Abstract: A method of constructing a preform for use in forming a machined structural assembly is provided. The method includes determining the dimensions of the machined structural assembly. First and second structural members are selected based on the predetermined dimensions of the machined structural assembly. The first structural member is positioned adjacent the second structural member so as to define at least two contact surfaces. The contact surfaces of the first and second structural members are friction welded to construct the preform such that the preform has dimensions approximating the dimensions of the machined structural assembly to thereby reduce material waste when forming the machined structural assembly. A machined structural assembly having predetermined dimensions is formed from the preform by machining away excess material.

Abstract: A method of constructing a preform for use in forming a machined structural assembly is provided. The method includes determining the dimensions of the machined structural assembly. First and second structural members are selected based on the predetermined dimensions of the machined structural assembly. The first structural member is positioned adjacent the second structural member so as to define at least two contact surfaces. The contact surfaces of the first and second structural members are friction welded to construct the preform such that the preform has dimensions approximating the dimensions of the machined structural assembly to thereby reduce material waste when forming the machined structural assembly. A machined structural assembly having predetermined dimensions is formed from the preform by machining away excess material.

Abstract: Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by sintering a stack of individual copper and tungsten powder blend layers having progressively higher copper content/tungsten content, by volume, ratio values in successive powder blend layers in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

Abstract: Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by thermal plasma spraying mixtures of copper powder and tungsten powder in a varied blending ratio such that the blending ratio of the copper powder and the tungsten powder that is fed to a plasma torch is intermittently adjusted to provide progressively higher copper content/tungsten content, by volume, ratio values in the interlayer in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

Abstract: Process for bonding a metal brush structure to a planar surface of a metal substrate in which an array of metal rods are retained and immobilized at their tips by a common retention layer formed of metal, and the brush structure is then joined to a planar surface of a metal substrate via the retention layer.

Abstract: A structural element comprising a first member and a second member interengaged with one another. Each member has an inner layer formed from a machinable material and having a substantially smooth outer surface, and an outer layer having a substantially smooth inner surface of a shape generally complementary to the shape of the outer surface of the inner layer. The inner and outer layers are joined together such that the outer surface of the inner layer and the inner surface of the outer layer are in substantially continuous, face-to-face engagement with each other. The inner layer of the first member has a first formation machined therein. The structural element further comprises an element for interconnecting the first formation of the first member with the second member thereby to form the structural element.