Patents by Inventor Kheng Leng Tan
Kheng Leng Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7880381Abstract: A plurality of different frequency absorbing materials are placed between an LED and a surface so as to generate a non-monochromatic colors. In one embodiment, a light device is arranged with light sources, each of which emit light of a different color, and by surrounding the different colored light sources with a color changing media, each of which absorb light of different colors and by allowing the light sources to be individually calibrated as to power level, a variety of colors can be achieved.Type: GrantFiled: July 5, 2006Date of Patent: February 1, 2011Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Kheng Leng Tan, Janet Bee Yin Chua, Wei Liam Loo
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Publication number: 20100320485Abstract: A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.Type: ApplicationFiled: August 30, 2010Publication date: December 23, 2010Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Kheng Leng Tan, Keat Chuan Ng, Kiam Soon Ong
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Publication number: 20100289055Abstract: In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant.Type: ApplicationFiled: May 14, 2009Publication date: November 18, 2010Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Kheng Leng Tan, Keat Chuan Ng, Kee Hon Lee
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Patent number: 7800304Abstract: A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.Type: GrantFiled: January 12, 2007Date of Patent: September 21, 2010Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Kheng Leng Tan, Keat Chuan Ng, Kiam Soon Ong
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Patent number: 7727041Abstract: A light emitting device having a die that includes a light source that generates light of a first wavelength and a layer of phosphor particles covering the die is disclosed. The phosphor particles convert a portion of the light of the first wavelength to light of a second wavelength. The light source can be fabricated by attaching the light source to a substrate, and converting the light source by applying a light converting layer that includes a volatile carrier material and particles of a phosphor that convert light of the first wavelength to light of the second wavelength over the light source. The volatile carrier material is then caused to evaporate leaving a layer of the phosphor particles over the light source. A binder material can be incorporated in the volatile carrier for binding the phosphor particles to one another after the volatile carrier material is evaporated.Type: GrantFiled: November 8, 2007Date of Patent: June 1, 2010Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Kee Yean Ng, Kheng Leng Tan, Wen Ya Ou
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Patent number: 7547583Abstract: A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.Type: GrantFiled: March 7, 2008Date of Patent: June 16, 2009Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Kee Yean Ng, Hui Peng Koay, Chiau Jin Lee, Kheng Leng Tan, Wei Liam Loo, Keat Chuan Ng, Aizar Abdul Karim Norfidathul
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Publication number: 20090129085Abstract: An exemplary embodiment of an optical device may include a lead frame with a plurality of leads and a reflector housing formed around the lead frame. The reflector housing includes a first end face and a second end face and a peripheral sidewall extending between the first end face and the second end face. The reflector housing includes a first pocket with a pocket opening in the first end face and a second pocket with a pocket opening in the second end face. At least one LED die is mounted in the first pocket of the reflector housing, and a light transmitting encapsulant is disposed in the first pocket and encapsulating the at least one LED die.Type: ApplicationFiled: November 16, 2007Publication date: May 21, 2009Applicant: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.Inventors: Abdul Karim Norfidathul Aizar, Chiau Jin Lee, Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
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Patent number: 7524087Abstract: An exemplary embodiment of an optical device may include a lead frame with a plurality of leads and a reflector housing formed around the lead frame. The reflector housing includes a first end face and a second end face and a peripheral sidewall extending between the first end face and the second end face. The reflector housing includes a first pocket with a pocket opening in the first end face and a second pocket with a pocket opening in the second end face. At least one LED die is mounted in the first pocket of the reflector housing, and a light transmitting encapsulant is disposed in the first pocket and encapsulating the at least one LED die.Type: GrantFiled: November 16, 2007Date of Patent: April 28, 2009Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Abdul Karim Norfidathul Aizar, Chiau Jin Lee, Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan
