Abstract: An optical module with a dual layer printed circuit board assembly (PCBA) structure. The optical module includes a first casing and a second casing, and a first PCBA board and a second PCBA board located between the first casing and the second casing, a plurality of power components arranged on opposing surfaces of at least one of the first PCBA board and the second PCBA board, a layer of thermal superconducting medium of a bent arrangement including a first thermal conducting part and a second thermal conducting part arranged opposite to each other, the first thermal conducting part being thermally connected to the power component, and the second thermal conducting part being thermally connected to at least one of the first casing and the second casing, and at least one insulating layer arranged between the layer of thermal superconducting medium and the power components.

Abstract: An optical module includes: an optical assembly, including a light receiving assembly and/or a light transmitting assembly; a printed circuit board, on which the optical assembly is mounted; an adapter, used for docking with external connectors, wherein the adapter is configured to fit the optical assembly and to be fixed to the printed circuit board, and the adapter includes a metal part and a plastic part; and a conductive shell, used for accommodating the printed circuit board, the optical assembly, and the adapter, the conductive shell being electrically connected to the metal part of the adapter.

Abstract: This disclosure provides an optical assembly, comprising a base body and a wave filtering apparatus. A first slot is disposed on an upper surface of the base body. A total internal reflection surface and a connecting part are formed in the first slot. The total internal reflection surface reflects collimated light formed by a first lens from a light emitting apparatus. The wave filtering apparatus comprises a first part removably connected to the connecting portion, and a second portion forming a beam splitting surface. The wave filtering apparatus has a light-pervious optical coating at least on the beam splitting surface of the apparatus, and is configured to split the collimated light reflected from the total internal reflection surface into a first beam and a second beam. The first beam travels towards the side where the third lens is located, and the second beam travels towards a photoelectric detection apparatus.

Abstract: An optical transceiver module includes a first flexible circuit board and a second flexible circuit board; a light receiving unit and a light transmitting unit disposed on the first flexible circuit board and the second flexible circuit board, respectively; a printed circuit board connected to the first flexible circuit board and the second flexible circuit board, and including a connecting point; and a signal processing unit disposed on at least one of the first flexible circuit board, the second flexible circuit board, and the printed circuit board. The signal processing unit processes optical signals received by the light receiving unit and transmits the signals to the connecting point of the printed circuit board, and processes electrical signals transmitted from the connecting point of the printed circuit board and transmits the signals out through the light transmitting unit.

Abstract: An optical module includes an optical fiber connector, a transmitter optical component, a receiver optical component and a printed circuit board arranged within an optical module housing; the transmitter optical component and the receiver optical component are optically coupled to the optical fiber connector, and electrically connected to the printed circuit board which is arranged horizontally within the optical module housing. The transmitter optical component and the receiver optical component are stacked in a direction perpendicular to the printed circuit board. Stacking the transmitter optical component and the receiver optical component makes use of the width of the optical module by improving design flexibility of the optical path and the electric circuit, reducing or even substantially eliminating crosstalk between the high-speed devices and high-speed signals, and improving the heat dissipation effect of the optical module.

Abstract: A packaging structure and an optical module using the same are disclosed, wherein said packaging structure includes: a printed circuit board, having a first surface and a second surface opposite to each other; a heat dissipation hole running through the first and second surfaces of the printed circuit board; a heat dissipation block fixed within the heat dissipation hole; a power device provided on the first surface of the printed circuit board, wherein the power device is in a thermal conductive connection with the heat dissipation block. No adhesive or other dielectric of low heat conductivity coefficient is necessary during the manufacturing process of the heat dissipation block. The heat dissipation hole can open wider, as the fixation of copper paste and the heat dissipation hole are not a concern. Therefore, the heat dissipation ability of the packaging structure is optimized and the stable operation of the device is ensured.

Abstract: An optical transceiver module includes a first flexible circuit board and a second flexible circuit board; a light receiving unit and a light transmitting unit disposed on the first flexible circuit board and the second flexible circuit board, respectively; a printed circuit board connected to the first flexible circuit board and the second flexible circuit board, and including a connecting point; and a signal processing unit disposed on at least one of the first flexible circuit board, the second flexible circuit board, and the printed circuit board. The signal processing unit processes optical signals received by the light receiving unit and transmits the signals to the connecting point of the printed circuit board, and processes electrical signals transmitted from the connecting point of the printed circuit board and transmits the signals out through the light transmitting unit.

Abstract: This disclosure provides an optical assembly, comprising a base body and a wave filtering apparatus. A first slot is disposed on an upper surface of the base body. A total internal reflection surface and a connecting part are formed in the first slot. The total internal reflection surface reflects collimated light formed by a first lens from a light emitting apparatus. The wave filtering apparatus comprises a first part removably connected to the connecting portion, and a second portion forming a beam splitting surface. The wave filtering apparatus has a light-pervious optical coating at least on the beam splitting surface of the apparatus, and is configured to split the collimated light reflected from the total internal reflection surface into a first beam and a second beam. The first beam travels towards the side where the third lens is located, and the second beam travels towards a photoelectric detection apparatus.