Patents by Inventor Ki-Chan Eun

Ki-Chan Eun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11494478
    Abstract: Provided are USB connector-free device and method, the device comprising: a host computer 10; a mobile device 20; and an ultra-high-speed module 30, wherein the host computer 10 comprises a USB module, the mobile device (20) comprises: a mobile device USB module (21) connected to the USB module of the host computer (10); mobile device hardware (22) matching with a hardware layer of the mobile device USB module (21); and a mobile device RF module (23) wirelessly matching with the mobile device hardware (22), and the ultra-high-speed module (30) comprises: an ultra-high-speed RF module (31) wirelessly communicating with the mobile device RF module (23); ultra-high-speed module hardware (32) matching with the ultra-high-speed RF module (31) by hardware; and a memory module (33) performing wire-communication with the ultra-high-speed module hardware (32).
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: November 8, 2022
    Assignee: GLS CO., LTD.
    Inventors: Ki-Chan Eun, Ki-Dong Song
  • Publication number: 20200311243
    Abstract: Provided are USB connector-free device and method, the device comprising: a host computer 10; a mobile device 20; and an ultra-high-speed module 30, wherein the host computer 10 comprises a USB module, the mobile device (20) comprises: a mobile device USB module (21) connected to the USB module of the host computer (10); mobile device hardware (22) matching with a hardware layer of the mobile device USB module (21); and a mobile device RF module (23) wirelessly matching with the mobile device hardware (22), and the ultra-high-speed module (30) comprises: an ultra-high-speed RF module (31) wirelessly communicating with the mobile device RF module (23); ultra-high-speed module hardware (32) matching with the ultra-high-speed RF module (31) by hardware; and a memory module (33) performing wire-communication with the ultra-high-speed module hardware (32).
    Type: Application
    Filed: November 3, 2017
    Publication date: October 1, 2020
    Applicant: GLS CO., LTD.
    Inventors: Ki-Chan EUN, Ki-Dong SONG
  • Patent number: 8577308
    Abstract: Disclosed are a beamformer and a beamforming method. The beamformer includes a plurality of dividers, each of which divides an input signal along a plurality of paths, an input switch which selects one of the dividers such that the input signal is input to the selected divider, a phase shifter which shifts phases of respective output signals from the divider, and an output switch which transmits the output signals from the phase shifter to an antenna.
    Type: Grant
    Filed: November 11, 2008
    Date of Patent: November 5, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Tae Choi, Jung-Han Choi, Young-Hwan Kim, Dong-Hyun Lee, Hong-Yi Kim, Ki-Chan Eun, Chul-Soon Park
  • Patent number: 7911292
    Abstract: Provided is a mode transition circuit for transferring a RF signal and a transceiver module having the same. The mode transition circuit includes: a planar transmission line mounted at a RF substrate for receiving a RF signal from a RF signal generating unit; a via formed inside the RF substrate and connected to one side of the planar transmission line for receiving the RF signal from the planar transmission line; at least one of metal patches formed inside the RF substrate and connected to the one side of the via for receiving the RF signal from the via; and a hole formed inside a low frequency substrate and connected to one side of the metal patch for receiving the RF signal from the metal patch.
    Type: Grant
    Filed: November 24, 2006
    Date of Patent: March 22, 2011
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Woo-Jin Byun, Kwang-Seon Kim, Bong-Su Kim, Ki-Chan Eun, Myung-Sun Song
  • Patent number: 7907031
    Abstract: A transit structure of a standard waveguide and a dielectric waveguide is related to connecting the dielectric dielectric waveguide to the standard waveguide. The transit structure includes: a cavity to match the dielectric waveguide and the standard waveguide, wherein the dielectric waveguide and the standard waveguide are orthogonal to each other to connect. The transit structure drastically reduces a design time by simply implementing a transit structure by using only a dielectric waveguide, a cavity and a standard waveguide on a dielectric substrate and remarkably reduces a size thereof in comparison with a conventional transit structure since all designs are finished in the size of a metal waveguide.
