Patents by Inventor KEWU WANG

KEWU WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240045161
    Abstract: An optical module includes a housing, a printed circuit board, an optical assembly, an optical interface joined with the optical assembly, the printed circuit board, the optical assembly, and the optical interface being disposed in the housing, an adapter to be mated with an external optical connector and disposed on an end of the housing, and first and second connecting part disposed on the adapter and the housing, respectively. The adapter and the housing are secured together through the first and second connecting parts. The optical interface and the adapter are configured to correspond to each other.
    Type: Application
    Filed: October 20, 2023
    Publication date: February 8, 2024
    Inventors: Zhanwei WANG, Kewu WANG
  • Patent number: 11803023
    Abstract: An optical module includes a housing, a printed circuit board, an optical assembly, an optical interface joined with the optical assembly, the printed circuit board, the optical assembly, and the optical interface being disposed in the housing, an adapter to be mated with an external optical connector and disposed on an end of the housing, and first and second connecting part disposed on the adapter and the housing, respectively. The adapter and the housing are secured together through the first and second connecting parts. The optical interface and the adapter are configured to correspond to each other.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: October 31, 2023
    Assignee: INNOLIGHT TECHNOLOGY PTE. LTD.
    Inventors: Zhanwei Wang, Kewu Wang
  • Patent number: 11668887
    Abstract: An optical module includes a housing including an optical interface, a circuit board module disposed in the housing, a fiber optic receptacle module disposed in the housing and including a plurality of fiber optic receptacles, an optoelectronic chip disposed in the housing and electrically connected to the circuit board module, a position limiting card disposed behind the fiber optic receptacle module, and a plurality of through holes arranged at the optical interface. The plurality of fiber optic receptacles are installed at the optical interface and fit through the plurality of through holes, and the position limiting card is fixed to the housing and locks the fiber optic receptacle module tightly against the optical interface.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: June 6, 2023
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Jie Zhou, Kewu Wang
  • Publication number: 20220326460
    Abstract: An optical module includes a housing including an optical interface, a circuit board module disposed in the housing, a fiber optic receptacle module disposed in the housing and including a plurality of fiber optic receptacles, an optoelectronic chip disposed in the housing and electrically connected to the circuit board module, a position limiting card disposed behind the fiber optic receptacle module, and a plurality of through holes arranged at the optical interface. The plurality of fiber optic receptacles are installed at the optical interface and fit through the plurality of through holes, and the position limiting card is fixed to the housing and locks the fiber optic receptacle module tightly against the optical interface.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 13, 2022
    Inventors: Jie ZHOU, Kewu WANG
  • Publication number: 20220252803
    Abstract: An optical module includes a housing, a printed circuit board, an optical assembly, an optical interface joined with the optical assembly, the printed circuit board, the optical assembly, and the optical interface being disposed in the housing, an adapter to be mated with an external optical connector and disposed on an end of the housing, and first and second connecting part disposed on the adapter and the housing, respectively. The adapter and the housing are secured together through the first and second connecting parts. The optical interface and the adapter are configured to correspond to each other.
    Type: Application
    Filed: April 28, 2022
    Publication date: August 11, 2022
    Inventors: Zhanwei WANG, Kewu WANG
  • Patent number: 11378764
    Abstract: An optical module includes a housing including an optical interface, a circuit board module disposed in the housing, a fiber optic receptacle module disposed in the housing and including a plurality of fiber optic receptacles, and an optoelectronic chip disposed in the housing and electrically connected to the circuit board module. The plurality of fiber optic receptacles are connected together and are installed at the optical interface.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: July 5, 2022
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Jie Zhou, Kewu Wang
  • Patent number: 11347011
    Abstract: An optical module includes a housing, a printed circuit board, an optical assembly, an optical interface joined with the optical assembly, the printed circuit board, the optical assembly, and the optical interface being disposed in the housing, an adapter to be mated with an external optical connector and disposed on an end of the housing, and first and second connecting part disposed on the adapter and the housing, respectively. The adapter and the housing are secured together through the first and second connecting parts. The optical interface and the adapter are configured to correspond to each other.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: May 31, 2022
    Assignee: InnoLight Technology Pte. Ltd.
