Abstract: A variable resistive memory device includes a memory cell array and a control circuit block. The memory cell array includes a plurality of memory cells that are connected between a global word line and a global bit line. The control circuit block is positioned on at least one of edge portions of the memory cell array. The memory cell array is classified into a first group with the memory cells that are adjacent to the control circuit block and a second group with the memory cells that are remote in relation to the control circuit block. The second group is farther from the control circuit block than the first group. The control circuit block includes a write control unit that generates a control signal for writing on the memory cell in the first group in a different way compared to writing on the memory cell in the second group.

Abstract: A variable resistive memory device includes a memory cell array and a control circuit block. The memory cell array includes a plurality of memory cells that are connected between a global word line and a global bit line. The control circuit block is positioned on at least one of edge portions of the memory cell array. The memory cell array is classified into a first group with the memory cells that are adjacent to the control circuit block and a second group with the memory cells that are remote in relation to the control circuit block. The second group is farther from the control circuit block than the first group. The control circuit block includes a write control unit that generates a control signal for writing on the memory cell in the first group in a different way compared to writing on the memory cell in the second group.

Abstract: A semiconductor memory apparatus may be provided. The semiconductor memory apparatus may include a memory element. The semiconductor memory apparatus may include a first switching driving circuit coupled to the memory element. The semiconductor memory apparatus may include a second switching driving circuit coupled to the memory element.

Abstract: A semiconductor memory apparatus may be provided. The semiconductor memory apparatus may include a memory element. The semiconductor memory apparatus may include a first switching driving circuit coupled to the memory element. The semiconductor memory apparatus may include a second switching driving circuit coupled to the memory element.

Abstract: An electronic device includes semiconductor memory. The semiconductor memory includes a cell array comprising a plurality of resistive memory cells arranged in a plurality of columns and a plurality of rows; and an access circuit applying a first voltage or a second voltage to a first node of a selected memory cell of the plurality of resistive memory cells, and applying a third voltage to a second node of the selected memory cell, the third voltage having a magnitude that is substantially the same as that of the first voltage and having a polarity that is opposite to a polarity of the first voltage.

Abstract: A variable resistive memory device may include a memory region and controller. The memory region may include a plurality of unit memory cells each electrically connected between a word line and a bit line. The controller may perform a driving operation of the word line in response to a read command. The controller may perform a driving operation of a bit line to output cell data through the bit line substantially simultaneously with the driving operation of the word line. Each of the unit memory cell may include a variable resistive material.

Abstract: A variable resistive memory device may include a memory region and controller. The memory region may include a plurality of unit memory cells each electrically connected between a word line and a bit line. The controller may perform a driving operation of the word line in response to a read command. The controller may perform a driving operation of a bit line to output cell data through the bit line substantially simultaneously with the driving operation of the word line. Each of the unit memory cell may include a variable resistive material.

Abstract: A resistive memory apparatus includes a plurality of bit lines, a plurality of local bit lines, and a plurality of global bit lines. The plurality of bit lines is electrically coupled to a plurality of memory cells. The plurality of local bit lines are extended in a row direction, and electrically coupled to one or more of the plurality of bit lines. The plurality of global bit lines are extended in the column direction, and electrically coupled to one or more of the plurality of local bit lines.

Abstract: A resistive memory apparatus includes a plurality of bit lines, a plurality of local bit lines, and a plurality of global bit lines. The plurality of bit lines is electrically coupled to a plurality of memory cells. The plurality of local bit lines are extended in a row direction, and electrically coupled to one or more of the plurality of bit lines. The plurality of global bit lines are extended in the column direction, and electrically coupled to one or more of the plurality of local bit lines.

Abstract: A bit line sense amplifier control circuit is configured to drive a bit line sense amplifier according to a first sense amplifier enable signal and a second sense amplifier enable signal, wherein the driving force of the bit line sense amplifier is changed in response to a column selection control signal.

Abstract: A semiconductor memory device includes a memory bank configured to output stored data in response to a column selection signal, a plurality of data latching units configured to latch the data outputted from the memory bank in response to an input control signal which is generated according to the column selection signal, and output the latched data in response to an output control signal, a time measurement unit configured to measure a time from an activation of the input control signal to an activation of the output control signal and generate a delay control signal, and an activation control unit configured to control an activation time of the column selection signal in response to the delay control signal.

Abstract: A semiconductor memory device includes a plurality of memory cell mats each comprising a plurality of normal memory cell arrays; and a redundancy memory cell array configured to replace a defective memory cell with a plurality of redundancy memory cells corresponding to a redundancy word line when the redundancy word line corresponding to one or more redundancy memory cell arrays is activated in response to an address corresponding to the defective memory cell among the plurality of normal memory cell arrays.

Abstract: A sense amplifier is configured to transfer data on a first data I/O line to a second data I/O line or to transfer data on the second data I/O line to the first data I/O line. The first data I/O line is substantially continuously coupled to the second data I/O line during an active operation.

Abstract: A semiconductor apparatus includes a first capacitor formed in a normal cell area and including a lower electrode coupled to one end of a cell transistor, and a second capacitor formed in a dummy cell area and including a lower electrode coupled to a power terminal.

Abstract: Various embodiments of a semiconductor memory apparatus and a related driving method are disclosed. According to one exemplary embodiment, a semiconductor memory apparatus may include a switching unit and a switching control unit. The switching unit couples or decouples a cell plate voltage line to or from a cell plate electrode in response to a control signal. The switching control unit is configured to enable the control signal at a first timing and disable the control signal at a second timing.

Abstract: A semiconductor integrated circuit includes a cell block including a plurality of cell mats having a plurality of word lines and a plurality of bit lines perpendicular to the plurality of word lines, a cell plate electrode formed over a whole area of the cell block, and a plate power mesh line including a first plate power mesh line electrically connected to the cell plate electrode while extending in a direction parallel to the word lines, and a second plate power mesh line extending in a direction parallel to the bit lines. The first plate power mesh line includes at least one cutting part.

Abstract: A semiconductor memory device includes a plurality of memory cell mats each comprising a plurality of normal memory cell arrays; and a redundancy memory cell array configured to replace a defective memory cell with a plurality of redundancy memory cells corresponding to a redundancy word line when the redundancy word line corresponding to one or more redundancy memory cell arrays is activated in response to an address corresponding to the defective memory cell among the plurality of normal memory cell arrays.

Abstract: A semiconductor memory device includes a memory bank configured to output stored data in response to a column selection signal, a plurality of data latching units configured to latch the data outputted from the memory bank in response to an input control signal which is generated according to the column selection signal, and output the latched data in response to an output control signal, a time measurement unit configured to measure a time from an activation of the input control signal to an activation of the output control signal and generate a delay control signal, and an activation control unit configured to control an activation time of the column selection signal in response to the delay control signal.

Abstract: A sense amplifier is configured to transfer data on a first data I/O line to a second data I/O line or to transfer data on the second data I/O line to the first data I/O line. The first data I/O line is substantially continuously coupled to the second data I/O line during an active operation.

Abstract: A bit line sense amplifier control circuit is configured to drive a bit line sense amplifier according to a first sense amplifier enable signal and a second sense amplifier enable signal, wherein the driving force of the bit line sense amplifier is changed in response to a column selection control signal.