Abstract: A semiconductor package comprises a substrate having a first opening formed therethrough, a first semiconductor chip stacked on the substrate in a flip chip manner and having a second opening formed therethrough, a second semiconductor chip stacked on the first semiconductor chip in a flip chip manner and having a third opening formed therethrough, and a molding material covering the first semiconductor chip and the second semiconductor chip and filling up a space between the substrate and the first semiconductor chip, a space between the first semiconductor chip and the second semiconductor chip, and filling each of the first opening, the second opening, and the third opening.

Abstract: A liquid crystal display (LCD) device comprises an image signal processing unit that selectively compensates a current frame upon determining that it is part of a sequence of changing images as opposed to a sequence of still images. The image signal processing device comprises an encoding/decoding unit that generates comparison frame decoding data by encoding and decoding comparison frame data, generates reference frame decoding data by encoding and decoding reference frame data, and a determining unit that sets a comparison range based on effective bits in the comparison frame decoding data and effective bits in the reference frame decoding data, and compares the comparison frame decoding data and the reference frame decoding data within the comparison range.

Abstract: Provided are a light emitting device package, a method of manufacturing the light emitting device package, and a lighting system. The light emitting device package includes a package body, an electrode layer, a reflective layer, a nanopattern metal layer, a light emitting device, and a molding part. The electrode layer is disposed on the package body. The reflective layer is disposed over the electrode layer. The nanopattern metal layer is disposed over the reflective layer. The light emitting device is displayed over the electrode layer. The molding part is disposed over the light emitting device.

Abstract: Disclosed is a light emitting device package including a body including a recess, first and second electrodes disposed on the body, a light emitting device provided on the first electrode, and a molding part disposed on the light emitting device. At least one of the body and the molding part includes benzotriazol (BTA).

Abstract: An organic light-emitting diode including a substrate; a first electrode on the substrate; a second electrode facing the first electrode; and an emission layer between the first electrode and the second electrode, the emission layer including an anthracene-based compound represented by Formula 1, below, and a condensed ring compound represented by Formula 20, below:

Abstract: An organic light-emitting diode, comprising a substrate; a first electrode on the substrate; a second electrode disposed opposite to the first electrode; and an emission layer between the first electrode and the second electrode, the emission layer including an anthracene-based compound represented by Formula 1, below, and a condensed cyclic compound represented by Formula 20, below:

Abstract: An organic light-emitting diode including a substrate; a first electrode on the substrate; a second electrode disposed opposite to the first electrode; and an emission layer between the first electrode and the second electrode, the emission layer including an anthracene-based compound represented by Formula 1, below, and a condensed cyclic compound represented by Formula 20, below:

Abstract: An apparatus includes a terminal, a first plurality of driver lines, and a first phase mixer. The driver lines drive the terminal to a first logic state responsive to a first enable signal. The first phase mixer is coupled to a first one of the first plurality of driver lines. The first phase mixer is operable to receive the first enable signal and a first delayed enable signal derived from the first enable signal and generate a first signal on the first driver line having a first configurable delay with respect to the first enable signal by mixing the first enable signal and the first delayed enable signal.

Abstract: A method and an apparatus are provided. The apparatus is a hardware module that controls a power mode of a plurality of modules. The apparatus receives an indication of a desired operational frequency. Based on the received indication, the apparatus determines to switch from a first power mode associated with a first set of modules to a second power mode corresponding to the desired operational frequency and associated with a second set of modules. The apparatus enables modules in the second set of modules that are unassociated with the first power mode, stops traffic through the plurality of modules upon expiration of a time period after enabling the modules in the second set of modules that are unassociated with the first power mode, routes traffic through the second set of modules, and disables modules in the first set of modules that are unassociated with the second power mode.

Abstract: In a particular embodiment, a method includes modifying an output impedance associated with the input receiver. In response to modifying the output impedance, the method restricts an output voltage at an output node of the input receiver. Particular embodiments of an input receiver circuit are also disclosed.

