Abstract: A dry etching method includes a first step of adsorbing first radicals into a surface of an etching target, wherein the first radicals are contained in first plasma generated from a plasma generator; and a second step of irradiating ion-beams extracted from second plasma generated from the plasma generator onto the surface of the etching target into which the radicals have been adsorbed, thereby desorbing a surface atomic layer of the etching target, wherein the first step is performed such that: a positive potential greater than a potential of the first plasma is applied to one or two selected from first to third grids, while a ground potential is applied to the rest thereof; and a negative potential equal to or lower than a potential of the third grid is applied to a substrate support structure.

Abstract: An event processing method performed by a computing device is provided. The method may comprise receiving a plurality of events and generating a first event sequence in which the received events are sequentially arranged, determining first priorities for the events included in the first event sequence, using data output from a previously trained priority decision model, verifying the first priorities by comparing the first priorities with second priorities for the events included in the first event sequence, determining a feedback score for the first priorities based on results of the verification; and reinforcing the training of the priority decision model using the feedback score.

Abstract: The method for automatically generating a playbook performed by a computing apparatus according to the present disclosure comprises periodically collecting asset information and CTI (Cyber Threat Intelligence) information of a target network, extracting TTP (Tactics, Techniques, Procedure) information using the collected asset information and the collected CTI information, retrieving a data source of the extracted TTP information, generating a temporary playbook including a data component matching a detection method of the extracted TTP information among a plurality of data components of the retrieved data source, verifying validity of the temporary playbook based on data component order information of the temporary playbook and determining whether rearrangement of data components included in the temporary playbook is needed, and rearranging data components included in the temporary playbook, and storing it as a final playbook.

Abstract: A converter comprises: a housing comprising an internal space; a printed circuit board disposed inside the internal space; a first electronic component disposed on the upper surface of the printed circuit board; a second electronic component disposed on the lower surface of the printed circuit board; and a heat dissipation space disposed inside the housing, wherein the first electronic component is disposed so as to overlap the heat dissipation space in a first direction, and the second electronic component is disposed so as to overlap the heat dissipation space in a second direction perpendicular to the first direction.

Abstract: A gate driving device includes a power supply circuit configured to boost a power source voltage and to output a first driving power voltage and a second driving power voltage, and a gate driver configured to drive a top control signal for switching a top switch element of an inverter by receiving the first driving power voltage from the power supply circuit, to drive a bottom control signal for switching a bottom switch element of the inverter by receiving the second driving power voltage from the power supply circuit, and to output a charging control signal for switching a charging switch element connected to a neutral terminal of a motor and one end of the bottom switch element by receiving the second driving power voltage.

Abstract: Disclosed herein is a technique for synthesizing chiral magnetic nanocoils using an electrodeposition technique, which can be used to fabricate magnetic nanosensors capable of generating an electric field by strongly reacting to an external magnetic field, such as Faraday's law of electromagnetic induction at the nanoscale, depending on the coil shape of the nanostructure. In accordance with one embodiment, a method of synthesizing a chiral magnetic nanocoil may include generating a primary particle composed of metal ions by applying an external electric field, binding a chiral molecule to a surface of the generated primary particle, and controlling an assembly direction of a next primary particle by the bound chiral molecule.

Abstract: A display device includes a substrate including a display area and a non-display area adjacent to the display area. The non-display area includes a blocking region. An organic layer is disposed on the substrate. An emission layer is disposed in the display area of the substrate. An auxiliary pattern is disposed in the blocking region of the non-display area of the substrate. A thin film encapsulation layer is disposed on the substrate and overlaps the emission layer and the blocking region. The organic layer has a groove penetrating an entire thickness of the organic layer in the blocking region. The auxiliary pattern overlaps the groove. The auxiliary pattern includes a same material as a gate electrode disposed in the display area of the substrate.

Abstract: A display device is provided. The display device includes: an input sensing member electrically connected to a first bonding pad unit having a first pad; a pressure sensing member electrically connected to a second bonding pad having a second pad; and a display panel disposed between the input sensing member and the pressure sensing member, wherein the first pad is electrically connected to the second pad, a first offset distance between the first and second pads is greater than zero, and the first offset distance is defined as a spacing distance, on a plane, between a side of the first pad and a side of the second pad when the first and second pads are yet to be electrically connected.

Abstract: A display device is provided. The display device includes: an input sensing member electrically connected to a first bonding pad unit having a first pad; a pressure sensing member electrically connected to a second bonding pad having a second pad; and a display panel disposed between the input sensing member and the pressure sensing member, wherein the first pad is electrically connected to the second pad, a first offset distance between the first and second pads is greater than zero, and the first offset distance is defined as a spacing distance, on a plane, between a side of the first pad and a side of the second pad when the first and second pads are yet to be electrically connected.

