Abstract: There are provided a package board, a method of manufacturing the same, and a semiconductor package using the same. According to an exemplary embodiment of the present disclosure, the package substrate may include: an insulating layer; a circuit layer formed on and beneath the insulating layer; a capacitor formed in the insulating layer and including an upper electrode, a lower electrode, and a dielectric layer formed between the upper electrode and the lower electrode; and a via connecting the circuit layer to the upper electrode and the lower electrode.

Abstract: Disclosed herein are a printed circuit board and a manufacturing method thereof capable of improving poor inter-layer conduction by increasing inter-layer insulating property and rigidity. The manufacturing method of a printed circuit board includes: laminating a copper foil layer on upper and lower surfaces of an insulating layer; coating an insulating material on a surface of the copper foil layer; forming a circuit layer by etching the copper foil layer; laminating an insulator on the copper foil layer so as to enclose the insulating material and the circuit layer; forming a via in the insulator so as to be communicated with the circuit layer; and forming a circuit pattern on the insulator.