Abstract: An image encoding device includes a first compression unit, a second compression unit, a third compression unit and an output unit. The first compression unit generates first compressed data by compressing first data associated with a reference block in an input image. The second compression unit generates second compressed data by compressing second data associated with a current compressing block in the input image when the current compressing block corresponds to a first pattern. The current compressing block is included in the reference block. The third compression unit generates third compressed data by compressing the second data when the current compressing block corresponds to one of a plurality of second patterns. The output unit outputs compressed data based on the first compressed data, the second compressed data and the third compressed data.

Abstract: A method of obtaining fiber structure information of a nerve fiber in an object by using an MRI system includes: obtaining image information of voxels of the object; setting a tracking start area including at least one voxel of the object; setting at least one voxel adjacent to the tracking start area as a tracking processing area; determining a similarity between image information of a voxel included in the set tracking processing area and a voxel included in the tracking start area; and obtaining the fiber structure information according to the determined similarity.

Abstract: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.

Abstract: An apparatus includes a terminal, a first plurality of driver lines, and a first phase mixer. The driver lines drive the terminal to a first logic state responsive to a first enable signal. The first phase mixer is coupled to a first one of the first plurality of driver lines. The first phase mixer is operable to receive the first enable signal and a first delayed enable signal derived from the first enable signal and generate a first signal on the first driver line having a first configurable delay with respect to the first enable signal by mixing the first enable signal and the first delayed enable signal.

Abstract: A light emitting device includes a conductive support member, a first conductive layer disposed on the conductive support member, a second conductive layer disposed on the first conductive layer, a light emitting structure including a first semiconductor layer, layer disposed on the second conductive layer, a second semiconductor layer, and an active layer disposed between the first semiconductor layer and the second semiconductor layer, and an insulation layer disposed between the first conductive layer and the second conductive layer. The first conductive layer includes a first expansion part penetrating through the second conductive layer, the second semiconductor layer and the active layer, and includes a second expansion part extending from the first expansion part and being disposed in the first semiconductor layer. The insulation layer is disposed on the lateral surface of the first expansion part, and the lateral surface of the second expansion part contacts with the first semiconductor layer.

Abstract: A light emitting device includes a conductive support member, a first conductive layer disposed on the conductive support member, a second conductive layer disposed on the first conductive layer, a light emitting structure including a first semiconductor layer, a second semiconductor layer, and an active layer disposed between the first semiconductor layer and the second semiconductor layer, and an insulation layer disposed between the first conductive layer and the second conductive layer. The first conductive layer includes a first expansion part penetrating through the second conductive layer, the second semiconductor layer and the active layer, and includes a second expansion part extending from the first expansion part and being disposed in the first semiconductor layer. The insulation layer is disposed on the lateral surface of the first expansion part, and wherein the lateral surface of the second expansion part contacts with the first semiconductor layer.

Abstract: A silicon based compound and an organic light-emitting diode including the same.

Abstract: An organometallic complex and an organic light-emitting device (OLED) including the same are described. In exemplary embodiments, the subject OLED devices may comprise an alkyl derivative of a tris(2-phenylpyridine)iridium complex paired with a carbazole-based host in an emission layer and emit green phosphorescent light.

Abstract: A light emitting device includes a conductive support member, a first conductive layer on the conductive support member, a second conductive layer, a first semiconductor layer on the second conductive layer, a second semiconductor layer and an active layer between the first semiconductor layer and the second conductive layer, and an insulation layer disposed between the first conductive layer and the second conductive layer. The first conductive layer includes a first expansion part penetrating the second conductive layer, the second semiconductor layer and the active layer, and a second expansion part extending from the first expansion part and disposed in the first semiconductor layer. The insulation layer is on a lateral surface of the first expansion part. At least a portion of a lateral surface of the second expansion part contacts the first semiconductor layer, and the insulation layer is between the first semiconductor layer and the second expansion part.

Abstract: A search system, a user device, and a server for AR service are disclosed. The search system includes a search engine configured to search a web content and a marker, in response to an input of a user, a matching unit configured to match the searched web content with the searched marker, and an output unit configured to transmit a document including the searched web content and the searched marker to the user.