Abstract: The present invention relates to an ester-based plasticizer composition and use thereof, wherein the composition can provide a synergistic effect in the improvement of thermal stability, such as migration resistance and heating loss, to contribute to the enhancement of properties of a molded product, and can provide a molded product with excellent thermal stability as well as mechanical properties due to excellent compatibility and processability with a polyvinyl chloride.

Abstract: An ester-based plasticizer composition and uses of the ester-based plasticizer composition are disclosed. Since the synergistic effect is provided to the improvement of thermal stability such as migration resistance and loss-on-heating to contribute to the improvement of the physical properties of a molded product, and compatibility with polyvinyl chloride resin and processability are excellent, the ester-based plasticizer composition can be used to provide molded products with excellent mechanical properties as well as thermal stability.

Abstract: Provided are a novel ester-based compound and a use thereof. A use of a novel ester-based compound for improving heat resistance and compatibility as a plasticizer is provided. When the ester-based compound according to the present invention is used as the plasticizer of a heat-resistant resin composition, a synergistic effect on improvement of physical properties such as migration resistance and heating loss is provided to contribute to improvement of the physical properties of a molded article, and due to a rapid absorption rate and a short melting time, processability of the heat-resistant resin composition may be improved.

Abstract: Provided are a novel ester-based compound and a use thereof. A use of a novel ester-based compound for improving heat resistance and compatibility as a plasticizer is provided. When the ester-based compound according to the present invention is used as the plasticizer of a heat-resistant resin composition, a synergistic effect on improvement of physical properties such as migration resistance and heating loss is provided to contribute to improvement of the physical properties of a molded article, and due to a rapid absorption rate and a short melting time, processability of the heat-resistant resin composition may be improved.

Abstract: A semiconductor device package includes a semiconductor device mounted to a substrate, a wall erected around the semiconductor device with a height taller than the height of the semiconductor device, at least one metal member provided in the wall or against the wall; and a lid secured to the metal member. The metal member and the lid enclose substantially the semiconductor device for providing electromagnetic interference shielding.

Abstract: A semiconductor device package includes a semiconductor device mounted to a substrate, a wall erected around the semiconductor device with a height taller than the height of the semiconductor device, at least one metal member provided in the wall or against the wall; and a lid secured to the metal member. The metal member and the lid enclose substantially the semiconductor device for providing electromagnetic interference shielding.

Abstract: A semiconductor device package includes a semiconductor device mounted and electrically coupled to the upper surface of a substrate, a package body encapsulating the semiconductor device against a portion of the upper surface of the substrate; and a metal ring formed on the upper surface of the substrate and connected to ground potential. The metal ring loops around the semiconductor device for providing electromagnetic interference shielding.

Abstract: A semiconductor device package includes a semiconductor device mounted to a substrate, a wall erected around the semiconductor device with a height taller than the height of the semiconductor device, at least one metal member provided in the wall or against the wall; and a lid secured to the metal member. The metal member and the lid enclose substantially the semiconductor device for providing electromagnetic interference shielding.