Abstract: A method may include, in response to a condition related to a particular device of a plurality of devices in an information handling system, causing a particular visual indicator associated with the particular device to illuminate in accordance with a blink pattern. The blink pattern may include one or more first durations of time in which the particular visual indicator is illuminated, one or more second durations of time significantly shorter than the first durations of time in which the particular visual indicator is illuminated, and a plurality of third durations of time significantly shorter than the first durations of time and the second durations of time in which the particular visual indicator is darkened, wherein each first duration of time occurs immediately before and after a third duration of time and each second duration of time occurs immediately before and after a third duration of time.

Abstract: Systems and methods are provided that may be implemented to use compute capabilities of a network interface controller (NIC) to broker a secure connection across a network between a target information handling system (e.g., such as a server) and one or more other entities (e.g., such as other information handling systems implementing a cloud service or private network, and/or that are providing other remote service/s across the network). This secure connection may be brokered by the NIC at a hardware level in a manner that is separate from a host programmable integrated circuit of the same target information handling system, and in a way that is agnostic and independent of any host operating system or other logic that is executing on the host programmable integrated circuit of the target information handling system.

Abstract: A network interface card includes a memory configured to store a credential associated with one of a manufacturer of the network interface card, a particular manufacturer of the server that includes the network interface card, or another manufacturer of an enclosure that holds the network interface card. A processor performs network discovery to identify devices in a local area network, performs port configuration, and establishes a secure network connection with a cloud service broker. Subsequent to the establishment of the secure network connection, the processor submits a provisioning request to the cloud service broker, receives a response to the provisioning request, and applies the security policies to the network interface card, wherein the security policies are for the devices of the local area network.

Abstract: A network interface card includes a memory configured to store a credential associated with one of a manufacturer of the network interface card, a particular manufacturer of the server that includes the network interface card, or another manufacturer of an enclosure that holds the network interface card. A processor performs network discovery to identify devices in a local area network, performs port configuration, and establishes a secure network connection with a cloud service broker. Subsequent to the establishment of the secure network connection, the processor submits a provisioning request to the cloud service broker, receives a response to the provisioning request, and applies the security policies to the network interface card, wherein the security policies are for the devices of the local area network.

Abstract: Systems and methods are provided that may be implemented to use compute capabilities of a network interface controller (NIC) to broker a secure connection across a network between a target information handling system (e.g., such as a server) and one or more other entities (e.g., such as other information handling systems implementing a cloud service or private network, and/or that are providing other remote service/s across the network). This secure connection may be brokered by the NIC at a hardware level in a manner that is separate from a host programmable integrated circuit of the same target information handling system, and in a way that is agnostic and independent of any host operating system or other logic that is executing on the host programmable integrated circuit of the target information handling system.

Abstract: A flat flexible cable may include a plurality of generally parallel, co-planar flat conductive traces sandwiched between two ribbons of dielectric material and a plurality of strips of conductive material formed at intervals along a length of the flat flexible cable, each strip of conductive material electrically coupling a plurality of ground traces of the flat conductive traces to one another via portions of the ground traces exposed through the dielectric material at each of the intervals.

Abstract: As cable assembly may include a cable comprising a plurality of electrically-conductive wires and a hybrid connector that terminates an end of the cable. The hybrid connector may include a receptacle comprising a plurality of receptacle pins and configured to mechanically couple to a printed circuit board and receive an electronic device in order to mechanically couple the electronic device to the receptacle and the printed circuit board and electrically couple each of a plurality of electronic device pins of the electronic device to respective ones of the plurality of receptacle pins. The hybrid connector may also include a first section that electrically couples each of the plurality of electrically-conductive wires to respective ones of the plurality of receptacle pins and a second section that electrically couples each of a plurality of electrical conduits integral to the printed circuit board to respective ones of the plurality of receptacle pins.

Abstract: The side profile of a hard drive assembly may be configured with one or more open areas to allow cooling air to pass side-to-side through a lateral flow channel provided by a cavity defined in the base portion of the hard drive assembly. Corresponding and complementary open areas may be also be defined in mating drive carrier assembly side components to allow passage of lateral side-to-side cooling air through the base portion flow channel of a hard drive assembled to the drive carrier assembly to form a mountable hard drive system that is installed into a storage enclosure. The at least partially aligned open flow areas of the assembled hard dive assembly and drive carrier assembly may cooperate to reduce air flow impedance across multiple rows of hard drive systems through a storage enclosure.

Abstract: A wireless charging module includes an antenna and a wireless charger module. An enclosure is configured to fit at least partially within an optical drive bay of an information handling system. The antenna is disposed within a plastic lower portion of the enclosure. The plastic lower portion of the enclosure is configured to enable the antenna to wirelessly receive power from a wireless charging pad. The wireless charger module is disposed within the enclosure, and is configured to provide power to the information handling system.

Abstract: A method includes determining a first unique identifier corresponding to an information handling system. The method further includes providing the first unique identifier to an asset management tag device affixed to the information handling system, the asset management tag device is communicatively coupled to an asset management system.

