Patents by Inventor Kevin P. Fairbairn
Kevin P. Fairbairn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10752987Abstract: Disclosed is a substrate processing system which enables combined static and pass-by processing. Also, a system architecture is provided, which reduces footprint size. The system is constructed such that the substrates are processed therein vertically, and each chamber has a processing source attached to one sidewall thereof, wherein the other sidewall backs to a complementary processing chamber. The chamber system can be milled from a single block of metal, e.g., aluminum, wherein the block is milled from both sides, such that a wall remains and separates each two complementary processing chambers.Type: GrantFiled: February 19, 2018Date of Patent: August 25, 2020Assignee: INTEVAC, INC.Inventors: Patrick Leahey, Eric Lawson, Charles Liu, Terry Bluck, Kevin P. Fairbairn, Robert L. Ruck, Samuel D. Harkness, IV
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Publication number: 20180171463Abstract: Disclosed is a substrate processing system which enables combined static and pass-by processing. Also, a system architecture is provided, which reduces footprint size. The system is constructed such that the substrates are processed therein vertically, and each chamber has a processing source attached to one sidewall thereof, wherein the other sidewall backs to a complementary processing chamber. The chamber system can be milled from a single block of metal, e.g., aluminum, wherein the block is milled from both sides, such that a wall remains and separates each two complementary processing chambers.Type: ApplicationFiled: February 19, 2018Publication date: June 21, 2018Inventors: Patrick Leahey, Eric Lawson, Charles Liu, Terry Bluck, Kevin P. Fairbairn, Robert L. Ruck, Samuel D. Harkness, IV
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Patent number: 9914994Abstract: Disclosed is a substrate processing system which enables combined static and pass-by processing. Also, a system architecture is provided, which reduces footprint size. The system is constructed such that the substrates are processed therein vertically, and each chamber has a processing source attached to one sidewall thereof, wherein the other sidewall backs to a complementary processing chamber. The chamber system can be milled from a single block of metal, e.g., aluminum, wherein the block is milled from both sides, such that a wall remains and separates each two complementary processing chambers.Type: GrantFiled: December 27, 2012Date of Patent: March 13, 2018Assignee: INTEVAC, INC.Inventors: Patrick Leahey, Eric Lawson, Charles Liu, Terry Bluck, Kevin P. Fairbairn, Robert L. Ruck, Samuel D. Harkness, IV
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Publication number: 20170004987Abstract: An improved position control means for robotic handling systems; particularly, a sensing system and method for precisely determining the center point of a substrate, such as a semiconductor wafer, relative to a destination point by using a set of multi pixel imaging sensors incorporated into the wafer carrying end effector of the robotic handling system.Type: ApplicationFiled: June 30, 2015Publication date: January 5, 2017Inventor: Kevin P. Fairbairn
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Patent number: 9524896Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A linear transport chamber includes linear tracks and robot arms riding on the linear tracks to linearly transfer substrates along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers.Type: GrantFiled: February 9, 2009Date of Patent: December 20, 2016Assignee: Brooks Automation Inc.Inventors: Terry Bluck, Kevin P. Fairbairn, Michael S. Barnes, Christopher T. Lane
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Patent number: 9111979Abstract: An improved position control means for robotic handling systems; particularly, a sensing system and method for precisely determining the center point of a substrate, such as a semiconductor wafer, relative to a destination point by using a set of multi pixel imaging sensors incorporated into the wafer carrying end effector of the robotic handling system.Type: GrantFiled: May 16, 2013Date of Patent: August 18, 2015Inventor: Kevin P Fairbairn
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Patent number: 8998553Abstract: A system for transporting substrates from an atmospheric pressure to high vacuum pressure and comprising: a rough vacuum chamber having an entry valve and an exit opening; a high vacuum chamber having an entry opening, the high vacuum chamber coupled to the rough vacuum chamber such that the exit opening and the entry opening are aligned; a valve situated between the exit opening and the entry opening; a first conveyor belt provided in the rough vacuum chamber; a second conveyor provided in the high vacuum chamber; a sensing element provided in the high vacuum chamber to enable detection of broken substrates on the second conveyor; and, a mechanism provided on the second conveyor belt enabling dumping of broken substrates onto the bottom of the high vacuum chamber.Type: GrantFiled: December 7, 2012Date of Patent: April 7, 2015Assignee: Intevac, Inc.Inventors: Vinay Shah, William Runstadler, Jr., Kevin P. Fairbairn, Terry Bluck, Richard Henry Cooke
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Publication number: 20140340509Abstract: An improved position control means for robotic handling systems; particularly, a sensing system and method for precisely determining the center point of a substrate, such as a semiconductor wafer, relative to a destination point by using a set of multi pixel imaging sensors incorporated into the wafer carrying end effector of the robotic handling system.Type: ApplicationFiled: May 16, 2013Publication date: November 20, 2014Inventor: Kevin P Fairbairn
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Patent number: 8349196Abstract: A system is provided for etching patterned media disks for hard drive. The modular system may be tailored to perform specific processes sequences so that a patterned media disk is fabricated without removing the disk from vacuum environment. In some sequence the magnetic stack is etched while in other the etch is performed prior to forming the magnetic stack. In a further sequence ion implantation is used without etching steps. For etching a movable non-contact electrode is utilized to perform sputter etch. The cathode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched.Type: GrantFiled: December 5, 2008Date of Patent: January 8, 2013Assignee: Intevac, Inc.Inventors: Kevin P. Fairbairn, Michael S. Barnes, Terry Bluck, Ren Xu, Charles Liu, Ralph Kerns
