Patents by Inventor Kheng Leng Tan
Kheng Leng Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200126958Abstract: A light-emitting device with at least two light-emitting dies encapsulated with two different types of the wavelength-converting materials is disclosed. Each of the wavelength-converting materials is configured to produce a visible light from a narrow band light near UV region produced by the light-emitting dies, but with different correlated color temperatures (CCT) and different spectral contents. The combination of the two visible light forms the desired visible white light. The Color rendering index of the light-emitting device is tunable by adjusting the supply current to the light-emitting dies. In another embodiment, a light module with tunable CRI for an illumination system is disclosed.Type: ApplicationFiled: December 18, 2019Publication date: April 23, 2020Applicant: Bench Walk Lighting LLCInventors: Keat Chuan Ng, Bit Tie Chan, Kheng Leng Tan
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Patent number: 10522518Abstract: A light-emitting device with at least two light-emitting dies encapsulated with two different types of the wavelength-converting materials is disclosed. Each of the wavelength-converting materials is configured to produce a visible light from a narrow band light near UV region produced by the light-emitting dies, but with different correlated color temperatures (CCT) and different spectral contents. The combination of the two visible light forms the desired visible white light. The Color rendering index of the light-emitting device is tunable by adjusting the supply current to the light-emitting dies. In another embodiment, a light module with tunable CRI for an illumination system is disclosed.Type: GrantFiled: December 23, 2010Date of Patent: December 31, 2019Assignee: Bench Walk Lighting, LLCInventors: Keat Chaun Ng, Bit Tie Chan, Kheng Leng Tan
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Patent number: 9474116Abstract: An illumination device, system, and method are disclosed. The illumination system includes a first set of light sources and a second set of light sources, driven by a first driver and second driver, respectively. The system further includes a dimming control system that implemented dimming control logic. The dimming control logic coordinates the operation of the first and second drivers such that the first and second sets of light sources are activated and deactivated so as to achieve substantially constant color temperature during dimming operations.Type: GrantFiled: January 3, 2013Date of Patent: October 18, 2016Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Choon Guan Ko, Kheng Leng Tan
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Publication number: 20160163935Abstract: A semiconductor device comprising a first conductor, a semiconductor die, a second conductor, an encapsulant, a first body, and a second body is disclosed. The semiconductor die may be coupled to the first conductor and the second conductors. The encapsulant may be encapsulating the semiconductor die and may comprise an illumination surface where light emitted and detected by the semiconductor device substantially passes through. The first and second conductors and the first and second bodies are interconnected by the encapsulant. A portion of the encapsulant other than the illumination surface is exposed by a gap between the first and second bodies so as to absorb stress resulting from temperature-induced movement of the encapsulant.Type: ApplicationFiled: December 3, 2014Publication date: June 9, 2016Inventors: Eit Thian Yap, Keat Chuan Ng, Kheng Leng Tan
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Publication number: 20160126430Abstract: In one embodiment, a light-emitting device having a light source die, a substantially transparent encapsulant surrounding the light source die, and a second substantially transparent encapsulant at least partially covering the first substantially transparent encapsulant is disclosed. The second substantially transparent encapsulant may expose a portion of the first substantially transparent encapsulant. The second substantially transparent encapsulant may be less tacky, and may be hardened as compared to the first substantially transparent encapsulant. The second substantially transparent encapsulant may comprise a plurality of encapsulant islands that are distanced away from one another. In another embodiment, the light-emitting device may comprise a third substantially transparent encapsulant covering a portion of the first substantially transparent encapsulant that is exposed by the second substantially transparent encapsulant.Type: ApplicationFiled: November 3, 2014Publication date: May 5, 2016Inventors: Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
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Patent number: 9228715Abstract: A lighting system and method are disclosed. Specifically, the lighting system includes a hybrid canopy that can provide an optimum light beam shape for a number of different lighting applications. The hybrid canopy is equipped with lighting clusters of different types, thereby enabling a broader beam output without sacrificing beam intensity or brightness.Type: GrantFiled: February 22, 2012Date of Patent: January 5, 2016Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Kum Soon Wong, Kheng Leng Tan, Chuan Hoe Chan