    Inventors: Zhanwei Wang, Kewu Wang
  • Publication number: 20200341219
    Abstract: An optical module includes a housing including an optical interface, a circuit board module disposed in the housing, a fiber optic receptacle module disposed in the housing and including a plurality of fiber optic receptacles, and an optoelectronic chip disposed in the housing and electrically connected to the circuit board module. The plurality of fiber optic receptacles are connected together and are installed at the optical interface.
    Type: Application
    Filed: April 22, 2020
    Publication date: October 29, 2020
    Inventors: Jie ZHOU, Kewu WANG
  • Patent number: 10455737
    Abstract: An optical module includes a housing, a PCB base board, an optical assembly, and a heat generating device. The PCB base board, the optical assembly, and the heat generating device are arranged in the housing. The heat generating device is thermally connected to the housing. A plurality of ribs are arranged outside the housing. Air flow channels are formed between the plurality of ribs and extend along a longitudinal direction of the optical module. Each one of the ribs has a first end portion, a second end portion, and a middle portion that connects the first end portion and the second end portion. A radial width of at least one of the ribs gradually increases from the first end portion of the at least one of the ribs toward the middle portion of the at least one of the ribs.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: October 22, 2019
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Chao Zhang, Kewu Wang
  • Publication number: 20190227247
    Abstract: An optical module includes a housing, a printed circuit board, an optical assembly, an optical interface joined with the optical assembly, the printed circuit board, the optical assembly, and the optical interface being disposed in the housing, an adapter to be mated with an external optical connector and disposed on an end of the housing, and first and second connecting part disposed on the adapter and the housing, respectively. The adapter and the housing are secured together through the first and second connecting parts. The optical interface and the adapter are configured to correspond to each other.
    Type: Application
    Filed: April 5, 2019
    Publication date: July 25, 2019
    Inventors: Zhanwei WANG, Kewu WANG
  • Publication number: 20190223325
    Abstract: An optical module includes a housing, a printed circuit board disposed in the housing, a heat generating chip electrically connected to the printed circuit board, and a heat pipe disposed between the housing and the heat generating chip. The heat pipe has a heat absorbing end abutting the heat generating chip and a heat dissipating end away from the heat generating chip. The heat absorbing end absorbs heat generated from the heat generating chip and transfers the heat to the heat dissipating end. The heat dissipating end transfers the heat to an area of the housing that is away from the heat generating chip.
    Type: Application
    Filed: January 17, 2019
    Publication date: July 18, 2019
    Inventors: Chao ZHANG, Kewu WANG
  • Publication number: 20190174654
    Abstract: An optical module includes a housing, a PCB base board, an optical assembly, and a heat generating device. The PCB base board, the optical assembly, and the heat generating device are arranged in the housing. The heat generating device is thermally connected to the housing. A plurality of ribs are arranged outside the housing. Air flow channels are formed between the plurality of ribs and extend along a longitudinal direction of the optical module. Each one of the ribs has a first end portion, a second end portion, and a middle portion that connects the first end portion and the second end portion. A radial width of at least one of the ribs gradually increases from the first end portion of the at least one of the ribs toward the middle portion of the at least one of the ribs.
    Type: Application
    Filed: November 1, 2018
    Publication date: June 6, 2019
    Inventors: Chao ZHANG, Kewu WANG
  • Patent number: 10302879
    Abstract: An optical communication module includes: a casing with an optical signal port and an electrical signal port arranged respectively on two ends of the casing; a circuit board assembly and an optical component assembly arranged inside the casing, the circuit board assembly including a circuit board and a control unit arranged on the circuit board; a fiber-optic communication cable connected to the optical signal port; and a status indicator unit arranged on the fiber-optic communication cable.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: May 28, 2019
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventor: Kewu Wang
  • Patent number: 10254492
    Abstract: An optical module includes a housing, a printed circuit board, an optical assembly, an optical interface joined with the optical assembly, the printed circuit board, the optical assembly, and the optical interface being disposed in the housing, an adapter to be mated with an external optical connector and disposed on an end of the housing, and first and second connecting part disposed on the adapter and the housing, respectively. The adapter and the housing are secured together through the first and second connecting parts. The optical interface and the adapter are configured to correspond to each other.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: April 9, 2019
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Zhanwei Wang, Kewu Wang
  • Publication number: 20190025530
    Abstract: An optical module includes a housing, a printed circuit board, an optical assembly, an optical interface joined with the optical assembly, the printed circuit board, the optical assembly, and the optical interface being disposed in the housing, an adapter to be mated with an external optical connector and disposed on an end of the housing, and first and second connecting part disposed on the adapter and the housing, respectively. The adapter and the housing are secured together through the first and second connecting parts. The optical interface and the adapter are configured to correspond to each other.
