Abstract: A printed circuit board includes a core layer having a first through-portion, a coil structure disposed in the first through-portion and comprising a support member, a first coil pattern in a planar spiral form disposed on one surface of the support member, and a body comprising a magnetic substance, wherein the support member and the first coil pattern are accommodated in the body, a first build-up layer covering at least a portion the core layer and disposed in at least a portion of the first through-portion, a first wiring layer disposed on one surface of the first build-up layer, and a first via layer passing through at least a portion of the first build-up layer and connected to the first wiring layer. The first via layer comprises a first wiring via connecting at least a portion of the first wiring layer to the first coil pattern.

Abstract: A printed circuit board includes a core layer having a through portion, a magnetic member disposed in the through portion and comprising a magnetic layer, a first coil pattern attached to one surface of the magnetic layer via an adhesive, and a first build-up layer covering at least a portion of the core layer, at least a portion of the magnetic member, and at least a portion of the first coil pattern, and disposed in at least a portion of the through portion.

Abstract: A printed circuit board includes a first core layer having a first coil pattern disposed on one surface of the first core layer, a second core layer disposed on the one surface of the first core layer and having a first recess, a first magnetic member disposed in the first recess and including a first magnetic layer, a first insulating layer disposed between the first and second core layers, and a second insulating layer disposed on the second core layer, covering at least a portion of the first magnetic member, and disposed in at least a portion of the first recess.

Abstract: A printed circuit board includes a first core layer having a first coil pattern disposed on one surface of the first core layer, a second core layer disposed on the one surface of the first core layer and having a first recess, a first magnetic member disposed in the first recess and including a first magnetic layer, a first insulating layer disposed between the first and second core layers, and a second insulating layer disposed on the second core layer, covering at least a portion of the first magnetic member, and disposed in at least a portion of the first recess.

Abstract: A printed circuit board includes a core layer having a first through-portion, a coil structure disposed in the first through-portion and comprising a support member, a first coil pattern in a planar spiral form disposed on one surface of the support member, and a body comprising a magnetic substance, wherein the support member and the first coil pattern are accommodated in the body, a first build-up layer covering at least a portion the core layer and disposed in at least a portion of the first through-portion, a first wiring layer disposed on one surface of the first build-up layer, and a first via layer passing through at least a portion of the first build-up layer and connected to the first wiring layer. The first via layer comprises a first wiring via connecting at least a portion of the first wiring layer to the first coil pattern.

Abstract: A printed circuit board includes a core layer having a through portion, a magnetic member disposed in the through portion and comprising a magnetic layer, a first coil pattern attached to one surface of the magnetic layer via an adhesive, and a first build-up layer covering at least a portion of the core layer, at least a portion of the magnetic member, and at least a portion of the first coil pattern, and disposed in at least a portion of the through portion.

Abstract: A fan-out semiconductor package may include a support member having a through-hole, a semiconductor chip disposed in the through-hole, a component embedded structure disposed adjacent to and spaced apart from the semiconductor chip in the through-hole by a predetermined distance, an encapsulant, and a connection member. The semiconductor chip has an active surface having connection pads disposed thereon and an inactive surface opposing the active surface. The component embedded structure has a plurality of passive components embedded therein. The encapsulant encapsulates at least portions of the support member, the component embedded structure, and the semiconductor chip. The connection member is disposed on the support member, the component embedded structure, and the active surface of the semiconductor chip. The connection member includes redistribution layers and vias electrically connecting the redistribution layers to the plurality of passive components and the connection pads of the semiconductor chip.

Abstract: There is provided a fan-out semiconductor device in which a first package having a semiconductor chip disposed therein and having a fan-out form and a second package having a passive component disposed therein and having a fan-out form are stacked in a vertical direction so that the semiconductor chip and the passive component are electrically connected to each other by a path as short as possible.