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Patent number: 9209373Abstract: A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package includes a lead frame with an integrated reflector cup. The reflector cup is directly connected to a heat sink, which improves the ability of the PLCC package to distribute heat away from the light source that is provided in the reflector cup.Type: GrantFiled: February 23, 2011Date of Patent: December 8, 2015Assignee: Intellectual Discovery Co., Ltd.Inventors: Keat Chuan Ng, Kheng Leng Tan, Chaiu Jin Lee
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Patent number: 9184149Abstract: In one embodiment, a semiconductor device having a die attach pad, an interlocking wire bond, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. A portion of the interlocking wire bond may be submerged within the adhesive material. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock bonding structure submerged within the adhesive material. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.Type: GrantFiled: February 12, 2014Date of Patent: November 10, 2015Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
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Patent number: 9147813Abstract: A package for a light source, a semiconductor device, and methods of manufacturing the same are disclosed. In particular, a Light Emitting Diode (LED) dice is attached to a bonding pad of the light source package by two discrete types of different adhesives. One of the adhesives may be curable under exposure to Ultraviolet (UV) light and the other adhesive may be cured under thermal radiation, but is stable when exposed to UV light.Type: GrantFiled: September 9, 2011Date of Patent: September 29, 2015Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Bit Tie Chan, Kheng Leng Tan
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Patent number: 9142528Abstract: In one embodiment, a semiconductor device having a die attach pad, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. The die attach pad may be sandwiched between the semiconductor die and the die attach pad. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock structure formed integrally with the die attach pad. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.Type: GrantFiled: February 12, 2014Date of Patent: September 22, 2015Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
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Publication number: 20150228608Abstract: In one embodiment, a semiconductor device having a die attach pad, an interlocking wire bond, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. A portion of the interlocking wire bond may be submerged within the adhesive material. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock bonding structure submerged within the adhesive material. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.Type: ApplicationFiled: February 12, 2014Publication date: August 13, 2015Applicant: Avago Technologes General IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
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Publication number: 20150228611Abstract: In one embodiment, a semiconductor device having a die attach pad, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. The die attach pad may be sandwiched between the semiconductor die and the die attach pad. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock structure formed integrally with the die attach pad. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.Type: ApplicationFiled: February 12, 2014Publication date: August 13, 2015Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
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Patent number: 9105825Abstract: A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufacturing costs. Methods of manufacturing light source packages are also disclosed.Type: GrantFiled: June 3, 2013Date of Patent: August 11, 2015Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Norfidathul Aizar Abdul Karim, Chiau Jin Lee, Kheng Leng Tan
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Publication number: 20150211714Abstract: In one embodiment, a light-emitting device having a reflector, an emitter and an encapsulant is disclosed. The encapsulant may have a plurality of optical structures. Each of the plurality of optical structures may be configured to attenuate light transmitting towards a first direction by re-directing towards a second direction. In another embodiment, a flashlight having a roughened area with micro-optics is disclosed. Each of the micro-optics is configured to redirect light transmitting towards a direction forming an angle relative to a longitudinal axis to a point along the longitudinal axis. In yet another embodiment, a lighting-emitting device having roughened area to reduce light along a longitudinal axis is disclosed.Type: ApplicationFiled: January 24, 2014Publication date: July 30, 2015Applicant: Avago Technologies General IP (Singapore) Pte. LtdInventors: Keat Chuan Ng, Chin Ewe Phang, Kheng Leng Tan, Boon Keat Tan, Kum Soon Wong
