Patents by Inventor Ki-Chan Eun

Ki-Chan Eun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transceiver using low temperature co-fired ceramic method
    Patent number: 7352260
    Abstract: Provided is a microwave and millimeter wave transceiver package technology that can unify the transceiver composed of an amplifier, a filter and a mixer into a low temperature co-fired ceramic (LTCC) module package by using an LTCC method utilizing a multilayer dielectric substrate, thereby achieving miniaturization, a loss reduction and moderate price. The transceiver includes a plurality of cavities arrayed in a multilayer substrate, an amplifier and a mixer mounted in the cavities and a filter provided with a strip line between the amplifier and the mixer.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: April 1, 2008
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Bong-Su Kim, Kwang-Seon Kim, Ki-Chan Eun, Myung-Sun Song
  • Transceiver using low temperature co-fired ceramic method
    Publication number: 20060125575
    Abstract: Provided is a microwave and millimeter wave transceiver package technology that can unify the transceiver composed of an amplifier, a filter and a mixer into a low temperature co-fired ceramic (LTCC) module package by using an LTCC method utilizing a multilayer dielectric substrate, thereby achieving miniaturization, a loss reduction and moderate price. The transceiver includes a plurality of cavities arrayed in a multilayer substrate, an amplifier and a mixer mounted in the cavities and a filter provided with a strip line between the amplifier and the mixer.
    Type: Application
    Filed: June 28, 2005
    Publication date: June 15, 2006
    Inventors: Bong-Su Kim, Kwang-Seon Kim, Ki-Chan Eun, Myung-Sun Song
  • Three dimensional multilayer RF module having air cavities and method fabricating same
    Publication number: 20040028888
    Abstract: In a multilayer RF module, a plurality of vertically stacked ceramic layers include a first to a third ceramic layers. Each of the first and the third ceramic layers has a circuit component thereon and the second ceramic layer is located between the first and the third ceramic layers and is provided with at least one or more air cavities filled with air, the air cavities being vertically aligned with the circuit components of the first and the third ceramic layers.
    Type: Application
    Filed: July 31, 2003
    Publication date: February 12, 2004
    Applicant: Information and Communications University Educational Foundation
    Inventors: Young Chul Lee, Chul Soon Park, Byoung Gun Choi, Ki Chan Eun, Dae Jun Kim