Abstract: Monolithic LED chips are disclosed comprising a plurality of active regions on a submount, wherein the submount comprises integral electrically conductive interconnect elements in electrical contact with the active regions and electrically connecting at least some of the active regions in series. The submount also comprises an integral insulator element electrically insulating at least some of the interconnect elements and active regions from other elements of the submount. The active regions are mounted in close proximity to one another with at least some of the active regions having a space between adjacent ones of the active regions that is 10 percent or less of the width of one or more of the active regions. The space is substantially not visible when the LED chip is emitting, such that the LED chips emits light similar to a filament.

Abstract: Embodiments of the present invention are generally related to LED chips having improved overall emission by reducing the light-absorbing effects of barrier layers adjacent mirror contacts. In one embodiment, a LED chip comprises one or more LEDs, with each LED having an active region, a first contact under the active region having a highly reflective mirror, and a barrier layer adjacent the mirror. The barrier layer is smaller than the mirror such that it does not extend beyond the periphery of the mirror. In another possible embodiment, an insulator is further provided, with the insulator adjacent the barrier layer and adjacent portions of the mirror not contacted by the active region or by the barrier layer. In yet another embodiment, a second contact is provided on the active region.

Abstract: A light emitting diode is disclosed that includes a transparent (and potentially low conductivity) silicon carbide substrate, an active structure formed from the Group III nitride material system on the silicon carbide substrate, and respective ohmic contacts on the top side of the diode. The silicon carbide substrate is beveled with respect to the interface between the silicon carbide and the Group III nitride.

Abstract: A light emitting diode is disclosed that includes a transparent substrate with an absorption coefficient less than 4 per centimeter, epitaxial layers having absorption coefficients of less than 500 per centimeter in the layers other than the active emission layers, an ohmic contact and metallization layer on at least one of the epitaxial layers, with the ohmic contact and metallization layer having a transmission of at least about 80 percent, and bond pads with reflectivity greater than at least about 70 percent.

Abstract: In a display device comprising a first substrate having at least one transparent, first picture electrode of a first material, a second substrate comprising at least one second picture electrode of a second material which, jointly with the picture electrode on the first substrate and an intermediate opto-electronic material, defines a pixel, and means for supplying electric voltages to the picture electrodes, the work function between the two picture electrodes is decreased in that at least one of the picture electrodes is coated with at least one layer of conducting material, or a layer of a material comprising a dipole.

Abstract: A display device is provided which includes a first substrate having at least one transparent, first picture electrode of a first material, a second substrate having at least one second picture electrode of a second material which, jointly with the picture electrode on the first substrate and an intermediate opto-electronic material, defines a pixel, and means for supplying electric voltages to the picture electrodes, wherein at least one of the picture electrodes is coated with at least one layer of a passivating material such that any asymmetry in operation of the device is substantially reduced or eliminated.

Abstract: A display device is provided which includes a first substrate having at least one transparent, first picture electrode of a first material, a second substrate having at least one second picture electrode of a second material which, jointly with the picture electrode on the first substrate and an intermediate opto-electronic material, defines a pixel, and means for supplying electric voltages to the picture electrodes, wherein at least one of the picture electrodes is coated with at least one layer of a passivating material such that any asymmetry in operation of the device is substantially reduced or eliminated.

Abstract: In a display device comprising a first substrate having at least one transparent, first picture electrode of a first material, a second substrate comprising at least one second picture electrode of a second material which, jointly with the picture electrode on the first substrate and an intermediate opto-electronic material, defines a pixel, and means for supplying electric voltages to the picture electrodes, the work function between the two picture electrodes is decreased in that at least one of the picture electrodes is coated with at least one layer of conducting material, or a layer of a material comprising a dipole.