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Patent number: 8303764Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.Type: GrantFiled: March 7, 2011Date of Patent: November 6, 2012Assignee: Brooks Automation, Inc.Inventors: Terry Bluck, Kevin P. Fairbairn, Michael S. Barnes, Christopher T. Lane
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Patent number: 8293066Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.Type: GrantFiled: December 1, 2008Date of Patent: October 23, 2012Assignee: Brooks Automation, Inc.Inventors: Terry Bluck, Kevin P. Fairbairn, Michael S. Barnes, Christopher T. Lane
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Publication number: 20120090992Abstract: A system is provided for etching patterned media disks for hard drive. The modular system may be tailored to perform specific processes sequences so that a patterned media disk is fabricated without removing the disk from vacuum environment. In some sequence the magnetic stack is etched while in other the etch is performed prior to forming the magnetic stack. In a further sequence ion implantation is used without etching steps. For etching a movable non-contact electrode is utilized to perform sputter etch. The cathode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched.Type: ApplicationFiled: December 27, 2011Publication date: April 19, 2012Applicant: INTEVAC, INC.Inventors: Kevin P. Fairbairn, Michael S. Barnes, Terry Bluck, Ren Xu, Charles Liu, Ralph Kerns
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Patent number: 8087380Abstract: A plurality of chamber are arranged about a transport chamber. The linear transport chamber may include a linear track supporting robot arms. The robot arms transport substrates to and from the chambers. Each chamber includes a plurality of evaporators, each controlled independently. Each substrate positioned in the chamber is coated from a plurality of the evaporators, such that by controlling the operation of each evaporator independently the formation of the layers and the concentration gradient of each layer can be precisely controlled.Type: GrantFiled: October 30, 2009Date of Patent: January 3, 2012Assignee: Intevac, Inc.Inventors: Terry Bluck, Michael S. Barnes, Kevin P. Fairbairn
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Publication number: 20110303148Abstract: An enclosure for generating a secondary environment within a processing chamber for coating a substrate. An enclosure wall forms a secondary environment encompassing the coating source, plasma, and the substrate, and separating them from interior of the processing chamber. The enclosure wall includes a plurality of pumping channels for diverting gaseous flow away from the substrate. The channels have an intake of larger diameter from the exhaust opening and are oriented at an angle with the intake opening pointing away from the deposition source. A movable seal enables transport of the substrate in open position and processing the substrate in closed position. The seal may be formed as a labyrinth seal to avoid particle generation from a standard contact seal.Type: ApplicationFiled: June 9, 2011Publication date: December 15, 2011Inventors: Jun XIE, Kevin P. Fairbairn, Charles Liu, Patrick Leahey, Robert L. Ruck, Terry Bluck
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Publication number: 20110158773Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.Type: ApplicationFiled: March 7, 2011Publication date: June 30, 2011Applicant: INTEVAC, INC.Inventors: Terry BLUCK, Kevin P. Fairbairn, Michael S. Barnes, Christopher T. Lane
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Publication number: 20110104847Abstract: A plurality of chamber are arranged about a transport chamber. The linear transport chamber may include a linear track supporting robot arms. The robot arms transport substrates to and from the chambers. Each chamber includes a plurality of evaporators, each controlled independently. Each substrate positioned in the chamber is coated from a plurality of the evaporators, such that by controlling the operation of each evaporator independently the formation of the layers and the concentration gradient of each layer can be precisely controlled.Type: ApplicationFiled: October 30, 2009Publication date: May 5, 2011Applicant: INTEVAC, INC.Inventors: Terry BLUCK, Michael S. Barnes, Kevin P. Fairbairn
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Patent number: 7901539Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.Type: GrantFiled: September 19, 2006Date of Patent: March 8, 2011Assignee: Intevac, Inc.Inventors: Terry Bluck, Kevin P Fairbairn, Michael S. Barnes, Christopher T. Lane
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Publication number: 20090191030Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A linear transport chamber includes linear tracks and robot arms riding on the linear tracks to linearly transfer substrates along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers.Type: ApplicationFiled: February 9, 2009Publication date: July 30, 2009Applicant: INTEVAC, INC.Inventors: Terry Bluck, Kevin P. Fairbairn, Michael S. Barnes, Christopher T. Lane
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Publication number: 20090145879Abstract: A system is provided for etching patterned media disks for hard drive. The modular system may be tailored to perform specific processes sequences so that a patterned media disk is fabricated without removing the disk from vacuum environment. In some sequence the magnetic stack is etched while in other the etch is performed prior to forming the magnetic stack. In a further sequence ion implantation is used without etching steps. For etching a movable non-contact electrode is utilized to perform sputter etch. The cathode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched.Type: ApplicationFiled: December 5, 2008Publication date: June 11, 2009Applicant: INTEVAC, INC.Inventors: Kevin P. Fairbairn, Michael S. Barnes, Terry Bluck, Ren Xu, Charles Liu, Ralph Kerns
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Publication number: 20090078374Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.Type: ApplicationFiled: December 1, 2008Publication date: March 26, 2009Applicant: INTEVAC, INC.Inventors: Terry Bluck, Kevin P. Fairbairn, Michael S. Barnes, Christopher T. Lane