Abstract: A fan-out semiconductor package may include a support member having a through-hole, a semiconductor chip disposed in the through-hole, a component embedded structure disposed adjacent to and spaced apart from the semiconductor chip in the through-hole by a predetermined distance, an encapsulant, and a connection member. The semiconductor chip has an active surface having connection pads disposed thereon and an inactive surface opposing the active surface. The component embedded structure has a plurality of passive components embedded therein. The encapsulant encapsulates at least portions of the support member, the component embedded structure, and the semiconductor chip. The connection member is disposed on the support member, the component embedded structure, and the active surface of the semiconductor chip. The connection member includes redistribution layers and vias electrically connecting the redistribution layers to the plurality of passive components and the connection pads of the semiconductor chip.

Abstract: There is provided a fan-out semiconductor device in which a first package having a semiconductor chip disposed therein and having a fan-out form and a second package having a passive component disposed therein and having a fan-out form are stacked in a vertical direction so that the semiconductor chip and the passive component are electrically connected to each other by a path as short as possible.

Abstract: Disclosed is a circuit board having a contact pad for connection with an external device, which protrudes from an upper surface of an outermost insulating layer. A device can be mounted on the circuit board, and a connection terminal of the device can be connected to the contact pad of the circuit board by a wire etc.

Abstract: A circuit board includes an insulating material; and a heat-transfer structure comprising a plurality of heat-dissipating members and inserted in the insulating material, wherein the plurality of heat-dissipating members each includes a metal wire; and an insulating part disposed on an outer circumferential surface of the metal wire excluding a top surface and a bottom surface of the metal wire.

Abstract: A circuit board includes an insulating material; and a heat-transfer structure comprising a plurality of heat-dissipating members and inserted in the insulating material, wherein the plurality of heat-dissipating members each includes a metal wire; and an insulating part disposed on an outer circumferential surface of the metal wire excluding a top surface and a bottom surface of the metal wire.

Abstract: The present invention provides a printed circuit board includes an insulating member, a first plating layer buried in a bottom region of the insulating member, a second plating layer buried in a top region of the insulating member and a plating via for electrically connecting the first plating layer and the second plating layer by being buried in any one among the top region and the bottom region of the insulating member.

Abstract: There are provided a printed circuit board including: an insulation layer; circuit patterns buried in the insulation layer; and a bump pad having a lower part buried in the insulation layer and an upper part protruding upwardly from the insulation layer, and a method of manufacturing the printed circuit board.

Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes a metal core; a through via penetrating through the metal core; and an insulating film formed between the metal core and the through via.

Abstract: A package structure and a method of manufacturing the package structure are disclosed. The package structure in accordance with an aspect of the present invention includes: a stiffener substrate; a dielectric layer and a circuit pattern layer laminated on the stiffener substrate; a protective layer laminated on the dielectric layer so as to protect the circuit pattern layer; a first electrode post protruded by penetrating the protective layer from the circuit pattern layer; and a chip receiving portion formed on a surface of the protective layer that is in a protruded direction of the first electrode post.

Abstract: Disclosed herein is a circuit board in which a metal plate is provided on a surface coupled to a device, and a connection pad is exposed through an opening part of the metal plate to be electrically connected to the device. The circuit board may have the device mounted thereon and a connection terminal of the device and a connection pad of the circuit board may be connected to each other by a wire, or the like.

Abstract: There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, a package board includes: a first insulating layer; a second insulating layer formed beneath the first insulating layer; a capacitor embedded in the first insulating layer and including a first electrode, a second electrode, and a dielectric layer formed between the first electrode and the second electrode; circuit layers formed on the first insulating layer and the second insulating layer; and a via formed between the capacitor and the circuit layers or between the circuit layers formed on the first insulating layer and the second insulating layer to electrically connect thererbetween, wherein an upper surface of the first electrode is formed to be exposed from the first insulating layer.

Abstract: Disclosed is a circuit board having a contact pad for connection with an external device, which protrudes from an upper surface of an outermost insulating layer. A device can be mounted on the circuit board, and a connection terminal of the device can be connected to the contact pad of the circuit board by a wire etc.