Abstract: A light-emitting semiconductor device such as a laser or LED includes a light-emitting region interposed between two GaN contact layers of different conductivity types. A metal electrical contact is provided directly on one of the contact layers and is formed of an annealed, at least partly alloyed metal layer including hafnium and gold. The metal layer may also include platinum, or platinum and titanium. Light-emitting semiconductor devices such as light-emitting diodes and lasers having such annealed, at least partly alloyed metal layer are particularly suitable for high current-density applications which result in higher operating temperatures, such they are capable of operating at higher temperatures without shorting.

Abstract: In a display device comprising a first substrate having at least one transparent, first picture electrode of a first material, a second substrate comprising at least one second picture electrode of a second material which, jointly with the picture electrode on the first substrate and an intermediate opto-electronic material, defines a pixel, and means for supplying electric voltages to the picture electrodes, the work function between the two picture electrodes is decreased in that at least one of the picture electrodes is coated with at least one layer of conducting material, or a layer of a material comprising a dipole.

Abstract: A method for fracturing semiconductor crystal wafers or bars to form individual chips with active devices without the use of mechanical scribing of the crystal. The method involves forming where fracture is desired a shallow trench by etching in the semiconductor wafer or bar, preferably with sharp corners, or providing over where the fracture is desired the edges of a metallization layer, or both. Applying pressure will then cause the crystal to fracture as a result of strains formed in the crystal at the sharp corners or below the metallization edges. The method is particularly suitable for the fabrication of laser chips from compound semiconductors.

Abstract: An etching composition and method for its use in etching a semiconductor structure, the semiconductor structure comprising a substrate and one or more epitaxial layers. The etching composition comprises a solvent, an etchant, and first and second complexing agents, the etchant and complexing agents being soluble in the solvent. The etchant preferentially etches the substrate with respect to at least one epitaxial layer. The first complexing agent is reactive with the substrate so as to accelerate the rate at which the etchant etches the substrate. The second completing agent is reactive with a component of the at least one epitaxial layer so as to form a resulting compound with the component. This reaction establishes an equilibrium between the resulting compound, the second complexing agent and the component, the equilibrium precluding significant etching of the at least one epitaxial layer.

Abstract: A method for manufacturing a ridge in a channel laser diode in II-VI materials by etching grooves to form an active mesa flanked by support mesas. The method involves using certain etchants for certain compositions of the II-VI layers so that the grooves can be formed by wet chemical etching using only a single photolithographic process.

Abstract: A blue, green or blue-green stripe-geometry II/VI semiconductor injection laser utilizing a Zn.sub.1-u Cd.sub.u Se active layer (quantum well) having Zn.sub.1-x Mg.sub.x S.sub.y Se.sub.1-y cladding layers and ZnS.sub.z Se.sub.1-z guiding layers is fabricated on a GaAs substrate. The stripe-geometry configuration is obtained by ion implanting a dopant such as Nitrogen or Oxygen into the structure to form blocking layer portions of higher resistivity in the second cladding layer and the second guiding layer. These blocking layer portions are positioned on both sides of, and thereby define, a stripe-shaped lateral confinement region of lower resistivity in the second cladding layer and the second cladding layer.

Abstract: A II-VI semiconductor diode laser has a strained layer disposed on top of the structure. This strained layer, having a thickness of between about 0.05 microns and 2 microns, is either a single film or a stack of films, preferably of metal. The strain field produced by this layer in the semiconductor layer structure produces a change in the refractive index of the structure, due to the photo-elastic effect. By virtue of this effect a strain-induced waveguide is provided in the diode laser, with a strained layer in an edge, stripe or window structure. Furthermore, a tensely-strained layer covering the entire structure is used to produce a strain field similar to that which occurs when the structure is bent. This strain field will produce strain-enhanced gain in the underlying structure, which allows for operation of the laser at a lower threshold current.

Abstract: A blue-green II/VI semiconductor injection laser utilizing a Zn.sub.1-u Cd.sub.u Se active layer (quantum well) having Zn.sub.1-x Mg.sub.x S.sub.y Se.sub.1-y cladding layers and ZnS.sub.z Se.sub.1-z guiding layers on a GaAs substrate. These devices are operable in a pulse mode at room temperature.