a pivot axis. At least one leg is connected to the support body with a retention member on its free end. The leg is routed through a selected one of the base apertures and one of the mounting holes corresponding thereto.

Abstract: A method of molding a thermally conductive article for transferring heat from a heat generating surface is provided. A mold assembly is first provided which is capable of forming an article of a desired configuration. The initial location of contact on the article with the heat generating surface is then determined. An input gate is formed in the mold assembly at the initial location of contact. The optimum heat flow path through the article is determined. A termination location of the heat flow path is determined. Polymer, loaded with conductive filler, is introduced into the mold assembly via the input gate. Venting is provided in the mold assembly at the termination location of the heat flow path. Polymer is positioned in the mold assembly with the conductive filler being substantially parallel and aligned with the heat flow path. Finally, the molded article is ejected from the mold assembly.

Abstract: An molded heat sink assembly includes an integrally molded attachment clip for securing the assembly to a semiconductor package to be cooled. The assembly removes heat from a semiconductor device package having opposing side wall edges. The heat sink assembly also includes a heat conductive base member having a substantially flat bottom surface adapted to be positioned in flush thermal communication with a heat generating semiconductor device package. A number of heat dissipating elements are connected to and extend upwardly from the thermally conductive base member. A pair of semiconductor package engaging clips downwardly depend from and are integrally connected to opposing sides of the heat conductive base member. The engaging clips are disposed in gripping communication with respective opposing side wall edges of the semiconductor device package.

Abstract: A conductive molding composition, with a thermal conductivity above 22 W/m.degree. K., is provided. The thermally conductive composition includes a polymer base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second thermally conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.