    Type: Application
    Filed: December 22, 2017
    Publication date: January 24, 2019
    Inventors: Zhanwei WANG, Kewu WANG
  • Patent number: 10107978
    Abstract: An optical module includes: an optical assembly, including a light receiving assembly and/or a light transmitting assembly; a printed circuit board, on which the optical assembly is mounted; an adapter, used for docking with external connectors, wherein the adapter is configured to fit the optical assembly and to be fixed to the printed circuit board, and the adapter includes a metal part and a plastic part; and a conductive shell, used for accommodating the printed circuit board, the optical assembly, and the adapter, the conductive shell being electrically connected to the metal part of the adapter.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: October 23, 2018
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Xian Zhou, Kewu Wang
  • Publication number: 20180074273
    Abstract: An optical communication module includes: a casing with an optical signal port and an electrical signal port arranged respectively on two ends of the casing; a circuit board assembly and an optical component assembly arranged inside the casing, the circuit board assembly including a circuit board and a control unit arranged on the circuit board; a fiber-optic communication cable connected to the optical signal port; and a status indicator unit arranged on the fiber-optic communication cable.
    Type: Application
    Filed: September 12, 2017
    Publication date: March 15, 2018
    Inventor: Kewu WANG
  • Patent number: 9915780
    Abstract: An optical module with a dual layer printed circuit board assembly (PCBA) structure. The optical module includes a first casing and a second casing, and a first PCBA board and a second PCBA board located between the first casing and the second casing, a plurality of power components arranged on opposing surfaces of at least one of the first PCBA board and the second PCBA board, a layer of thermal superconducting medium of a bent arrangement including a first thermal conducting part and a second thermal conducting part arranged opposite to each other, the first thermal conducting part being thermally connected to the power component, and the second thermal conducting part being thermally connected to at least one of the first casing and the second casing, and at least one insulating layer arranged between the layer of thermal superconducting medium and the power components.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: March 13, 2018
    Assignee: InnoLight Technology (Suzhou) LTD.
    Inventors: Zhanwei Wang, Kewu Wang
  • Patent number: 9866328
    Abstract: An optical module includes an optical fiber connector, a transmitter optical component, a receiver optical component and a printed circuit board arranged within an optical module housing; the transmitter optical component and the receiver optical component are optically coupled to the optical fiber connector, and electrically connected to the printed circuit board which is arranged horizontally within the optical module housing. The transmitter optical component and the receiver optical component are stacked in a direction perpendicular to the printed circuit board. Stacking the transmitter optical component and the receiver optical component makes use of the width of the optical module by improving design flexibility of the optical path and the electric circuit, reducing or even substantially eliminating crosstalk between the high-speed devices and high-speed signals, and improving the heat dissipation effect of the optical module.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: January 9, 2018
    Assignee: InnoLight Technology (Suzhou) LTD.
    Inventors: Xiangzhong Wang, Yuzhou Sun, Kewu Wang, Xiaoming Xu
  • Patent number: RE48778
    Abstract: An optical module includes: an optical assembly, including a light receiving assembly and/or a light transmitting assembly; a printed circuit board, on which the optical assembly is mounted; an adapter, used for docking with external connectors, wherein the adapter is configured to fit the optical assembly and to be fixed to the printed circuit board, and the adapter includes a metal part and a plastic part; and a conductive shell, used for accommodating the printed circuit board, the optical assembly, and the adapter, the conductive shell being electrically connected to the metal part of the adapter.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: October 19, 2021
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Xian Zhou, Kewu Wang