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Publication number: 20090057708Abstract: A light source and method for making the same are disclosed. The light source includes a substrate, a die, and a cup. The substrate has a plurality of electrical traces thereon and the die includes an LED that is connected to two of the traces. The cup overlies the substrate and is filled with an encapsulant material. The die is located within the cup and is encapsulated by the substrate and the encapsulant material. The cup and encapsulant material have substantially the same coefficient of thermal expansion. The cup can include reflective sidewalls positioned to reflect light leaving the die. The cup, encapsulant and substrate can be constructed from the same material.Type: ApplicationFiled: August 27, 2007Publication date: March 5, 2009Inventors: Norfidathul Aizar Abdul Karim, Siew It Pang, Kheng Leng Tan, Tong Fatt Chew
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Patent number: 7481562Abstract: A device and method for providing illuminating light utilizes quantum dots to convert at least some of the original light emitted from a light source of the device to longer wavelength light to change the color characteristics of the illuminating light. The quantum dots may be included in the light source, a light panel and/or an optional interface medium of the device.Type: GrantFiled: November 18, 2004Date of Patent: January 27, 2009Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Janet Bee Yin Chua, Kok Chin Pan, Kee Yean Ng, Kheng Leng Tan, Tajul Arosh Baroky
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Publication number: 20080170391Abstract: A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.Type: ApplicationFiled: January 12, 2007Publication date: July 17, 2008Inventors: Aizar Abdul Karim Norfidathul, Chiau Jin Lee, Kheng Leng Tan, Keat Chuan Ng, Kiam Soon Ong
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Publication number: 20080153190Abstract: A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.Type: ApplicationFiled: March 7, 2008Publication date: June 26, 2008Applicant: Avago Technologies General IP (Singapore) Pte. LtdInventors: Kee Yean Ng, Hui Peng Koay, Chiau Jin Lee, Kheng Leng Tan, Wei Liam Loo, Keat Chuan Ng, Aizar Abdul Karim Norfidathul
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Publication number: 20080144322Abstract: A light source having a rigid substrate, a first LED, and a flexible reflector housing is disclosed. The rigid substrate has a first surface having a plurality of electrical traces formed thereon, the first LED die being disposed on the first surface and connected to two of the electrical traces. The rigid substrate also includes a plurality of external electrical connections for accessing the electrical traces. The reflector housing includes a layer of flexible material having at least one cavity extending through the layer of flexible material. The layer of flexible material is bonded to the first surface such that the cavity overlies the first LED die. The cavity has walls that reflect light generated in the first LED die. The first die can be encapsulated in a layer of silicone encapsulant. The reflector can likewise be constructed from silicone.Type: ApplicationFiled: December 15, 2006Publication date: June 19, 2008Inventors: Aizar Abdul Karim Norfidathul, Siew It Pang, Kheng Leng Tan, Tong Fatt Chew
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Publication number: 20080117619Abstract: A light source, a flexible circuit carrier and a flexible reflector are disclosed. The flexible circuit carrier includes a flexible substrate having a first surface having a plurality of electrical traces formed thereon. A first LED die is disposed on the first surface and connected to two of the electrical traces. A plurality of external electrical connections for accessing the electrical traces are also included in the circuit carrier. The flexible reflector includes a layer of flexible material having at least one cavity extending through the layer of flexible material. The flexible layer is bonded to the first surface such that the cavity overlies the first LED die. The cavity has walls that reflect light generated in the first LED die. The flexible material and the flexible substrate can include silicone.Type: ApplicationFiled: November 21, 2006Publication date: May 22, 2008Inventors: Siew It Pang, Aizar Abdul Karim Norfidathul, Kheng Leng Tan, Tong Fatt Chew
