Abstract: A standard RF connector assembly for wireless communications antenna system. The RF connector assembly includes a first connector housing incorporating an RF connector, the housing including a first latch plate attached to the housing and has at least two toggle mounts. A toggle is attached to each toggle mount and each toggle includes a metal band pivotably attached to the toggle. A second connector housing incorporating a second RF connector includes a second latch plate attached to the second housing and has at least two tabs configured to be engaged by the metal bands to secure the first and second housing into latched engagement with each other.

Abstract: A closure system, assembly and attended method for closing and opening in the tissue of the patient includes first and second closure members each including a biased construction operative for disposition of the closure members into an out of retracted and expanded orientations. A connector is disposed in interconnecting relation with the closure members and structured to establish at least a partial spacing there between. The biased construction and the interconnection of the closure members facilitate con current disposition of the closure members with one another into and through an introductory instrument as well as independent and successive disposition of the first and second closure members into a closing relation to the tissue opening upon exiting the introductory instrument.

Abstract: The present disclosure provides a foldable buttstock assembly for a pneumatic air gun. The foldable buttstock assembly has a foldable buttstock air fitting adapter connected to an air tank to a barrel unit of the pneumatic air gun. It also has an air channeling fitting to channel flow of the air gas. The pneumatic air gun can be operated while the air tank is in any position.

Abstract: A system for and a method of regulating the data interconnections between applications running on an infrastructure are provided. The system/method records access permission data into metadata embedded in the source code of each such application that regulates the data that can be received or transmitted by that application. In addition to regulating the receipt or transmission of data, the metadata can serve to provide instruction to firewalls and other regulating systems in order to configure those systems to allow the applications to receive and transmit data for which permissions have been recorded.

Abstract: The present disclosure provides a foldable buttstock assembly for a pneumatic air gun. The foldable buttstock assembly has a foldable buttstock air fitting adapter connected to an air tank to a barrel unit of the pneumatic air gun. It also has an air channeling fitting to channel flow of the air gas. The pneumatic air gun can be operated while the air tank is in any position.

Abstract: A core-shell microneedle system and a method of manufacturing the microneedle system provides a pulsatile drug delivery system which is programmed to release drugs/vaccines at predictable times using biodegradable polymers and with controllable dosages. This microneedle system can be fully embedded into the skin and then release drugs/vaccines as sharp bursts in a timely manner, similar to multiple bolus injections.

Abstract: A device (100) for the excision of a heart valve via a percutaneous route having a proximal (20) and distal (30) end, comprising an expandable cutting instrument, ECI, that forms a receptacle in the open configuration for receiving, compacting and containing the excised heart valve, an expandable cutting block, ECB, and a displacement mechanism (5, 6) for adjusting the distance between the ECI and the ECB (70).

Abstract: A device (100) is presented for excision of a heart valve comprising a first (120) and second (140) clamping element in mutual sliding relation, each having an annular clamping surface (122, 142) which annular clamping surfaces (122, 142) mutually co-operate to form an annular clamping region (166) configured for clamping a heart valve annularly, and a slidable cutting element (160) slidable and rotatable with respect to the annular clamping region (166) configured to circularly excise the heart valve, wherein the slidable cutting element (160) is displaceable within an annulus of the annular clamping zone region (166).

Abstract: A surface mount device includes at least one semiconductor device including an exposed top metal, an encapsulation layer partially encapsulating the at least one semiconductor device, and at least one end-termination cap on the surface mount device resulting in an electrical connection from a first side of the surface mount device to a second side of the surface mount device. In implementations, one process for fabricating the surface mount device includes dicing a finished device wafer in a scribe-line region, applying tape to a first side of the finished device wafer, backgrinding a second side of the finished device wafer, encapsulating the second side of the finished device wafer with an encapsulation layer, singulating the finished device wafer, and forming at least one wrap-around connection from a first side of the surface mount device to a second side of the surface mount device.

Abstract: Disclosed is an implant molding system for the molding of an hardenable implant forming material including a mold obtainable from an image of a bone defect by additive manufacturing and having a surface concave along at least one axis; and a tangible unit for retaining the implant forming material in the mold during hardening and for unmolding the implant thereafter; wherein the tangible unit for retaining the implant forming material in the mold during hardening and for unmolding after hardening includes or consists of a coating to be applied onto the concave surface of the mold.

Abstract: Semiconductor devices are described that employ techniques configured to control adhesive application between a substrate and a die. In an implementation, a sacrificial layer is provided on a top surface of the die to protect the surface, and bonds pads thereon, from spill-over of the adhesive. The sacrificial layer and spill-over adhesive are subsequently removed from the die and/or chip carrier. In an implementation, the die includes a die attach film (DAF) on a bottom surface of the die for adhering the die to the cavity of the substrate. The die is applied to the cavity with heat and pressure to cause a portion of the die attach film (DAF) to flow from the bottom surface of the die to a sloped surface of the substrate cavity.