Abstract: A deposition apparatus is provided to eliminate unnecessary empty spaces that may form between a substrate and a substrate supporting pin, which may be formed within a substrate supporting pin hole, by covering the substrate supporting pin, inserted into the substrate supporting pin hole formed in the substrate support, by a substrate supporting pin cover loaded on the substrate support. Accordingly, the temperature under the substrate can be maintained constant, and generation of parasitic plasma or contaminating particles can be avoided.

Abstract: A deposition apparatus according to an exemplary embodiment of the present invention includes a plurality of reaction spaces, a plurality of plasma electrodes respectively disposed in the reaction spaces, a first plasma processor connected to at least two plasma electrodes, and a first plasma power source connected to the first plasma processor. The first plasma processor may include a plasma distributor or a plasma splitter.

Abstract: A deposition apparatus according to an exemplary embodiment of the present invention includes a plurality of reaction spaces, a plurality of plasma electrodes respectively disposed in the reaction spaces, a first plasma processor connected to at least two plasma electrodes, and a first plasma power source connected to the first plasma processor. The first plasma processor may include a plasma distributor or a plasma splitter.

Abstract: A deposition apparatus according to an exemplary embodiment of the present invention includes a plurality of reaction spaces, a plurality of plasma electrodes respectively disposed in the reaction spaces, a first plasma processor connected to at least two plasma electrodes, and a first plasma power source connected to the first plasma processor. The first plasma processor may include a plasma distributor or a plasma splitter.

Abstract: A deposition apparatus and a method of depositing a thin film using the same are provided. By maintaining pressure of an external chamber between a reaction space and an outer wall slightly lower than pressure of the reaction space by supplying a charge gas to an external chamber of a space between the reaction space and an outer wall, parasitic plasma can be prevented from being generated within the external chamber. When loading or unloading a substrate, a charge gas of the external chamber can be prevented from flowing backward to the reaction space, and by supplying nitrogen gas as a charge gas, even if high plasma power is supplied, parasitic plasma can be effectively prevented from being generated in the external chamber.

Abstract: A deposition apparatus is provided to eliminate unnecessary empty spaces that may form between a substrate and a substrate supporting pin, which may be formed within a substrate supporting pin hole, by covering the substrate supporting pin, inserted into the substrate supporting pin hole formed in the substrate support, by a substrate supporting pin cover loaded on the substrate support. Accordingly, the temperature under the substrate can be maintained constant, and generation of parasitic plasma or contaminating particles can be avoided.

Abstract: A deposition apparatus according to an exemplary embodiment of the present invention is a lateral-flow deposition apparatus in which in which a process gas flows between a surface where a substrate is disposed and the opposite surface, substantially in parallel with the substrate. The lateral-flow deposition apparatus includes: a substrate support that moves up/down and rotates the substrate while supporting the substrate; a reactor cover that defines a reaction chamber by contacting the substrate support; and a substrate support lifter and a substrate support rotator that move the substrate support.

Abstract: In a deposition apparatus, as a plurality of plasma connection terminals that transfer plasma power to a plasma electrode are coupled in parallel to the plasma electrode, resistance caused by the plurality of plasma connection terminals is reduced and a current is distributed such that heat generated in the plurality of plasma connection terminals can be distributed. Therefore, even if high RF power is used, by preventing the plurality of plasma connection terminals from being oxidized, plasma is stably supplied and thus, stability of a deposition apparatus and the accuracy of a process can be enhanced.

Abstract: A deposition apparatus and a method of depositing a thin film using the same are provided. By maintaining pressure of an external chamber between a reaction space and an outer wall slightly lower than pressure of the reaction space by supplying a charge gas to an external chamber of a space between the reaction space and an outer wall, parasitic plasma can be prevented from being generated within the external chamber. When loading or unloading a substrate, a charge gas of the external chamber can be prevented from flowing backward to the reaction space, and by supplying nitrogen gas as a charge gas, even if high plasma power is supplied, parasitic plasma can be effectively prevented from being generated in the external chamber.

Abstract: A thin film deposition apparatus including a substrate mounting error detector, a chamber and a substrate support positioned in the chamber. The substrate support is configured to support a substrate. The substrate mounting error detector includes: a light source configured to provide a light beam to the substrate, such that the substrate reflects the light beam; a collimator configured to selectively pass at least a portion of the light beam reflected by the substrate; and an optical sensor configured to detect the at least a portion of the reflected light beam passed by the collimator. The detector is positioned and oriented to detect substrate position on a lowered support prior to raising the support into contact with an upper cover of a clamshell reactor arrangement. This configuration allows a thin film deposition process only if the substrate is correctly mounted on the substrate support. Thus, abnormal deposition due to a substrate mounting error is prevented in advance.