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Patent number: 7365407Abstract: A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has first and second sections, the first section including a lateral portion, a chip mounting area and a first extension. The integrated circuit chip is mounted in the chip mounting area and is in thermal contact with the chip mounting area. The encapsulating layer has top, bottom, and first and second side surfaces. The first extension is bent to provide a first heat path from the chip mounting area to the bottom surface. The heat path connects the heat chip mounting area to the bottom surface without passing through the first and second side surfaces and provides a heat path that has less thermal resistance than the heat path through either the lateral portion or the second section.Type: GrantFiled: May 1, 2006Date of Patent: April 29, 2008Assignee: Avago Technologies General IP Pte LtdInventors: Kee Yean Ng, Hui Peng Koay, Chiau Jin Lee, Kheng Leng Tan, Wei Liam Loo, Keat Chuan Ng, Alzar Abdul Karim Norfidathul
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Publication number: 20080007172Abstract: A plurality of different frequency absorbing materials are placed between an LED and a surface so as to generate a non-monochromatic colors. In one embodiment, a light device is arranged with light sources, each of which emit light of a different color, and by surrounding the different colored light sources with a color changing media, each of which absorb light of different colors and by allowing the light sources to be individually calibrated as to power level, a variety of colors can be achieved.Type: ApplicationFiled: July 5, 2006Publication date: January 10, 2008Inventors: Kheng Leng Tan, Janet Bee Yin Chua, Wei Liam Loo
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Patent number: 7315119Abstract: A light emitting device having a die that includes a light source that generates light of a first wavelength and a layer of phosphor particles covering the die is disclosed. The phosphor particles convert a portion of the light of the first wavelength to light of a second wavelength. The light source can be fabricated by attaching the light source to a substrate, and converting the light source by applying a light converting layer that includes a volatile carrier material and particles of a phosphor that convert light of the first wavelength to light of the second wavelength over the light source. The volatile carrier material is then caused to evaporate leaving a layer of the phosphor particles over the light source. A binder material can be incorporated in the volatile carrier for binding the phosphor particles to one another after the volatile carrier material is evaporated.Type: GrantFiled: May 7, 2004Date of Patent: January 1, 2008Inventors: Kee Yean Ng, Kheng Leng Tan, Wen Ya Ou
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Publication number: 20070295968Abstract: An encapsulant containing nanoparticles that improve the heat and UV resistance properties of electroluminescent devices. The nanoparticles that are suspended in the encapsulant may be either oxides or non-oxides and may include SiO2, TiO2, Al2O3, ZrO2, Ti, TiB2, TiC, and TiN. The nanoparticles may range in size from 5 to 165 nm in diameter. The encapsulant containing nanoparticles may be used in an electroluminescent device by being deposited in a concave base cavity to cover a light source, such as a light-emitting diode (“LED”), positioned in the concave base cavity, and may also be applied in the form of a conformal coating that covers the light source. An electroluminescent device utilizing the encapsulant containing nanoparticles and a method of producing such a device is also provided.Type: ApplicationFiled: June 27, 2006Publication date: December 27, 2007Inventors: Kheng Leng Tan, Janet Bee Yin Chua, Kee Yean Ng
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Patent number: 7265488Abstract: A light emitting device in which a primary light generator, such as a light emitting diode (LED) or laser diode, is operable to emit a primary light that is received by a body of wavelength converting material. A portion of the primary light is absorbed by the body of wavelength converting material and is emitted as secondary light. The wavelength converting material contains phosphor nano-particles and larger phosphor particles. The phosphor nano-particles prevent transmission of primary light while the larger phosphor particles provide efficient light conversion.Type: GrantFiled: September 30, 2004Date of Patent: September 4, 2007Assignee: Avago Technologies General IP Pte. LtdInventors: Kee Yean Ng, Kheng Leng Tan, Tajul Arosh Baroky, Janet Bee Yin Chua, Kok Chin Pan
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Patent number: D576966Type: GrantFiled: June 26, 2006Date of Patent: September 16, 2008Assignee: Avago Technologies General IP (Singapore) Pte Ltd.Inventors: Keat Chuan Ng, Chiau Jin Lee, Kheng Leng Tan, Wei Liam Loo