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Patent number: 9062863Abstract: An illumination device, system, and method are disclosed. The illumination device includes an active cooling mechanism and a controller for the same. When the controller activates or deactivates the active cooling mechanism, one or more optical elements on the illumination device are automatically moved, thereby adjusting at least one characteristic of the light emitted by the illumination device.Type: GrantFiled: December 10, 2012Date of Patent: June 23, 2015Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Keat Chuan Ng, Kheng Leng Tan, Ju Chin Poh
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Patent number: 8928219Abstract: In one embodiment, a light-emitting device having a body, a reflector, a light source die, and a spectral converter is disclosed. The spectral converter may be formed adjacent to, but distanced away from, the light source die. The spectral converter may be configured to spectrally adjust a portion of the light output having a predetermined spectral content. In another embodiment, a system for illumination having a plurality of lighting assemblies is disclosed. Each of the lighting assemblies comprises a spectral converter configured to spectrally adjust a portion of the light output so that the plurality of lighting assemblies are configured to emit substantially similar spectral output. In yet another embodiment, a lighting apparatus having the spectral converter is disclosed.Type: GrantFiled: March 5, 2013Date of Patent: January 6, 2015Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Chuan Hoe Chan, Kwok Yuen Ng, Kum Soon Wong, Kheng Leng Tan, Ju Chin Poh, Keat Chuan Ng
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Patent number: 8915603Abstract: A cooling system utilizing a potential energy that provides cooling with low power consumption is disclosed. The cooling system may comprise a heat dissipating member, a support structure, a movable assembly, and a coil. In one embodiment, the movable assembly may be configured to oscillate above the heat dissipating member by utilizing induction from the coil and the potential energy to generate air flow that provide cooling on the heat dissipating member. In other embodiments, the movable assembly may be configured to oscillate substantially within the recess of the heat dissipating member.Type: GrantFiled: December 5, 2012Date of Patent: December 23, 2014Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Chuan Hoe Chan, Ju Chin Poh, Kheng Leng Tan
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Publication number: 20140353701Abstract: A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufacturing costs. Methods of manufacturing light source packages are also disclosed.Type: ApplicationFiled: June 3, 2013Publication date: December 4, 2014Inventors: Norfidathul Aizar Abdul Karim, Chiau Jin Lee, Kheng Leng Tan
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Patent number: 8876312Abstract: In one embodiment, a light-emitting device having a substrate, a casing, a plurality of light source dies, a plurality of spectral converters and a plurality of optical structures is disclosed. The spectral converters may be configured to spectrally adjust a portion of the light output of the light source die into a first and second converted spectral output that is substantially different from one another. In another embodiment, a system for illumination having a plurality of lighting assemblies has been disclosed. Each of the lighting assemblies comprises a light source die and a spectral converter. The spectral converter is configured to spectrally adjust the light output of the light source die so that the plurality of lighting assemblies are configured to emit substantially different spectral output. In yet another embodiment, a lighting apparatus having a primary spectral converter and a secondary spectral converter is disclosed.Type: GrantFiled: March 5, 2013Date of Patent: November 4, 2014Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Kheng Leng Tan, Ju Chin Poh, Keat Chuan Ng, Chuan Hoe Chan, Kwok Yuen Ng, Kum Soon Wong
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Publication number: 20140254127Abstract: In one embodiment, a light-emitting device having a substrate, a casing, a plurality of light source dies, a plurality of spectral converters and a plurality of optical structures is disclosed. The spectral converters may be configured to spectrally adjust a portion of the light output of the light source die into a first and second converted spectral output that is substantially different from one another. In another embodiment, a system for illumination having a plurality of lighting assemblies has been disclosed. Each of the lighting assemblies comprises a light source die and a spectral converter. The spectral converter is configured to spectrally adjust the light output of the light source die so that the plurality of lighting assemblies are configured to emit substantially different spectral output. In yet another embodiment, a lighting apparatus having a primary spectral converter and a secondary spectral converter is disclosed.Type: ApplicationFiled: March 5, 2013Publication date: September 11, 2014Applicant: Avago Technologies General lP (Singapore) Pte. Ltd.Inventors: Kheng Leng Tan, Ju Chin Poh, Keat Chuan Ng, Chuan Hoe Chan, Kwok Yuen Ng, Kum Soon Wong