Abstract: An information handling system (IHS) has a circuit board assembly with a dual-sided interposer substrate that is inserted between a baseboard and a processor integrated circuit having a second pattern of electrical contacts. The dual interposer substrate formed of a stack of printed circuit boards (PCBs) provides communication channels between a first coupling pad on the baseboard that has a first pattern of electrical contacts and a second coupling pad on top of the dual interposer substrate that provides the second pattern of electrical contacts. The second pattern receives another type of processor integrated circuit than a type supported by the first pattern. Stacked vias formed through the stack of PCBs electrically connect respective electrical contacts of the first and second coupling pads to form a corresponding communication channel. One or more grounded vias mitigate signal integrity (SI) anomalies on the communication channels.

Abstract: A velocity cooled (VC) mobile data center (MDC) utilizes exhaust/residual heat to preheat cooling air. The MDC includes a volumetric container with heat generating information technology (IT) equipment positioned therein, having a minimum operating temperature. The MDC includes a ram air based cooling subsystem that provides a flow of outside cooling air to cool the IT equipment when the MDC is mobile. An engine of the transport vehicle connected to the container generates exhaust/residual heat during operation. The MDC includes an exhaust heat re-routing subsystem, fluidly coupled to the container, and which channels the exhaust heat from the transport vehicle engine towards the container to provide additional heating of ingested ram air to bring the ambient temperature of the IT equipment up to within the specific range of operating temperatures, above the minimum operating temperature. A flow control mechanism selectively opened or closed to direct the exhaust heat flow.

Abstract: A drive carrier includes a latch wire, and a track that includes first and second segments. The latch wire is configured to move along a channel in the track to enable a handle of the drive carrier to transition between multiple positions within the track. The first segment is to be placed in physical communication with the latch wire while the latch wire is at a first position and a second position within the track. The second segment is in physical communication with the first segment. The second segment is to transition between a misaligned position and an aligned position with respect to the first segment, and the latch wire is to transition from the second position to a third position within the track in response to the second segment being in the aligned position.

Abstract: An information handling system (IHS) has a circuit board assembly with a dual-sided interposer substrate that is inserted between a baseboard and a processor integrated circuit having a second pattern of electrical contacts. The dual interposer substrate formed of a stack of printed circuit boards (PCBs) provides communication channels between a first coupling pad on the baseboard that has a first pattern of electrical contacts and a second coupling pad on top of the dual interposer substrate that provides the second pattern of electrical contacts. The second pattern receives another type of processor integrated circuit than a type supported by the first pattern. Stacked vias formed through the stack of PCBs electrically connect respective electrical contacts of the first and second coupling pads to form a corresponding communication channel. One or more grounded vias mitigate signal integrity (SI) anomalies on the communication channels.

Abstract: In accordance with embodiments of the present disclosure, a system may include an information handling resource and an expansion cold plate thermally coupled to the information handling resource and configured to be fluidically coupled to a refrigeration system and configured to expand a refrigerant within the expansion cold plate in order to cool the information handling resource.

Abstract: A connector system includes a first connector element and a second connector element. The first connector element includes a first contact that has a first contact region and a first wipe region. The second connector element includes a second contact that has a second contact region and a second wipe region. When the first connector element is mated with the second connector element, the first contact region makes a first point electrical contact with the second wipe region such that the first contact does not form a first tuned electrical stub.

Abstract: An information handling system (IHS) has a circuit board assembly with a dual-sided interposer substrate that is inserted between a baseboard and a processor integrated circuit having a second pattern of electrical contacts. The dual interposer substrate formed of a stack of printed circuit boards (PCBs) provides communication channels between a first coupling pad on the baseboard that has a first pattern of electrical contacts and a second coupling pad on top of the dual interposer substrate that provides the second pattern of electrical contacts. The second pattern receives another type of processor integrated circuit than a type supported by the first pattern. Stacked vias formed through the stack of PCBs electrically connect respective electrical contacts of the first and second coupling pads to form a corresponding communication channel. One or more grounded vias mitigate signal integrity (SI) anomalies on the communication channels.

Abstract: An information handling system (IHS) has a circuit board assembly with a dual-sided interposer substrate that is inserted between a baseboard and a processor integrated circuit having a second pattern of electrical contacts. The dual interposer substrate formed of a stack of printed circuit boards (PCBs) provides communication channels between a first coupling pad on the baseboard that has a first pattern of electrical contacts and a second coupling pad on top of the dual interposer substrate that provides the second pattern of electrical contacts. The second pattern receives another type of processor integrated circuit than a type supported by the first pattern. Stacked vias formed through the stack of PCBs electrically connect respective electrical contacts of the first and second coupling pads to form a corresponding communication channel. One or more grounded vias mitigate signal integrity (SI) anomalies on the communication channels.

Abstract: A wireless charging module includes an antenna and a wireless charger module. An enclosure is configured to fit at least partially within an optical drive bay of an information handling system. The antenna is disposed within a plastic lower portion of the enclosure. The plastic lower portion of the enclosure is configured to enable the antenna to wirelessly receive power from a wireless charging pad. The wireless charger module is disposed within the enclosure, and is configured to provide power to the information handling system.

Abstract: An information handling system circuit board interfaces storage device surface connectors and storage device controllers disposed on opposing sides by coupling a first circuit board portion having a controller press in connector to a second circuit board portion having plural surface connectors. The first and second circuit board portions couple to each other with an adhesive activated by curing. Resistant ink is printed over openings of the first circuit board portion where adhesive is applied in order to prevent the adhesive from flowing into the openings at or before the curing of the adhesive.