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: March 15, 2011
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Bong-Su Kim, Kwang-Seon Kim, Woo-Jin Byun, Ki-Chan Eun, Myung-Sun Song
  • Publication number: 20090270051
    Abstract: Disclosed are a beamformer and a beamforming method. The beamformer includes a plurality of dividers, each of which divides an input signal along a plurality of paths, an input switch which selects one of the dividers such that the input signal is input to the selected divider, a phase shifter which shifts phases of respective output signals from the divider, and an output switch which transmits the output signals from the phase shifter to an antenna.
    Type: Application
    Filed: November 11, 2008
    Publication date: October 29, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung-tae Choi, Jung-han Choi, Young-hwan Kim, Dong-hyun Lee, Hong-yi Kim, Ki-chan Eun, Chul-soon Park
  • Publication number: 20080309427
    Abstract: A transit structure of a standard waveguide and a dielectric waveguide is related to connecting the dielectric dielectric waveguide to the standard waveguide. The transit structure includes: a cavity to match the dielectric waveguide and the standard waveguide, wherein the dielectric waveguide and the standard waveguide are orthogonal to each other to connect. The transit structure drastically reduces a design time by simply implementing a transit structure by using only a dielectric waveguide, a cavity and a standard waveguide on a dielectric substrate and remarkably reduces a size thereof in comparison with a conventional transit structure since all designs are finished in the size of a metal waveguide.
    Type: Application
    Filed: August 31, 2006
    Publication date: December 18, 2008
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Bong-Su Kim, Kwang-Seon Kim, Woo-Jin Byun, Ki-Chan Eun, Myung-Sun Song
  • Publication number: 20080297283
    Abstract: Provided is a mode transition circuit for transferring a RF signal and a transceiver module having the same. The mode transition circuit includes: a planar transmission line mounted at a RF substrate for receiving a RF signal from a RF signal generating unit; a via formed inside the RF substrate and connected to one side of the planar transmission line for receiving the RF signal from the planar transmission line; at least one of metal patches formed inside the RF substrate and connected to the one side of the via for receiving the RF signal from the via; and a hole formed inside a low frequency substrate and connected to one side of the metal patch for receiving the RF signal from the metal patch.
    Type: Application
    Filed: November 24, 2006
    Publication date: December 4, 2008
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Woo-Jin Byun, Kwang-Seon Kim, Bong-Su Kim, Ki-Chan Eun, Myung-Sun Song
  • Patent number: 7352260
    Abstract: Provided is a microwave and millimeter wave transceiver package technology that can unify the transceiver composed of an amplifier, a filter and a mixer into a low temperature co-fired ceramic (LTCC) module package by using an LTCC method utilizing a multilayer dielectric substrate, thereby achieving miniaturization, a loss reduction and moderate price. The transceiver includes a plurality of cavities arrayed in a multilayer substrate, an amplifier and a mixer mounted in the cavities and a filter provided with a strip line between the amplifier and the mixer.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: April 1, 2008
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Bong-Su Kim, Kwang-Seon Kim, Ki-Chan Eun, Myung-Sun Song
  • Publication number: 20060125575
    Abstract: Provided is a microwave and millimeter wave transceiver package technology that can unify the transceiver composed of an amplifier, a filter and a mixer into a low temperature co-fired ceramic (LTCC) module package by using an LTCC method utilizing a multilayer dielectric substrate, thereby achieving miniaturization, a loss reduction and moderate price. The transceiver includes a plurality of cavities arrayed in a multilayer substrate, an amplifier and a mixer mounted in the cavities and a filter provided with a strip line between the amplifier and the mixer.
    Type: Application
    Filed: June 28, 2005
    Publication date: June 15, 2006
    Inventors: Bong-Su Kim, Kwang-Seon Kim, Ki-Chan Eun, Myung-Sun Song