Abstract: Light sensors are described that include a trench structure integrated therein. In an implementation, the light sensor includes a substrate having a dopant material of a first conductivity type and multiple trenches disposed therein. The light sensor also includes a diffusion region formed proximate to the multiple trenches. The diffusion region includes a dopant material of a second conductivity type. A depletion region is created at the interface of the dopant material of the first conductivity type and the dopant material of the second conductivity type. The depletion region is configured to attract charge carriers to the depletion region, at least substantially a majority of the charge carriers generated due to light incident upon the substrate.

Abstract: A standard RF connector assembly for wireless communications antenna system. The RF connector assembly includes a first connector housing incorporating an RF connector, the housing including a first latch plate attached to the housing and has at least two toggle mounts. A toggle is attached to each toggle mount and each toggle includes a metal band pivotably attached to the toggle. A second connector housing incorporating a second RF connector includes a second latch plate attached to the second housing and has at least two tabs configured to be engaged by the metal bands to secure the first and second housing into latched engagement with each other.

Abstract: Aspects of the disclosure pertain to a packaging structure configured for providing heterogeneous packaging of electronic components and a process for making same. The packaging structure includes a carrier substrate having a plurality of cavities formed therein. The packaging structure further includes a first die and a second die. The first die is at least substantially contained within a first cavity included in the plurality of cavities. The second die is at least substantially contained within a second cavity included in the plurality of cavities. The first die is fabricated via a first fabrication technology, and the second die is fabricated via a second fabrication technology, the second fabrication technology being different than the first fabrication technology. The packaging structure also includes electrical interconnect circuitry connected to (e.g., for electrically connecting) the first die, the second die and/or the carrier substrate.

Abstract: Semiconductor devices are described that include a capacitor integrated therein. In an implementation, the semiconductor devices include a substrate. The substrate includes multiple capacitor regions, such as a first capacitor region and a second capacitor region that are adjacent to one another. Each capacitor region includes trenches that are formed within the substrate. A metal-insulator-metal capacitor is formed within the trenches and at least partially over the substrate. The trenches disposed within the first capacitor region are at least substantially perpendicular to the trenches disposed within the second capacitor region.

Abstract: Semiconductor devices are described that include a capacitor integrated therein. In an implementation, the semiconductor devices include a substrate including a dopant material of a first conductivity type. A plurality of trenches are formed within the substrate. The semiconductor devices also include a diffusion region having dopant material of a second conductivity type formed proximate to the trenches. A capacitor is formed within the trenches and at least partially over the substrate. The capacitor includes at least a first electrode, a second electrode, and a dielectric material formed between the first and second electrodes.

Abstract: A paintball assembly capable of retaining a paintball in a loading chamber using a paintball catcher is disclosed. The paintball assembly includes a loading chamber, a detent, and a bolt. The loading chamber is coupled to a loading port to receive paintballs. In one embodiment, the detent includes a paintball catcher capable of catching the paintball as it is loaded into the loading chamber. In one example, the paintball catcher is a flexible paintball catcher extending into the loading chamber and is able to catch the paintball and hold it in a predefined position. When a trigger is pulled, the bolt pushes the paintball into a firing chamber while the paintball catcher releases the paintball.

Abstract: Semiconductor devices are described that include a capacitor integrated therein. In an implementation, the semiconductor devices include a substrate including a dopant material of a first conductivity type. A plurality of trenches are formed within the substrate. The semiconductor devices also include a diffusion region having dopant material of a second conductivity type formed proximate to the trenches. A capacitor is formed within the trenches and at least partially over the substrate. The capacitor includes at least a first electrode, a second electrode, and a dielectric material formed between the first and second electrodes.

Abstract: A surface mount device includes at least one semiconductor device including an exposed top metal, an encapsulation layer partially encapsulating the at least one semiconductor device, and at least one end-termination cap on the surface mount device resulting in an electrical connection from a first side of the surface mount device to a second side of the surface mount device. In implementations, one process for fabricating the surface mount device includes dicing a finished device wafer in a scribe-line region, applying tape to a first side of the finished device wafer, backgrinding a second side of the finished device wafer, encapsulating the second side of the finished device wafer with an encapsulation layer, singulating the finished device wafer, and forming at least one wrap-around connection from a first side of the surface mount device to a second side of the surface mount device.

Abstract: A computer-implemented method to provide a secure uniform resource locator (URL) shortening service is described. A URL is received via a browser provided on a display of a computing device. A shortened URL is generated to represent the received URL. A determination is made as to whether a classification assigned to a web site associated with the shortened URL is valid. Upon determining that the assigned classification is not valid, the web site is evaluated in order to assign an updated valid classification to the web site.